Flexible Electronics: Thin Silicon Die on Flexible Substrates
Abstract
Silicon thinned to 50$\mu{\hbox {m}}$and less is flexible allowing the fabrication of flexible and conformable electronics. Two techniques have been developed to achieve this goal using thinned die: die flip chip bonded onto flexible substrates [polyimide and liquid crystal polymer (LCP)] and die flip chip laminated onto LCP films. A key to achieving each of these techniques is the thinning of die to a thickness of 50$\mu{\hbox {m}}$or thinner. Conventional grinding and polishing can be used to thin to 50$\mu{\hbox {m}}$. At 50$\mu{\hbox {m}}$, the active die becomes flexible and must be handled by temporarily bonding it to a holder die for assembly. Both reflow solder and thermocompression assembly methods are used. In the case of solder assembly, underfill is used to reinforce the solder joints. With thermocompression bonding of the die to an LCP substrate, the LCP adheres to the die surface, eliminating the need for underfill.
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Flip-chip bonding has been extensively used on flexible substrates in several variations, including reflow soldering and thermocompression processes for thin dice (50 μm).
“Flip-chip bonding has been extensively used on flexible substrates in several variations, including reflow soldering and thermocompression processes for thin dice (50 μm) (Banda et al. 2008; Zhang et al. 2009), but dispensing the underfill without allowing the material to flow on top of the very thin die is challenging.”
From Realizing flexible bioelectronic medicines for accessing the peripheral nerves – technology considerations (2018) · cites this paper as Zhang et al. 2009
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- Authors
- Zhang, T., Hou, Z., Johnson, R. W., Del Castillo, L., Moussessian, A., Greenwell, R., & Blalock, B. J.
- Affiliations
- GE Global Research (United States) (US)
- Seagate (United States) (US)
- Jet Propulsion Laboratory (US)
- University of Tennessee at Knoxville (US)
- ORCID
- Tan Zhang
- Venue
- IEEE Transactions on Electronics Packaging Manufacturing
- Published
- 2009-10
- Volume
- 32
- Issue
- 4
- Pages
- 291-300
- ISSN
- 1521-334X (ISSN-L)
- 1558-0822
- OpenAlex
- W2167260132
- Cited by
- 40
- References
- 14
- Citations by year
- 2026: 1 · 2025: 1 · 2024: 2 · 2023: 1 · 2022: 2 · 2021: 3 · 2020: 2 · 2019: 2 · 2018: 3 · 2017: 2 · 2016: 1 · 2015: 2 · 2013: 3 · 2012: 7
- FWCI
- 3.97
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- IEEE Transactions on Electronics Packaging Manufacturing (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electronic Packaging and Soldering Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Keywords
- flexible electronics, silicon thinning, flip-chip bonding, flexible substrates, liquid crystalline polymers, polyimide, thermocompression bonding, underfill, conformable electronics
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