The DOI matches its Crossref record; 38 of the 38 references it cites were found in a registry or an index.
III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects
Abstract
In this paper III‐V on silicon‐on‐insulator (SOI) heterogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter‐chip and intra‐chip optical interconnects. Two bonding technologies are used to realize the III‐V/SOI integration: one based on molecular wafer bonding and the other based on DVS‐BCB adhesive wafer bonding. The realization of micro‐disk lasers, Fabry‐Perot lasers, DFB lasers, DBR lasers and mode‐locked lasers on the III‐V/SOI material platform is discussed.
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Citations
Cites
Rationale and challenges for optical interconnects to electronic chips
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Optical interconnections for VLSI systems
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On-Chip Optical Interconnect Roadmap: Challenges and Critical Directions
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Plasma-assisted InP-to-Si low temperature wafer bonding
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Self-citationRoelkens, G., Thourhout, D. V., Baets, R., Nötzel, R., & Smit, M. K. (2006) · Optics Express · doi:10.1364/oe.14.008154 · Cited by 215
Self-citationLow temperature wafer direct bonding
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Cited by
Bogaerts, W., De Heyn, P., Van Vaerenbergh, T., De Vos, K., Kumar Selvaraja, S., Claes, T., Dumon, P., Bienstman, P., Van Thourhout, D., & Baets, R. (2012) · Laser & Photonics Reviews · doi:10.1002/lpor.201100017 · Cited by 2,643
Advances in quantum cryptography
Pirandola, S., Andersen, U. L., Banchi, L., Berta, M., Bunandar, D., Colbeck, R., Englund, D., Gehring, T., Lupo, C., Ottaviani, C., et al. (2020) · Advances in Optics and Photonics · doi:10.1364/aop.361502 · Cited by 2,033
Integrated photonics on thin-film lithium niobate
Zhu, D., Shao, L., Yu, M., Cheng, R., Desiatov, B., Xin, C. J., Hu, Y., Holzgrafe, J., Ghosh, S., Shams-Ansari, A., et al. (2021) · Advances in Optics and Photonics · doi:10.1364/aop.411024 · Cited by 1,516
Polarization management for silicon photonic integrated circuits
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Self-citationNovel Light Source Integration Approaches for Silicon Photonics
Wang, Z., Abbasi, A., Dave, U., De Groote, A., Kumari, S., Kunert, B., Merckling, C., Pantouvaki, M., Shi, Y., Tian, B., et al. (2017) · Laser & Photonics Reviews · doi:10.1002/lpor.201700063 · Cited by 213
Self-citation
Metadata
- Authors
- Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., & Bowers, J.
- Venue
- Laser & Photonics Reviews
- Publisher
- Wiley
- Published
- 2010-01-11
- Volume
- 4
- Issue
- 6
- Pages
- 751-779
- ISSN
- 1863-8880 (ISSN-L)
- 1863-8899
- OpenAlex
- W2089925011
- Cited by
- 555
- References
- 38
- FWCI
- 25.92
- Type
- journal article
- Language
- en
- Open access
- closed
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- Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., & Bowers, J. (2010). III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects. Laser & Photonics Reviews. https://doi.org/10.1002/lpor.200900033
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