Cited by 229Photonic and Optical DevicesSemiconductor Lasers and Optical DevicesInterconnection Networks and Systems

Monolithic silicon-photonic platforms in state-of-the-art CMOS SOI processes [Invited]

Open access
Stojanović, Vladimir, Ram, Rajeev J., Popović, Milos, Lin, Sen, Moazeni, Sajjad, Wade, Mark, Sun, Chen, Alloatti, Luca +4 more·2018·Optics Express

Abstract

Integrating photonics with advanced electronics leverages transistor performance, process fidelity and package integration, to enable a new class of systems-on-a-chip for a variety of applications ranging from computing and communications to sensing and imaging. Monolithic silicon photonics is a promising solution to meet the energy efficiency, sensitivity, and cost requirements of these applications. In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our "zero-change" silicon photonics platforms in 45 nm and 32 nm SOI CMOS. The results indicate that the 45 nm and 32 nm processes provide a "sweet-spot" for adding photonic capability and enhancing integrated system applications beyond the Moore-scaling, while being able to offload major communication tasks from more deeply-scaled compute and memory chips without complicated 3D integration approaches.

Integrity signals

Registry

Crossref · 10.1364/oe.26.013106

Cites

23 of 23 references verified0 citation errors · 0 not checkable

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  • The option to integrate the PIC with the EIC has been around since the first commercially successful silicon photonic product.

    “The option to integrate the PIC with the EIC has been around since the first commercially successful silicon photonic product1,127,129.”

    From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [129]

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Authors
Stojanović, V., Ram, R. J., Popović, M., Lin, S., Moazeni, S., Wade, M., Sun, C., Alloatti, L., Atabaki, A., Pavanello, F., Mehta, N., & Bhargava, P.
Venue
Optics Express
Published
2018-05-07
Volume
26
Issue
10
Pages
13106
ISSN
1094-4087 (ISSN-L)
OpenAlex
W2801471062
Cited by
229
References
23
Citations by year
2026: 15 · 2025: 18 · 2024: 32 · 2023: 35 · 2022: 28 · 2021: 30 · 2020: 38 · 2019: 27 · 2018: 6
FWCI
9.66
Type
journal article
Language
en
Open access
Locations
  • Optics Express (publishedVersion)
  • PubMed (publishedVersion)
Funders
  • Defense Advanced Research Projects Agency (DARPA) (HR0011-11-C-0100)
  • Directorate for Engineering (ENG) (1611296)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
  • Physical Sciences › Computer Science › Computer Networks and Communications › Interconnection Networks and Systems
Keywords
optical interconnects, system-on-chip, photonic integration, integrated photonics

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