Cited by 54Neuroscience and Neural EngineeringWireless Body Area NetworksAnalog and Mixed-Signal Circuit Design

An Implantable Wireless Network of Distributed Microscale Sensors for Neural Applications

Lee, Jihun, Lee, Florence, Huang, Jiannan, Cui, Lingxiao, Lee, Ah-Hyoung, Leung, Vincent, Mercier, Patrick, Shellhammer, Steven +6 more·2019·2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)

Abstract

A vastly enhanced capability to bi-directionally interface with cortical microcircuits in a clinically viable way is the ultimate aspiration in neuroengineering. This necessitates a paradigm shift in neural interface system design beyond current bulky, monolithic constructs which are challenging to scale past 100-200 channels due to anatomic and engineering design constraints. A neural interface system relying on a spatially-distributed network of wireless microscale implantable sensors offers a highly scalable, robust and adaptive architecture for next-generation neural interfaces. We describe the development of a wireless network of sub-mm, untethered, individually addressable, fully wireless "Neurograin" sensors, in the context of an epicortical implant. Individual neurograin chiplets integrate a ~ 1 GHz wireless link for energy harvesting and telemetry with analog and digital electronics for neural signal amplification, on-chip storage, and networked communications via a TDMA protocol. Each neurograin thus forms a completely self-contained single channel of neural access and is implantable after post-process atomic layer deposition of thin-film (100 nm thick) barriers for hermetic sealing. Finally, ensembles of implantable neurograins form a fully wireless cortico-computer communication network (utilizing their unique device IDs). The implanted network is coordinated by a compact external "Epidermal Skinpatch" RF transceiver and data processing hub, which is implemented as a wearable module in order to be compatible with clinical implant considerations. We describe neurograin performance specifications and proof-of-concept in bench top and ex vivo and in vivo rodent platforms.

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Crossref · 10.1109/ner.2019.8717023

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9 of 9 references verified0 citation errors · 0 not checkable

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Authors
Lee, J., Lee, F., Huang, J., Cui, L., Lee, A.-H., Leung, V., Mercier, P., Shellhammer, S., Larson, L., Asbeck, P., Rao, R., Song, Y.-K., Nurmikko, A., & Laiwalla, F.
Affiliations
  • Brown University
  • Brown University (US)
  • University of California San Diego (US)
  • Seoul National University (KR)
  • Qualcomm (United States) (US)
Venue
2019 9th International IEEE/EMBS Conference on Neural Engineering (NER)
Publisher
IEEE
Published
2019-03
Pages
871-874
ISSN
1948-3554 (ISSN-L)
OpenAlex
W2946609658
Cited by
54
References
9
Citations by year
2025: 2 · 2024: 8 · 2023: 12 · 2022: 9 · 2021: 11 · 2020: 6 · 2019: 6
FWCI
32.22
Type
conference paper
Language
en
Open access
closed
Locations
International IEEE/EMBS Conference on Neural Engineering (publishedVersion)
Topics
  • Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
  • Physical Sciences › Engineering › Biomedical Engineering › Wireless Body Area Networks
  • Physical Sciences › Engineering › Biomedical Engineering › Analog and Mixed-Signal Circuit Design
Keywords
neural interfaces, sensor networks, cortical microcircuits, energy harvesting, hermetic sealing, atomic layer deposition, RF transceiver

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