Ultra-thin electronic device package
Abstract
We report in this article a feasibility study of ultra-thin device packages. These packages combine thin integrated circuit chips, thin flex circuitry, and adhesive flip-chip technologies. Using this novel packaging concept, we constructed 512 kb SRAM memory modules that were less than 150 micron thick. Even more profound, the package was flexible enough to conform to nonplanar surfaces. This unique property can lead to new applications that would not be feasible otherwise and extend the reach of electronics into brand new areas. Two of these ultra-thin modules were stacked to construct a 3D package with 1 Mbyte of memory capacity that is approximately 30 times thinner and 30 times lighter than a conventionally packaged device.
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Polymeric adhesives can eliminate the need for underfill in flip-chip bonding on flexible substrates.
“Polymeric adhesives are also very popular for flip-chip bonding on flexible substrates (Lai and Liu 1999; Chen et al. 2000; Lu and Chen 2010; Chiang et al. 2006; Chuang et al. 2010) as they can eliminate the need for underfill.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Chen et al. 2000
In flip-chip bonding with polymeric adhesives, the adhesive acts as the interconnection medium between the bumped chip and the substrate.
“The adhesive acts as the interconnection medium between the bumped chip and the substrate, while it at the same time protects the contacts and provides mechanical support.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Chen et al. 2000
Polymeric adhesives are very popular for flip-chip bonding on flexible substrates.
“Polymeric adhesives are also very popular for flip-chip bonding on flexible substrates (Lai and Liu 1999; Chen et al. 2000; Lu and Chen 2010; Chiang et al. 2006; Chuang et al. 2010) as they can eliminate the need for underfill.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Chen et al. 2000
In flip-chip bonding with polymeric adhesives, the adhesive protects the contacts and provides mechanical support.
“The adhesive acts as the interconnection medium between the bumped chip and the substrate, while it at the same time protects the contacts and provides mechanical support.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Chen et al. 2000
Cites
Chip Scale Package Assembly Reliability
Ghaffarian, R. (2001) · Springer eBooks · doi:10.1007/978-1-4615-1389-6_23 · Cited by 25 · see citing works
Conductive adhesive flip-chip bonding for bumped and unbumped die
Connell, G., Zenner, R. L. D., & Gerber, J. A. K. (2002) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.1997.606181 · Cited by 16 · see citing works
Self-citationInvestigations into the use of Adhesives For Level-1 Microelectronic Interconnections
Hogerton, P. B., Hall, J. B., Pujol, J. M., et al. (1989) · MRS Proceedings · doi:10.1557/proc-154-415 · Cited by 15 · see citing works
a Comparative Analysis of High Density Pwb Technologies
Aday, J. G., Tessier, T., Crews, H., et al. (1996) · SPIE eBooks · Cited by 12 · see citing works
Selecting Flip Chip on Board Compatible High Density PWB Technologies
Tessier, T. G., Aday, J. G., & Crews, H. (1995) · Multichip Modules · Cited by 11 · see citing works
Adhesive and conductive adhesive flip chip bonding
Zenner, R. L. D., Connell, G., & Gerber, J. A. K. (2002) · International Symposium on Advanced Packaging Materials · doi:10.1109/isapm.1997.581272 · Cited by 5 · see citing works
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Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
Banda, C., Johnson, R. W., Zhang, T., Hou, Z., & Charles, H. K. (2008) · IEEE Transactions on Electronics Packaging Manufacturing · doi:10.1109/tepm.2007.914217 · Cited by 63 · see citing works
Giagka, V., & Serdijn, W. A. (2018) · Bioelectronic Medicine · doi:10.1186/s42234-018-0010-y · Cited by 58 · see citing works
Membrane-based thermal flow sensors on flexible substrates
Sturm, H., & Lang, W. (2013) · Sensors and Actuators A: Physical · doi:10.1016/j.sna.2013.03.004 · Cited by 37 · see citing works
Lu, S.-T., & Chen, W.-H. (2010) · IEEE Transactions on Advanced Packaging · doi:10.1109/tadvp.2010.2052806 · Cited by 31 · see citing works
- Authors
- Chen, K. Y., Zenner, R. L. D., Ameson, M., & Mountain, D.
- Affiliations
- 3M (United States) (US)
- ORCID
- Mountain, D.
- Venue
- IEEE Transactions on Advanced Packaging
- Published
- 2000
- Volume
- 23
- Issue
- 1
- Pages
- 22-26
- ISSN
- 1521-3323 (ISSN-L)
- OpenAlex
- W2154320899
- Cited by
- 45
- References
- 6
- Citations by year
- 2022: 1 · 2021: 1 · 2020: 1 · 2019: 1 · 2018: 2 · 2017: 2 · 2016: 1 · 2015: 2 · 2014: 3 · 2013: 3 · 2012: 4
- FWCI
- 3.89
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Advanced Packaging (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Keywords
- flip-chip packaging, 3D packaging, non-planar surfaces
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