Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints
Abstract
The need for flexible interconnects in advanced applications in consumer electronic products is increasing rapidly. The reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects formed using anisotropic conductive adhesive (ACA) are thus investigated. Two films of ACA materials, namely ACA-P and ACA-F, are assembled at different bonding temperatures to study the effect of temperature on the adhesion at the substrate-adhesive and adhesive-chip interfaces using differential scanning calorimetry (DSC) and a 90° peeling test. The contact resistance of a daisy chain with 188 input/output (I/O) is measured to examine the quality of bonding through dummy test samples with an 80-μm pitch. The reliability of the fabricated UTCOF interconnects bonded via selected ACA joints is evaluated by performing an 85°C/85% RH thermal humidity storage test (THST) for 1000 h, and their flexibility is evaluated in static bending and four-point bending tests. The interfaces between the ultra-thin silicon chip and the substrate of failed samples in the THST and four-point bending testing are then investigated by scanning electron microscopy (SEM), which is utilized to obtain cross-sectional images. Finite element analysis is also conducted to elucidate the failure mechanism of the UTCOF interconnects in the four-point bending test. The averaged maximum allowable deflections of the fabricated UTCOF interconnects with ACA-P and ACA-F materials are 26% and 168%, respectively, higher than those of the COF interconnects with a chip thickness of 670 μm. Moreover, the contact resistance remains stable, varying by less than 10%, in the static bending test with a bending radius of 30 mm. According to the results thus obtained, give the appropriate choice of an ACA material and the optimal curing conditions, the UTCOF interconnects with ACA joints reliably serve as flexible interconnects for use in consumer electronic products.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
Polymeric adhesives can eliminate the need for underfill in flip-chip bonding on flexible substrates.
“Polymeric adhesives are also very popular for flip-chip bonding on flexible substrates (Lai and Liu 1999; Chen et al. 2000; Lu and Chen 2010; Chiang et al. 2006; Chuang et al. 2010) as they can eliminate the need for underfill.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Lu and Chen 2010
In flip-chip bonding with polymeric adhesives, the adhesive acts as the interconnection medium between the bumped chip and the substrate.
“The adhesive acts as the interconnection medium between the bumped chip and the substrate, while it at the same time protects the contacts and provides mechanical support.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Lu and Chen 2010
Polymeric adhesives are very popular for flip-chip bonding on flexible substrates.
“Polymeric adhesives are also very popular for flip-chip bonding on flexible substrates (Lai and Liu 1999; Chen et al. 2000; Lu and Chen 2010; Chiang et al. 2006; Chuang et al. 2010) as they can eliminate the need for underfill.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Lu and Chen 2010
In flip-chip bonding with polymeric adhesives, the adhesive protects the contacts and provides mechanical support.
“The adhesive acts as the interconnection medium between the bumped chip and the substrate, while it at the same time protects the contacts and provides mechanical support.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Lu and Chen 2010
Cites
Chan, Y. C., & Luk, D. Y. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00079-3 · Cited by 117 · see citing works
Uddin, M. A., Alam, M. O., Chan, Y. C., & Chan, H. P. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00185-9 · Cited by 101 · see citing works
