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Cited by 437

The DOI matches its Crossref record; 12 of the 12 references it cites were found in a registry or an index.

Wafer-to-wafer bonding for microstructure formation

Schmidt, M.A.·1998·Proceedings of the IEEE
DOI 10.1109/5.704262
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Abstract

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods are discussed. Opportunities for continued development are outlined.

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Metadata

Authors
Schmidt, M. A.
Venue
Proceedings of the IEEE
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Published
1998
Volume
86
Issue
8
Pages
1575-1585
ISSN
0018-9219 (ISSN-L)
DOI
10.1109/5.704262
OpenAlex
W2105130406
Cited by
437
References
12
FWCI
16.53
Type
journal article
Language
en
Open access
closed

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CoChat. (2026). Citation check: Wafer-to-wafer bonding for microstructure formation. https://app.cochat.ai/papers/10.1109/5.704262
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Schmidt, M. A. (1998). Wafer-to-wafer bonding for microstructure formation. Proceedings of the IEEE. https://doi.org/10.1109/5.704262

Data sources

Bibliographic data: Semantic Scholar, OpenAlex, Crossref.

Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).

Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.