The DOI matches its Crossref record.
Silicon‐On‐Insulator by Wafer Bonding: A Review
Open accessAbstract
Various approaches to wafer bonding technology are reviewed. Bonding kinetics are discussed as well as different mechanical and chemical thinning techniques. The structural and electrical qualities of state‐of‐the‐art bonded SOI silicon films and devices built in them are detailed. Problems faced by this technology are evaluated.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cited by
Gösele, U., & Tong, Q.-Y. (1998) · Annual Review of Materials Science · doi:10.1146/annurev.matsci.28.1.215 · Cited by 599
III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects
Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., & Bowers, J. (2010) · Laser & Photonics Reviews · doi:10.1002/lpor.200900033 · Cited by 555
Thermal conduction in doped single-crystal silicon films
Asheghi, M., Kurabayashi, K., Kasnavi, R., & Goodson, K. E. (2002) · Journal of Applied Physics · doi:10.1063/1.1458057 · Cited by 469
Wafer-to-wafer bonding for microstructure formation
Schmidt, M. A. (1998) · Proceedings of the IEEE · doi:10.1109/5.704262 · Cited by 437
Temperature-Dependent Thermal Conductivity of Single-Crystal Silicon Layers in SOI Substrates
Asheghi, M., Touzelbaev, M. N., Goodson, K. E., Leung, Y. K., & Wong, S. S. (1998) · Journal of Heat Transfer · doi:10.1115/1.2830059 · Cited by 368
Metadata
- Authors
- Maszara, W. P.
- Venue
- Journal of The Electrochemical Society
- Publisher
- The Electrochemical Society
- Published
- 1991-01-01
- Volume
- 138
- Issue
- 1
- Pages
- 341-347
- ISSN
- 0013-4651 (ISSN-L)
- 1945-7111
- OpenAlex
- W1966863561
- Cited by
- 170
- References
- 0
- FWCI
- 18.44
- Type
- journal article
- Language
- en
- Open access
- bronze
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: Silicon‐On‐Insulator by Wafer Bonding: A Review. https://app.cochat.ai/papers/10.1149/1.2085575
- The paper
- Maszara, W. P. (1991). Silicon‐On‐Insulator by Wafer Bonding: A Review. Journal of The Electrochemical Society. https://doi.org/10.1149/1.2085575
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
