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Cited by 194Transportation Systems and InfrastructureInnovation Diffusion and ForecastingTechnology Assessment and Management

The DOI matches its Crossref record; 7 of the 7 references it cites were found in a registry or an index.

Electronic part life cycle concepts and obsolescence forecasting

Pecht, M.G., Sandborn, P.A., Solomon, R.·2000·IEEE Transactions on Components and Packaging Technologies
DOI 10.1109/6144.888857
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Abstract

Obsolescence of electronic parts is a major contributor to the life cycle cost of long-field life systems such as avionics. A methodology to forecast life cycles of electronic parts is presented, in which both years to obsolescence and life cycle stages are predicted. The methodology embeds both market and technology factors based on the dynamic assessment of sales data. The predictions enabled from the models developed in this paper allow engineers to effectively manage the introduction and on-going use of long field-life products based on the projected life cycle of the parts incorporated into the products. Application of the methodology to integrated circuits is discussed and obsolescence predictions for dynamic random access memories (DRAMs) are demonstrated. The goal is to significantly reduce design iterations, inventory expenses, sustainment costs, and overall life cycle product costs.

Overview

Integrity signals

Registry

Crossref · 10.1109/6144.888857

Cites

7 of 7 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

This paper’s full text isn’t openly available, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • The premature aging process through calculating and planning when various circuit-breakers in the product shall fail reliably renders the product useless or less useful after a certain predetermined date, even if often only one aspect or component truly breaks.

    “The premature aging process through calculating and planning when various circuit-breakers in the product shall fail, reliably renders the product useless or less useful after a certain predetermined date, even if often only one aspect or component of the product truly breaks (Solomon et al., 2000).”

    From Designed to break: planned obsolescence as corporate environmental crime (2022) · cites this paper as Solomon et al., 2000

  • For many products, the availability of parts is limited in time or so expensive that repairs are not cost-effective.

    “For many products, the availability of parts is limited in time or so expensive that repairs are not cost-effective (Solomon et al., 2000).”

    From Designed to break: planned obsolescence as corporate environmental crime (2022) · cites this paper as Solomon et al., 2000

Citations

Cites

Flagged first, then by citations

Research works printed but not linked: 5

  1. texas instruments, 1999, 1999 Standard linear and logic product withdrawal device list
  2. national semiconductor, 2000, Product Folder LF11331
  3. sherwood, 2000, Product life cycle (PLC) code definitions and applications
  4. 1997, Product Life Cycle Data Model
  5. bumbalough, 1999, usaf manufacturing technology's initiative on electronics parts obsolescence management, Proc 44th Int SAMPE Symp, 2044

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Related

Metadata

Authors
Pecht, M. G., Sandborn, P. A., & Solomon, R.
Affiliations
University of Maryland, College Park (US)
ORCID
Venue
IEEE Transactions on Components and Packaging Technologies
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published
2000
Volume
23
Issue
4
Pages
707-717
ISSN
1521-3331 (ISSN-L)
DOI
10.1109/6144.888857
OpenAlex
W2119785455
Cited by
194
References
7
Citations by year
2026: 6 · 2025: 7 · 2024: 4 · 2023: 2 · 2022: 10 · 2021: 19 · 2020: 5 · 2019: 14 · 2018: 9 · 2017: 9 · 2016: 10 · 2015: 9 · 2014: 11 · 2013: 8 · 2012: 16
FWCI
6.83
Type
journal article
Language
en
Open access
closed
Licence
ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html (vor)
Locations
IEEE Transactions on Components and Packaging Technologies (publishedVersion)
Topics
  • Social Sciences › Business, Management and Accounting › Management of Technology and Innovation › Transportation Systems and Infrastructure
  • Social Sciences › Decision Sciences › Management Science and Operations Research › Innovation Diffusion and Forecasting
  • Social Sciences › Business, Management and Accounting › Management of Technology and Innovation › Technology Assessment and Management
Keywords
life cycle cost, avionics, integrated circuits, dynamic random access memory, DRAM, sales analysis, technology forecasting, inventory management

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