Failure mechanism study of anisotropic conductive film (ACF) packages
Mercado, L. L., White, J., Sarihan, V., & Lee, T. T. (2003) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2003.817640 · Cited by 82 · see citing works
Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength
Takyu, S., Kurosawa, T., Shimizu, N., & Harada, S. (2006) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2006.1645874 · Cited by 57 · see citing works
Flow characterization and thermo-mechanical response of anisotropic conductive films
Dudek, R., Meinel, S., Schubert, A., Michel, B., Dorfmüller, L., Knoll, P., & Baumbach, J. (1999) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/6144.774727 · Cited by 47 · see citing works
Ultra-thin electronic device package
Chen, K. Y., Zenner, R. L. D., Ameson, M., & Mountain, D. (2000) · IEEE Transactions on Advanced Packaging · doi:10.1109/6040.826758 · Cited by 45 · see citing works
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization
Zhang, J. H., Chan, Y. C., Alam, M. O., & Fu, S. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00165-3 · Cited by 40 · see citing works
A study on chip thinning process for ultra thin memory devices
Takyu, S., Sagara, J., & 黒澤, 哲. (2008) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2008.4550176 · Cited by 37 · see citing works
Wu, Y., Alam, M. O., Chan, Y. C., & Wu, B. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00214-2 · Cited by 37 · see citing works
Thermal stability performance of anisotropic conductive film at different bonding temperatures
Tan, S. C., Chan, Y. C., Chiu, Y. W., & Tan, C. W. (2003) · Microelectronics Reliability · doi:10.1016/s0026-2714(03)00239-7 · Cited by 32 · see citing works
The evaluation of wafer thinning and singulating processes to enhance chip strength
Chen, S., Kuo, T.-Y., Hu, H.-T., Lin, J.-R., & Yu, S.-P. (2005) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2005.1441990 · Cited by 31 · see citing works
A Study of Process-Induced Deformations of Anisotropic Conductive Film (ACF) Assembly
Cheng, H., Ho, C.-L., Chen, W., & Yang, S.-S. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2006.880507 · Cited by 29 · see citing works
Self-citationEffects of bonding pressure on the thermo-mechanical reliability of ACF interconnection
Kim, J., Moon, W.-C., & Jung, S. (2006) · Microelectronic Engineering · doi:10.1016/j.mee.2006.10.029 · Cited by 27 · see citing works
Study of anisotropic conductive adhesive joint behavior under 3-point bending
Rizvi, M. J., Chan, Y. C., Bailey, C., & Lu, H. (2004) · Microelectronics Reliability · doi:10.1016/j.microrel.2004.10.015 · Cited by 25 · see citing works
Anisotropic conductive film flip chip joining using thin chips
Jokinen, E., & Ristolainen, E. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00100-2 · Cited by 22 · see citing works
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
Cao, L., Lai, Z., & Liu, J. (2005) · Journal of Electronic Packaging · doi:10.1115/1.1846066 · Cited by 20 · see citing works
Innovative packaging concepts for ultra thin integrated circuits
Klink, G., Feil, M., Ansorge, F., Aschenbrenner, R., & Reichl, H. (2001) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2001.927940 · Cited by 20 · see citing works
Sakurai, R., Hattori, R., Asakawa, M., Nakashima, T., Tanuma, I., Yokoo, A., Nihei, N., & Masuda, Y. (2007) · SID Symposium Digest of Technical Papers · doi:10.1889/1.2785591 · Cited by 17 · see citing works
Lau, D., Chan, Y. S., Lee, S. W. R., Fu, L., Ye, Y., & Liu, S. (2006) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept.2006.359865 · Cited by 16 · see citing works
Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength
Takyu, S., 黒澤, 哲., Shimizu, N., & Harada, S. (2006) · MRS Proceedings · doi:10.1557/proc-0970-y06-05 · Cited by 15 · see citing works
