Cited by 316Photonic and Optical Devices3D IC and TSV technologiesSemiconductor Lasers and Optical Devices

Hybrid Integrated Platforms for Silicon Photonics

Open access
Liang, Di, Roelkens, Gunther, Baets, Roel, Bowers, John·2010·Materials

Abstract

A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics.

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  • Integration proximity of the dissimilar materials in direct bonding facilitates superior optical coupling and heat transportation between them.

    “Integration proximity of the (dissimilar) materials in direct bonding facilitates superior optical coupling and heat transportation between them56.”

    From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [56]

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Authors
Liang, D., Roelkens, G., Baets, R., & Bowers, J.
Affiliations
  • University of California, Santa Barbara (US)
  • Photonics Research Group, IMEC - Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
  • Ghent University (BE)
Corresponding author
Liang, Di
Venue
Materials
Publisher
MDPI AG
Published
2010-03-12
Volume
3
Issue
3
Pages
1782-1802
ISSN
1996-1944 (ISSN-L)
OpenAlex
W2112113449
Cited by
316
References
60
Citations by year
2026: 6 · 2025: 19 · 2024: 17 · 2023: 20 · 2022: 27 · 2021: 21 · 2020: 18 · 2019: 15 · 2018: 27 · 2017: 23 · 2016: 26 · 2015: 28 · 2014: 25 · 2013: 19 · 2012: 14
FWCI
11.10
Type
journal article
Language
en
Open access
Locations
  • Materials (publishedVersion, cc-by)
  • Europe PMC (PubMed Central) (publishedVersion, cc-by)
  • PubMed Central (publishedVersion, cc-by)
  • Ghent University Academic Bibliography (Ghent University) (submittedVersion, other-oa)
  • DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
Funders
  • Vlaamse regering
  • Defense Advanced Research Projects Agency
  • University of California, Santa Barbara
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
Keywords
hybrid integration, silicon photonics, III-V on silicon, silicon-on-insulator, wafer bonding, bond strength, stress distribution, active photonic devices, passive optical components

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