The DOI matches its Crossref record; 7 of the 7 references it cites were found in a registry or an index.
Reliability assessment of SiC power module stack based on thermo-structural analysis
Abstract
Power semiconductor modules for power electronics converters are required to withstand significant temperature cycles in operation. Due to the availability of novel wide-bandgap semiconductors such as SiC, operation temperatures and corresponding temperature cycles of the power modules are intended to be increased. This can lead to severe lifetime limitation by fatigue failure mechanism induced by the CTE (coefficient of thermal expansion) mismatch of the material layers in the module. In this study a 3D finite element model (FEM) of an advanced power module concept was developed. The main material stack consists of a ceramic substrate, an Ag sintered SiC MOSFET and a sintered top plate that serves as a bond buffer to allow for Cu wire bonding. Stress simulations are performed for several thermal load cycles starting with an analysis of the initia bonding process during manufacture, and following a temperature cycling mission profile during operation. Plastic strain energy densities in the critical regions of the bond interfaces are computed and its development upon consecutives cycles are followed-up in the time domain. Based on these investigations, it is possible to propose design improvements that are effective in reducing thermo-mechanical stresses, and to increase fatigue life.
Overview
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
SiC has lower CTE compared to Al surface (4.3 ppm/°C vs. 22 ppm/°C), which translates to plastic deformation at high junction temperatures.
“Also, SiC has lower CTE compared to Al surface (4.3 ppm/ ◦ C vs. 22 ppm/ ◦ C) which translates to plastic deformation at high junction temperatures [47], [48].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [48]
Citations
Cites
Plasticity: Theory and Application
Mendelson, A. (1968) · International Linear Collider · Cited by 941
Yeo, A., Lee, C., & Pang, J. H. L. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2006.875893 · Cited by 60
Durand, C., Klingler, M., Coutellier, D., et al. (2013) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/eurosime.2013.6529900 · Cited by 15
Novel Large-Area Attachment for High-Temperature Power Electronics Module Application
Liu, C., Mohn, F., Schuderer, J., et al. (2017) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2017.143 · Cited by 11
Self-citationHow materials behaviour affects power electronics reliability
Poech, M. (2010) · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · Cited by 5
Reliable Interconnection Technologies for High-Temperature Operation of SiC MOSFETs
Mohn, F., Liu, C., & Schuderer, J. (2017) · Cited by 5
Self-citationLi, G., & Gurrum, S. P. (2015) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2015.7159857 · Cited by 4
Flagged first, then by citations
Cited by
Sorted by citations
Overview of Real-Time Lifetime Prediction and Extension for SiC Power Converters
Ni, Z., Lyu, X., Yadav, O. P., Singh, B. N., Zheng, S., & Cao, D. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2962503 · Cited by 261
AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24
Metadata
- Authors
- Sokolov, A., Liu, C., & Mohn, F.
- Affiliations
- ABB (Switzerland) (CH)
- Venue
- 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Publisher
- IEEE
- Published
- 2018-04
- Pages
- 1-4
- OpenAlex
- W2806440147
- Cited by
- 11
- References
- 7
- Citations by year
- 2025: 1 · 2024: 1 · 2023: 2 · 2022: 1 · 2021: 2 · 2019: 3 · 2018: 1
- FWCI
- 2.39
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electrical and Thermal Properties of Materials
- Keywords
- SiC power modules, reliability analysis, thermomechanical fatigue, thermal expansion mismatch, ceramic substrates, bond interface, plastic strain energy density, thermal cycling, fatigue life, wide bandgap semiconductors, power converters
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
