The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.
3-Omega Measurements of Vertically Oriented Carbon Nanotubes on Silicon
Abstract
An exploratory thermal interface structure, made of vertically oriented carbon nanotubes directly grown on a silicon substrate, has been thermally characterized using a 3-omega method. The effective thermal conductivities of the carbon nanotubes (CNT) sample, including the effects of voids, are found to be 74W∕mK to 83W∕mK in the temperature range of 295K to 323K, one order higher than that of the best thermal greases or phase change materials. This result suggests that the vertically oriented CNTs potentially can be a promising next-generation thermal interface solution. However, fairly large thermal resistances were observed at the interfaces between the CNT samples and the experimental contact. Minimizing these contact resistances is critical for the application of these materials.
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Citations
Cites
Thermal Transport Measurements of Individual Multiwalled Nanotubes
Kim, P., Shi, L., Majumdar, A., & McEuen, P. L. (2001) · Physical Review Letters · doi:10.1103/physrevlett.87.215502 · Cited by 3,378
Thermal conductivity measurement from 30 to 750 K: the 3ω method
Cahill, D. G. (1990) · Review of Scientific Instruments · doi:10.1063/1.1141498 · Cited by 1,928
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611
Self-citationMeasurement of thermal conductivity of silicon dioxide thin films using a 3ω method
Yamane, T., Nagai, N., Katayama, S.-I., & Todoki, M. (2002) · Journal of Applied Physics · doi:10.1063/1.1481958 · Cited by 367
Cited by
Rao, R., Pint, C. L., Islam, A. E., Weatherup, R. S., Hofmann, S., Meshot, E. R., Wu, F., Zhou, C., Dee, N., Amama, P. B., et al. (2018) · ACS Nano · doi:10.1021/acsnano.8b06511 · Cited by 588
Qiu, L., Zhu, N., Feng, Y., Michaelides, E. E., Żyła, G., Jing, D., Zhang, X., Norris, P. M., Markides, C. N., & Mahian, O. (2020) · Physics Reports · doi:10.1016/j.physrep.2019.12.001 · Cited by 523
Thermal conductivity of carbon nanotube networks: a review
Kumanek, B., & Janas, D. (2019) · Journal of Materials Science · doi:10.1007/s10853-019-03368-0 · Cited by 486
Present and future thermal interface materials for electronic devices
Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1296605 · Cited by 422
Liang, Q., Yao, X., Wang, W., Liu, Y., & Wong, C. P. (2011) · ACS Nano · doi:10.1021/nn200181e · Cited by 320
Metadata
- Authors
- Hu, X. J., Padilla, A. A., Xu, J., Fisher, T. S., & Goodson, K. E.
- Venue
- Journal of Heat Transfer
- Publisher
- ASME International
- Published
- 2005-11-04
- Volume
- 128
- Issue
- 11
- Pages
- 1109-1113
- ISSN
- 0022-1481 (ISSN-L)
- 1528-8943
- OpenAlex
- W2054243108
- Cited by
- 237
- References
- 4
- FWCI
- 4.84
- Type
- journal article
- Language
- en
- Open access
- closed
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