Cited by 1,244Photonic and Optical DevicesSemiconductor Lasers and Optical DevicesSemiconductor Quantum Structures and Devices

Electrically pumped hybrid AlGaInAs-silicon evanescent laser

Open access
Fang, Alexander W., Park, Hyundai, Cohen, Oded, Jones, Richard, Paniccia, Mario J., Bowers, John E.·2006·Optics Express

Abstract

An electrically pumped light source on silicon is a key element needed for photonic integrated circuits on silicon. Here we report an electrically pumped AlGaInAs-silicon evanescent laser architecture where the laser cavity is defined solely by the silicon waveguide and needs no critical alignment to the III-V active material during fabrication via wafer bonding. This laser runs continuous-wave (c.w.) with a threshold of 65 mA, a maximum output power of 1.8 mW with a differential quantum efficiency of 12.7 % and a maximum operating temperature of 40 degrees C. This approach allows for 100's of lasers to be fabricated in one bonding step, making it suitable for high volume, low-cost, integration. By varying the silicon waveguide dimensions and the composition of the III-V layer, this architecture can be extended to fabricate other active devices on silicon such as optical amplifiers, modulators and photo-detectors.

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Crossref · 10.1364/oe.14.009203

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  • Heterogeneous integration strategies include bonding III-V chips to Si with coarse alignment followed by post-processing the Si wafer to make quantum-well (QW) lasers.

    “They include bonding III-V chips to Si with coarse alignment followed by post-processing the Si wafer to make quantum-well (QW) lasers (Fig. 3e)14,18,19,22.”

    From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [14]

  • Another commercially successful technique in HVM (>million/year) has been heterogeneous integration, where multiple materials or epitaxial stacks are processed together into one silicon chip at wafer scale.

    “Another commercially successful technique in HVM (>million/year)14 has been heterogeneous integration, where multiple materials or epitaxial stacks are processed together into one silicon chip at wafer scale.”

    From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [14]

Cited by

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Authors
Fang, A. W., Park, H., Cohen, O., Jones, R., Paniccia, M. J., & Bowers, J. E.
Affiliations
  • University of California, Santa Barbara (US)
  • Intel (Israel) (IL)
  • Intel (United States) (US)
Venue
Optics Express
Published
2006
Volume
14
Issue
20
Pages
9203
ISSN
1094-4087 (ISSN-L)
OpenAlex
W1992672596
Cited by
1,244
References
0
Citations by year
2026: 21 · 2025: 39 · 2024: 35 · 2023: 43 · 2022: 40 · 2021: 53 · 2020: 44 · 2019: 62 · 2018: 77 · 2017: 69 · 2016: 82 · 2015: 82 · 2014: 76 · 2013: 78 · 2012: 87
FWCI
71.87
Type
journal article
Language
en
Open access
Locations
  • Optics Express (publishedVersion)
  • PubMed (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
  • Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Semiconductor Quantum Structures and Devices
Keywords
electrically pumped lasers, AlGaInAs, silicon photonics, wafer bonding, silicon waveguides, continuous-wave operation, photonic integrated circuits, quantum efficiency, high-temperature operation

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