Tan, S. C., Chan, Y. C., & Lui, N. S. M. (2006) · IEEE Transactions on Advanced Packaging · doi:10.1109/tadvp.2006.875071 · Cited by 13 · see citing works
Investigations of strength properties of ultra-thin silicon
Schönfelder, S., Bagdahn, J., Ebert, M. P. A., Petzold, M., Bock, K., & Landesberger, C. (2005) · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · doi:10.1109/esime.2005.1502783 · Cited by 11 · see citing works
Development and Characterization of Rigid-Flex Interface
Lu, S., Lo, W., Chen, T., Chen, Y., Chang, S., Huang, Y., Lee, Y., Kuo, T.-Y., & Shih, Y.-C. (2006) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2006.1645909 · Cited by 10 · see citing works
Self-citationReliability modelling for packages in flexible end-products
van Driel, W. D., van der Sluis, O., Yang, D., Ubachs, R. L. J. M., Zenz, C., Aflenzer, G., & Zhang, G. Q. (2006) · Microelectronics Reliability · doi:10.1016/j.microrel.2006.07.085 · Cited by 7 · see citing works
40¿m Die Strength Characterization
Heng, L. T., Fei, C. C., & Subaramaniym, S. (2008) · IEEE Electronics Packaging Technology Conference (EPTC) · doi:10.1109/eptc.2008.4763456 · Cited by 6 · see citing works
Flagged first, then by citations
Cited by
Sorted by citations
Review on Physically Flexible Nonvolatile Memory for Internet of Everything Electronics
Ghoneim, M. T., & Hussain, M. (2015) · Electronics · doi:10.3390/electronics4030424 · Cited by 129 · see citing works
Giagka, V., & Serdijn, W. A. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0010-y · Cited by 58 · see citing works
Back, J., Baek, D., Sim, K.-B., Oh, G.-Y., Jang, S.-W., Kim, H., & Kim, Y.-D. (2019) · Industrial & Engineering Chemistry Research · doi:10.1021/acs.iecr.8b05208 · Cited by 46 · see citing works
Huang, Y., Yin, Z., & Wan, X. (2019) · Springer eBooks · doi:10.1007/978-981-13-3627-0_1 · Cited by 35 · see citing works
Nonlinear characteristics in fracture strength test of ultrathin silicon die
Liu, Z., Huang, Y., Xiao, L. J., Tang, P., & Yin, Z. (2015) · Semiconductor Science and Technology · doi:10.1088/0268-1242/30/4/045005 · Cited by 29 · see citing works
A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics
Davila‐Frias, A., Yadav, O. P., & Marinov, V. R. (2020) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2020.3029250 · Cited by 26 · see citing works
Happonen, T., Voutilainen, J.-V., & Fabritius, T. (2014) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2014.2356477 · Cited by 23 · see citing works
Choi, J.-Y., & Oh, T. S. (2015) · MATERIALS TRANSACTIONS · doi:10.2320/matertrans.m2015106 · Cited by 22 · see citing works
Tang, Y., Luo, S., Li, G. Y., Yang, Z., Chen, R., Han, Y., & Hou, C. (2018) · Microelectronics Journal · doi:10.1016/j.mejo.2018.01.011 · Cited by 20 · see citing works
A Hybrid Low Power Biopatch for Body Surface Potential Measurement
Yang, G., Chen, J., Xie, L., Mao, J., Tenhunen, H., & Zheng, L. (2013) · IEEE Journal of Biomedical and Health Informatics · doi:10.1109/jbhi.2013.2252017 · Cited by 17 · see citing works
Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test
Chen, R., Chow, J. H., Taylor, C., Meth, J. S., & Sitaraman, S. K. (2020) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2020.2985649 · Cited by 16 · see citing works
Lu, S., & Chen, W. (2010) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2010.2080273 · Cited by 13 · see citing works
Self-citationContact Resistance of Flip-Chip Joints in Wearable Electronic Textiles
Choi, J.-Y., & Oh, T. S. (2014) · Journal of Electronic Materials · doi:10.1007/s11664-014-3431-8 · Cited by 12 · see citing works
Lu, S., Lin, Y.-M., Chuang, C.-C., Chen, T., & Chen, W. (2010) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2010.2101431 · Cited by 11 · see citing works
