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Cited by 261

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Mechanism of copper surface toxicity in Escherichia coli O157:H7 and Salmonella involves immediate membrane depolarization followed by slower rate of DNA destruction which differs from that observed for Gram‐positive bacteria

Warnes, S. L., Caves, V., Keevil, C. W.·2012·Environmental Microbiology

Abstract

Summary: We have reported previously that copper I and II ionic species, and superoxide but not Fenton reaction generated hydroxyl radicals, are important in the killing mechanism of pathogenic enterococci on copper surfaces. In this new work we determined if the mechanism was the same in non‐pathogenic ancestral (K12) and laboratory (DH5α) strains, and a pathogenic strain (O157), of Escherichia coli . The pathogenic strain exhibited prolonged survival on stainless steel surfaces compared with the other E. coli strains but all died within 10 min on copper surfaces using a ‘dry’ inoculum protocol (with approximately 10 7 cfu cm −2 ) to mimic dry touch contamination. We observed immediate cytoplasmic membrane depolarization, not seen with enterococci or methicillin resistant Staphylococcus aureus , and loss of outer membrane integrity, inhibition of respiration and in situ generation of reactive oxygen species on copper and copper alloy surfaces that did not occur on stainless steel. Chelation of copper (I) and (II) ionic species still had the most significant impact on bacterial survival but protection by d ‐mannitol suggests hydroxyl radicals are involved in the killing mechanism. We also observed a much slower rate of DNA destruction on copper surfaces compared with previous results for enterococci. This may be due to protection of the nucleic acid by the periplasm and the extensive cell aggregation that we observed on copper surfaces. Similar results were obtained for Salmonella species but partial quenching by d ‐mannitol suggests radicals other than hydroxyl may be involved. The results indicate that copper biocidal surfaces are effective for Gram‐positive and Gram‐negative bacteria but bacterial morphology affects the mechanism of toxicity. These surfaces could not only help to prevent infection spread but also prevent horizontal gene transmission which is responsible for the evolution of virulent toxin producing and antibiotic resistant bacteria.

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Crossref · 10.1111/j.1462-2920.2011.02677.x

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Metadata

Authors
Warnes, S. L., Caves, V., & Keevil, C. W.
Venue
Environmental Microbiology
Publisher
Wiley
Published
2011-12-19
Volume
14
Issue
7
Pages
1730-1743
ISSN
  • 1462-2912 (ISSN-L)
  • 1462-2920
OpenAlex
W1838145843
Cited by
261
References
5
FWCI
3.29
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Mechanism of copper surface toxicity in Escherichia coli O157:H7 and Salmonella involves immediate membrane depolarization followed by slower rate of DNA destruction which differs from that observed for Gram‐positive bacteria. https://app.cochat.ai/papers/10.1111/j.1462-2920.2011.02677.x
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Warnes, S. L., Caves, V., & Keevil, C. W. (2012). Mechanism of copper surface toxicity in Escherichia coli O157:H7 and Salmonella involves immediate membrane depolarization followed by slower rate of DNA destruction which differs from that observed for Gram‐positive bacteria. Environmental Microbiology. https://doi.org/10.1111/j.1462-2920.2011.02677.x

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