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High Breakdown Voltage AlGaN–GaN HEMTs Achieved by Multiple Field Plates

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Xing, H., Dora, Y., Chini, A., Heikman, S., Keller, S., Mishra, U.K.·2004·IEEE Electron Device Letters

Abstract

High-voltage Al/sub 0.22/Ga/sub 0.78/N-GaN high-electron mobility transistors have been fabricated using multiple field plates over dielectric passivation layers. The device breakdown voltage was found to increase with the addition of the field plates. With two field plates, the device showed a breakdown voltage as high as 900 V. This technique is easy to apply, based on the standard planar transistor fabrication, and especially attractive for the power switching applications.

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Metadata

Authors
Xing, H., Dora, Y., Chini, A., Heikman, S., Keller, S., & Mishra, U. K.
Venue
IEEE Electron Device Letters
Published
2004-04
Volume
25
Issue
4
Pages
161-163
ISSN
0741-3106 (ISSN-L)
OpenAlex
W2152320292
Cited by
360
References
0
FWCI
9.95
Type
journal article
Language
en
Open access
green

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CoChat. (2026). Citation check: High Breakdown Voltage AlGaN–GaN HEMTs Achieved by Multiple Field Plates. https://app.cochat.ai/papers/10.1109/led.2004.824845
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Xing, H., Dora, Y., Chini, A., Heikman, S., Keller, S., & Mishra, U. K. (2004). High Breakdown Voltage AlGaN–GaN HEMTs Achieved by Multiple Field Plates. IEEE Electron Device Letters. https://doi.org/10.1109/led.2004.824845

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Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.