The DOI matches its Crossref record.
Projection Printing Characterization:
Abstract
Projection printing eliminates the problems introduced by hard-contacting the mask to the wafer while maintaining the high resolution requirements of the integrated circuit manufacturer. Certain advantages of projection printing are obvious: the wafers are not contaminated or damaged by contact with the mask, and the mask will not wear out. Less obvious are the steps required to maximize the advantages of projection printing, thereby reducing costs and increasing yields. This paper considers photoresist choices, suggests some procedures to determine process variables, and discusses mask costs and quality effects.
Overview
Integrity signals
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Claims the paper makes
Citations
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Sorted by citations
Selvaraja, S. K., Jaenen, P., Bogaerts, W., Thourhout, D. V., Dumon, P., & Baets, R. (2009) · Journal of Lightwave Technology · doi:10.1109/jlt.2009.2022282 · Cited by 221
“picts the measured line width as a function of focus and exposure dose (so-called Bossung curve) [17].”
BackgroundExtreme ultraviolet lithography
Kazazis, D., Santaclara, J. G., van Schoot, J., Mochi, I., & Ekinci, Y. (2024) · Nature Reviews Methods Primers · doi:10.1038/s43586-024-00361-z · Cited by 149
“An intuitive way of characterizing the impact of focus and dose variations to estimate and optimize tolerances is to use a Bossung plot 81 .”
Jenkins, R. P., Campbell, S. D., & Werner, D. H. (2021) · Nanophotonics · doi:10.1515/nanoph-2021-0428 · Cited by 61
Line edge roughness and intrinsic bias for two methacrylate polymer resist systems
Pawloski, A. R., Acheta, A., Levinson, H., et al. (2006) · Journal of Micro/Nanopatterning Materials and Metrology · doi:10.1117/1.2200675 · Cited by 28
Run-to-Run Critical Dimension and Sidewall Angle Lithography Control Using the PROLITH Simulator
Chemali, C. E., Freudenberg, J. S., Hankinson, M., et al. (2004) · IEEE Transactions on Semiconductor Manufacturing · doi:10.1109/tsm.2004.831530 · Cited by 27
“This consists of visualizing the FEM data by generating two CD plots called Bossung plots [14], one for the isolated lines [Fig.”
Method
Metadata
- Authors
- Bossung, J. W.
- Affiliations
- PerkinElmer (United States) (US)
- Corresponding author
- Bossung, John W.
- Venue
- SPIE Proceedings
- Publisher
- SPIE
- Published
- 1977-08-08
- Volume
- 0100
- Pages
- 80-85
- ISSN
- 0277-786X (ISSN-L)
- OpenAlex
- W2046658518
- Cited by
- 57
- References
- 0
- Citations by year
- 2026: 3 · 2025: 1 · 2024: 4 · 2023: 3 · 2022: 4 · 2021: 3 · 2019: 1 · 2018: 1 · 2015: 4 · 2014: 1 · 2013: 2
- FWCI
- 0.00
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Photolithography Techniques
- Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Advanced optical system design
- Physical Sciences › Engineering › Industrial and Manufacturing Engineering › Industrial Vision Systems and Defect Detection
- Keywords
- projection printing, photolithography, process parameter optimization, integrated circuit fabrication, wafer contamination, yield improvement
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How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Projection Printing Characterization:. https://app.cochat.ai/papers/10.1117/12.955357
- The paper
- Bossung, J. W. (1977). Projection Printing Characterization:. SPIE Proceedings. https://doi.org/10.1117/12.955357
