The DOI matches its Crossref record; 16 of the 16 references it cites were found in a registry or an index.
DC link bus design for high frequency, high temperature converters
Abstract
Advancements in IGBT device performance and reliability have been important for widespread electric vehicle (EV) and hybrid electric vehicle (HEV) adoption. However, further improvements in device performance are now limited by silicon's (Si) inherent material characteristics. New improvements are being realized in converter efficiency and power density with wide bandgap materials, such as silicon-carbide (SiC) and gallium nitride (GaN), which permit faster switching frequencies and higher temperature operation. On the horizon are ultra-wide bandgap materials such as aluminum nitride (AlN) and aluminum gallium nitride (AlGaN) which hold the potential to push the envelope further. As device operating temperatures and switching frequencies increase, however, the balance of the power conversion system becomes more important: DC bus design, filter components and thermal management. This paper considers a typical 6-puIse inverter application common in EV and HEV power systems and provides an alternative, cost-effective solution to the design of a low-impedance DC bus. In contrast to systems that use bus bars with film or electrolytic dc link capacitors, the proposed high-frequency (HF) bus design reduces parasitic resistance and inductance, tolerates higher temperature and is potentially scalable to MHz frequencies. A prototype was built and compared in simulation to the DC bus design documented for the 2010 Toyota Prius.
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When the hot-engine liquid-cooling system is utilized for the power electronics, the typical high temperature of cooling liquid is 90 °C-125 °C.
“This becomes further challenging when the hot-engine liquid-cooling system is utilized for the power electronics, with a typical high temperature of cooling liquid in 90 ◦ C-125 ◦ C [57].”
From Reliability of Power Electronic Systems for EV/HEV Applications (2021) · cites this paper as [57]
Citations
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Reliability of Power Electronic Systems for EV/HEV Applications
Blaabjerg, F., Wang, H., Vernica, I., Liu, B., & Davari, P. (2021) · Proceedings of the IEEE · doi:10.1109/jproc.2020.3031041 · Cited by 249
“Third, at the application level, design strategies for low-inductive dc-link capacitor bank design are developed for the trend of using an increasing switching frequency [75].”
Method
Metadata
- Authors
- Stewart, J., Neely, J., Delhotal, J., & Flicker, J.
- Affiliations
- Sandia National Laboratories (US)
- Venue
- 2017 IEEE Applied Power Electronics Conference and Exposition (APEC)
- Publisher
- IEEE
- Published
- 2017-03
- Pages
- 809-815
- ISSN
- 1048-2334 (ISSN-L)
- OpenAlex
- W2616834910
- Cited by
- 25
- References
- 16
- Citations by year
- 2026: 1 · 2025: 3 · 2024: 1 · 2023: 6 · 2022: 3 · 2021: 1 · 2020: 5 · 2019: 2 · 2018: 3
- FWCI
- 3.87
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition (publishedVersion)
- Funders
- U.S. Department of Energy
- National Nuclear Security Administration
- Sandia National Laboratories
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electromagnetic Compatibility and Noise Suppression
- Keywords
- high-frequency converters, high-temperature operation, wide bandgap semiconductors, silicon carbide, gallium nitride, aluminum nitride, aluminum gallium nitride, electric vehicle power systems, hybrid electric vehicles, thermal management, busbars, electrolytic capacitors, power density
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