Interfacial Thermal Conductance of Transfer‐Printed Metal Films

Analysis of heat flow in layered structures for time-domain thermoreflectance

Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543 · see citing works

Waterproof AlInGaP optoelectronics on stretchable substrates with applications in biomedicine and robotics

Kim, R.-H., Kim, D.-H., Xiao, J., Kim, B. H., Park, S.-I., Panilaitis, B., Ghaffari, R., Yao, J., Li, M., Liu, Z., et al. (2010) · Nature Materials · doi:10.1038/nmat2879 · Cited by 637 · see citing works

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Kim, D., Xiao, J., Song, J., Huang, Y. Y., & Rogers, J. A. (2010) · Advanced Materials · doi:10.1002/adma.200902927 · Cited by 593 · see citing works

Thermal conductance of interfaces between highly dissimilar materials

Lyeo, H.-K., & Cahill, D. G. (2006) · Physical Review B · doi:10.1103/physrevb.73.144301 · Cited by 576 · see citing works

The role of van der Waals forces in adhesion of micromachined surfaces

DelRio‬, F. W., Boer, M. P., Knapp, J. A., Reedy, E. D., Clews, P. J., & Dunn, M. L. (2005) · Nature Materials · doi:10.1038/nmat1431 · Cited by 525 · see citing works

Thermal conductance of epitaxial interfaces

Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486 · see citing works

Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing

Kim, S., Wu, J. C., Carlson, J. A., Jin, S. H., Kovalsky, A., Glass, P., Liu, Z., Ahmed, N., Elgan, S. L., Chen, W., et al. (2010) · Proceedings of the National Academy of Sciences · doi:10.1073/pnas.1005828107 · Cited by 445 · see citing works

FT-IR Study of Water Adsorption on Aluminum Oxide Surfaces

Al‐Abadleh, H. A., & Grassian, V. H. (2002) · Langmuir · doi:10.1021/la026208a · Cited by 440 · see citing works

Kapitza conductance of silicon–amorphous polyethylene interfaces by molecular dynamics simulations

Hu, M., Keblinski, P., & Schelling, P. K. (2009) · Physical Review B · doi:10.1103/physrevb.79.104305 · Cited by 207 · see citing works

Comparison of the 3ω method and time-domain thermoreflectance for measurements of the cross-plane thermal conductivity of epitaxial semiconductors

Koh, Y. K., Singer, S. L., Kim, W., Zide, J. M. O., Lü, H., Cahill, D. G., Majumdar, A., & Gossard, A. C. (2009) · Journal of Applied Physics · doi:10.1063/1.3078808 · Cited by 206 · see citing works

Growth and Structure of Water on SiO2 Films on Si Investigated by Kelvin Probe Microscopy and in Situ X-ray Spectroscopies

Verdaguer, A., Weis, C. D., Oncins, G., Ketteler, G., Bluhm, H., & Salmerón, M. (2007) · Langmuir · doi:10.1021/la700893w · Cited by 191 · see citing works

Room temperature thermal conductance of alkanedithiol self-assembled monolayers

Wang, R. Y., Segalman, R. A., & Majumdar, A. (2006) · Applied Physics Letters · doi:10.1063/1.2358856 · Cited by 185 · see citing works

The roughening of metal surfaces

Lapujoulade, J. (1994) · Surface Science Reports · doi:10.1016/0167-5729(94)90004-3 · Cited by 178 · see citing works

Elastic contact between rough surfaces: Effect of roughness at large and small wavelengths

Hyun, S., & Robbins, M. O. (2007) · Tribology International · doi:10.1016/j.triboint.2007.02.003 · Cited by 136 · see citing works

Thermoreflectance of metal transducers for time-domain thermoreflectance

Wang, Y., Park, J. Y., Koh, Y. K., & Cahill, D. G. (2010) · Journal of Applied Physics · doi:10.1063/1.3457151 · Cited by 112 · see citing works