Self-citationLu, S., Chu, H.-M., & Chen, W. (2012) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2012.2210554 · Cited by 10 · see citing works
Self-citationLu, S., Lin, Y.-M., Chuang, C.-C., Chen, T., & Chen, W. (2009) · IEEE Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2009.5074218 · Cited by 9 · see citing works
Self-citationLarsson, A. J., Oldervoll, F., Seip, T. A. T., Nguyen, H. V., Kristiansen, H., & Sløgedal, Ø. (2011) · BIBSYS Brage (BIBSYS (Norway)) · Cited by 9 · see citing works
Chen, J., Xu, Z., Huang, Y., Duan, Y., & Yin, Z. (2016) · Science China Technological Sciences · doi:10.1007/s11431-016-0588-6 · Cited by 7 · see citing works
Manufacture and Characterization of Ultrathin Flexible Chips
Zheng, K., Cai, S., Chen, Y., Ma, Y., & Feng, X. (2021) · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · doi:10.1109/edtm50988.2021.9420950 · Cited by 5 · see citing works
Ultra-thin chip on flex by Solder-on-Pad (SoP) technology
Zhangqi, H., Wang, Q., Guo, H., Chen, Y., Cui, C. Q., Wang, J., Wang, F., & Cai, J. (2015) · International Conference on Electronic Packaging Technology (ICEPT) · doi:10.1109/icept.2015.7236669 · Cited by 4 · see citing works
Yang, G. (2012) · KTH Publication Database DiVA (KTH Royal Institute of Technology) · Cited by 3 · see citing works
Chen, X. C., Tao, B., & Yin, Z. (2012) · Journal of Electronic Packaging · doi:10.1115/1.4006889 · Cited by 2 · see citing works
Jesudoss, P., Mathewson, A., Wright, W. M. D., & Stam, F. (2012) · Microelectronics Reliability · doi:10.1016/j.microrel.2012.09.014 · Cited by 2 · see citing works
Vacuum-Based Picking-up and Placing-on
Huang, Y., Yin, Z., & Wan, X. (2019) · Springer eBooks · doi:10.1007/978-981-13-3627-0_9 · Cited by 2 · see citing works
Lin, Y.-M., Lu, S., Kao, H., & Chen, M. T. (2010) · International Microsystems, Packaging, Assembly and Circuits Technology Conference · doi:10.1109/impact.2010.5699624 · Cited by 1 · see citing works
Self-citationIntroduction to Hybrid System-in-Foil
Elsobky, M. (2022) · Springer theses · doi:10.1007/978-3-030-97726-9_2 · Cited by 1 · see citing works
Elsobky, M., & Burghartz, J. N. (2021) · Wiley eBooks · doi:10.1002/9781119869610.ch10 · Cited by 1 · see citing works
Electrical performance of micro-assembled beads under different temperatures and loadings
Tzeng, Y.-L., & Wang, K. (2012) · IEEE International Conference on Nano/Micro Engineered and Molecular Systems · doi:10.1109/nems.2012.6196811
Iannacci, J. (2013) · Wiley eBooks · doi:10.1002/9783527680856.biblio
Heterogeneous Integration of Silicon and Printed Electronics
Zheng, L., Tenhunen, H., & Zou, Z. (2018) · Wiley eBooks · doi:10.1002/9783527691685.ch7
Wearable Healthcare Device: Bio‐Patch
Zheng, L., Tenhunen, H., & Zou, Z. (2018) · Wiley eBooks · doi:10.1002/9783527691685.ch9
- Authors
- Lu, S.-T., & Chen, W.-H.
- Affiliations
- National Tsing Hua University (TW)
- Venue
- IEEE Transactions on Advanced Packaging
- Published
- 2010-08
- Volume
- 33
- Issue
- 3
- Pages
- 702-712
- ISSN
- 1521-3323 (ISSN-L)
- 1557-9980
- OpenAlex
- W2118805732
- Cited by
- 31
- References
- 25
- Citations by year
- 2022: 1 · 2021: 2 · 2020: 2 · 2019: 3 · 2018: 4 · 2016: 1 · 2015: 4 · 2014: 2 · 2013: 2 · 2012: 5
- FWCI
- 2.77
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Advanced Packaging (publishedVersion)
- Funders
- Georgia Institute of Technology
- Industrial Technology Research Institute
- National Tsing Hua University
- National Taiwan University
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electrical and Thermal Properties of Materials
- Keywords
- anisotropic conductive adhesive, flexible interconnects, interconnect reliability, bonding temperature, adhesion, contact resistance, bending flexibility, failure mechanisms, finite element analysis
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
