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Cited by 972

The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.

Laser ablation and micromachining with ultrashort laser pulses

Liu, X., Du, D., Mourou, G.·1997·IEEE Journal of Quantum Electronics

Abstract

The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required.

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Metadata

Authors
Liu, X., Du, D., & Mourou, G.
Venue
IEEE Journal of Quantum Electronics
Published
1997
Volume
33
Issue
10
Pages
1706-1716
ISSN
0018-9197 (ISSN-L)
OpenAlex
W2113295440
Cited by
972
References
2
FWCI
17.97
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Laser ablation and micromachining with ultrashort laser pulses. https://app.cochat.ai/papers/10.1109/3.631270
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Liu, X., Du, D., & Mourou, G. (1997). Laser ablation and micromachining with ultrashort laser pulses. IEEE Journal of Quantum Electronics. https://doi.org/10.1109/3.631270

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.