Capillary adhesion between elastic solids with randomly rough surfaces

Persson, B. N. J. (2008) · Journal of Physics Condensed Matter · doi:10.1088/0953-8984/20/31/315007 · Cited by 111 · see citing works

Influence of roughness on capillary forces between hydrophilic surfaces

van Zwol, P. J., Palasantzas, G., & Hosson, J. T. M. D. (2008) · Physical Review E · doi:10.1103/physreve.78.031606 · Cited by 107 · see citing works

Kapitza thermal resistance between a metal and a nonmetal

Mahan, G. D. (2009) · Physical Review B · doi:10.1103/physrevb.79.075408 · Cited by 90 · see citing works

Thermal resistances of pressed contacts

Snaith, B., Probert, S. D., & O'Callaghan, P. W. (1986) · Applied Energy · doi:10.1016/0306-2619(86)90073-5 · Cited by 88 · see citing works

Heat transfer between elastic solids with randomly rough surfaces

Persson, B. N. J., Lorenz, B., & Волокитин, А. И. (2010) · The European Physical Journal E · doi:10.1140/epje/i2010-10543-1 · Cited by 86 · see citing works

Ultrathin SiO2 on Si. I. Quantifying and removing carbonaceous contamination

Seah, M. P., & Spencer, S. J. (2003) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.1535173 · Cited by 85 · see citing works

Use of the Quartz Crystal Microbalance for the Study of Adsorption from the Gas Phase

Tsionsky, V., & Gileadi, E. (1994) · Langmuir · doi:10.1021/la00020a053 · Cited by 74 · see citing works

Evaluation of contacts for a MEMS thermal switch

Cho, J., Richards, C. D., Bahr, D. F., Jiao, J., & Richards, R. F. (2008) · Journal of Micromechanics and Microengineering · doi:10.1088/0960-1317/18/10/105012 · Cited by 73 · see citing works

Influence of roughness on near-field heat transfer between two plates

Biehs, S., & Greffet, J. (2010) · Physical Review B · doi:10.1103/physrevb.82.245410 · Cited by 42 · see citing works

Thermal contact conductance of adhered microcantilevers

Huxtable, S. T., Cahill, D. G., & Phinney, L. M. (2004) · Journal of Applied Physics · doi:10.1063/1.1639146 · Cited by 34 · see citing works

Thermal contact conductance of actuated interfaces

Song, W.-B., Sutton, M. S., & Talghader, J. J. (2002) · Applied Physics Letters · doi:10.1063/1.1499518 · Cited by 32 · see citing works

Contact‐Printed Microelectromechanical Systems

Packard, C. E., Murarka, A., Lam, E. W., Schmidt, M. A., & Bulović, V. (2010) · Advanced Materials · doi:10.1002/adma.200903034 · Cited by 29 · see citing works

Strain engineering of epitaxially transferred, ultrathin layers of III-V semiconductor on insulator

Fang, H., Madsen, M., Carraro, C., Takei, K., Kim, H. S., Plis, E. A., Chen, S., Krishna, S., Chueh, Y., Maboudian, R., et al. (2011) · Applied Physics Letters · doi:10.1063/1.3537963 · Cited by 24 · see citing works

Effect of capillary formation on friction and pull-off forces measured on submicron-size asperities

Ando, Y. (2005) · Tribology Letters · doi:10.1007/s11249-004-4262-1 · Cited by 18 · see citing works

The tunneling of heat

Mahan, G. D. (2011) · Applied Physics Letters · doi:10.1063/1.3573800 · Cited by 17 · see citing works

Thermal contact conductance across Si3N4—Si3N4 contact

Aikawa, T., & Winer, W. O. (1994) · Wear · doi:10.1016/0043-1648(94)90114-7 · Cited by 17 · see citing works

An ultra-lightweight design for imperceptible plastic electronics

Kaltenbrunner, M., Sekitani, T., Reeder, J., Yokota, T., Kuribara, K., Tokuhara, T., Drack, M., Schwödiauer, R., Graz, I., Bauer-Gogonea, S., et al. (2013) · Nature · doi:10.1038/nature12314 · Cited by 2,485 · see citing works

Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

Carlson, A., Bowen, A. M., Huang, Y. Y., Nuzzo, R. G., & Rogers, J. A. (2012) · Advanced Materials · doi:10.1002/adma.201201386 · Cited by 927 · see citing works

Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials

Jiang, P., Qian, X., & Yang, R. (2018) · Journal of Applied Physics · doi:10.1063/1.5046944 · Cited by 424 · see citing works

Thermal Boundary Conductance: A Materials Science Perspective

Monachon, C., Weber, L., & Dames, C. (2016) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070115-031719 · Cited by 288 · see citing works

Anisotropic Thermal Conductivity of Exfoliated Black Phosphorus

Jang, H., Wood, J. D., Ryder, C. R., Hersam, M. C., & Cahill, D. G. (2015) · Advanced Materials · doi:10.1002/adma.201503466 · Cited by 260 · see citing works

Tunable anisotropic thermal transport in porous carbon foams: The role of phonon coupling

Chen, X.-K., Hu, X.-Y., Jia, P., Xie, Z.-X., & Liu, J. (2021) · International Journal of Mechanical Sciences · doi:10.1016/j.ijmecsci.2021.106576 · Cited by 208 · see citing works

Molecular Bridge Enables Anomalous Enhancement in Thermal Transport across Hard‐Soft Material Interfaces

Sun, F., Zhang, T., Jobbins, M. M., Guo, Z. M., Zhang, X., Zheng, Z., Tang, D., Ptasińska, S., & Luo, T. (2014) · Advanced Materials · doi:10.1002/adma.201400954 · Cited by 172 · see citing works

Thermal conductance across β-Ga2O3-diamond van der Waals heterogeneous interfaces

Cheng, Z., Yates, L., Shi, J., Tadjer, M. J., Hobart, K. D., & Graham, S. L. (2019) · APL Materials · doi:10.1063/1.5089559 · Cited by 167 · see citing works

Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications

Zhang, X., Yang, G., & Cao, B. (2022) · Advanced Materials Interfaces · doi:10.1002/admi.202200078 · Cited by 118 · see citing works

Ultralow Thermal Conductivity of Multilayers with Highly Dissimilar Debye Temperatures

Dechaumphai, E., Lu, D., Kan, J. J., Moon, J., Fullerton, E. E., Liu, Z., & Chen, R. (2014) · Nano Letters · doi:10.1021/nl500127c · Cited by 99 · see citing works

Thermal conductance of strongly bonded metal-oxide interfaces

Wilson, R. B., Apgar, B. A., Hsieh, W.-P., Martin, L. W., & Cahill, D. G. (2015) · Physical Review B · doi:10.1103/physrevb.91.115414 · Cited by 97 · see citing works

Thermal conductance across harmonic-matched epitaxial Al-sapphire heterointerfaces

Cheng, Z., Koh, Y. R., Ahmad, H., Hu, R., Shi, J., Liao, M. E., Wang, Y., Bai, T., Li, R., Lee, E., et al. (2020) · Communications Physics · doi:10.1038/s42005-020-0383-6 · Cited by 84 · see citing works

Influence of interfacial properties on thermal transport at gold:silicon contacts

Duda, J. C., Yang, C.-Y. P., Foley, B. M., Cheaito, R., Medlin, D. L., Jones, R. E., & Hopkins, P. E. (2013) · Applied Physics Letters · doi:10.1063/1.4793431 · Cited by 82 · see citing works

On the Steady-State Temperature Rise During Laser Heating of Multilayer Thin Films in Optical Pump–Probe Techniques

Braun, J. L., Szwejkowski, C. J., Giri, A., & Hopkins, P. E. (2017) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4038713 · Cited by 69 · see citing works

Laser‐Driven Shape Memory Effect for Transfer Printing Combining Parallelism with Individual Object Control

Eisenhaure, J. D., & Kim, S. (2016) · Advanced Materials Technologies · doi:10.1002/admt.201600098 · Cited by 67 · see citing works

Strain engineering and mechanical assembly of silicon/germanium nanomembranes

Guo, Q., Di, Z., Lagally, M. G., & Mei, Y. (2018) · Materials Science and Engineering R Reports · doi:10.1016/j.mser.2018.02.002 · Cited by 67 · see citing works

Impact of Nanoscale Roughness on Heat Transport across the Solid–Solid Interface

Wang, J., Zhang, Z., Shi, R., Chandrashekar, B. N., Shen, N., Song, H., Wang, N., Chen, J., & Cheng, C. (2019) · Advanced Materials Interfaces · doi:10.1002/admi.201901582 · Cited by 57 · see citing works

Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics

Cheng, Z., Graham, S. L., Amano, H., & Cahill, D. G. (2022) · Applied Physics Letters · doi:10.1063/5.0077039 · Cited by 47 · see citing works

Plasmonic Sensing of Heat Transport at Solid–Liquid Interfaces

Park, J., & Cahill, D. G. (2016) · The Journal of Physical Chemistry C · doi:10.1021/acs.jpcc.5b11706 · Cited by 45 · see citing works

A four-probe thermal transport measurement method for nanostructures

Kim, J., Ou, E., Sellan, D. P., & Shi, L. (2015) · Review of Scientific Instruments · doi:10.1063/1.4916547 · Cited by 44 · see citing works

Thermal Resistance of Transferred-Silicon-Nanomembrane Interfaces

Schroeder, D. P., Akšamija, Z., Rath, A., Voyles, P. M., Lagally, M. G., & Eriksson, M. A. (2015) · Physical Review Letters · doi:10.1103/physrevlett.115.256101 · Cited by 43 · see citing works

Effect of interface adhesion and impurity mass on phonon transport at atomic junctions

Saltonstall, C. B., Polanco, C. A., Duda, J. C., Ghosh, A. W., Norris, P. M., & Hopkins, P. E. (2013) · Journal of Applied Physics · doi:10.1063/1.4773331 · Cited by 42 · see citing works

Progress in the semiconductor/diamond heterogeneous integrations: Technical methods, interfacial phonon transport, and thermal characterizations

Zhao, X., & Hu, W. (2024) · Surfaces and Interfaces · doi:10.1016/j.surfin.2024.104178 · Cited by 34 · see citing works

Towards a coherent database of thermal boundary conductance at metal/dielectric interfaces

Blank, M., & Weber, L. (2019) · Journal of Applied Physics · doi:10.1063/1.5085176 · Cited by 33 · see citing works

Thermal contact resistance at the Nb/Cu interface as a limiting factor for sputtered thin film RF superconducting cavities

Palmieri, V., & Vaglio, R. (2015) · Superconductor Science and Technology · doi:10.1088/0953-2048/29/1/015004 · Cited by 31 · see citing works

Molecular Fin Effect from Heterogeneous Self-Assembled Monolayer Enhances Thermal Conductance across Hard–Soft Interfaces

Wei, X., Zhang, T., & Luo, T. (2017) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.7b07169 · Cited by 30 · see citing works

Thermal Conductivity of Mechanically Joined Semiconducting/Metal Nanomembrane Superlattices

Grimm, D. F., Wilson, R. B., Teshome, B., Gorantla, S. M., Rümmeli, M. H., Bublat, T., Zallo, E., Li, G., Cahill, D. G., & Schmidt, O. G. (2014) · Nano Letters · doi:10.1021/nl404827j · Cited by 28 · see citing works

Titanium contacts to graphene: process-induced variability in electronic and thermal transport

Freedy, K. M., Giri, A., Foley, B. M., Barone, M. R., Hopkins, P. E., & McDonnell, S. J. (2018) · Nanotechnology · doi:10.1088/1361-6528/aaaacd · Cited by 28 · see citing works

Density, Elastic Constants, and Thermal Conductivity of Interfacially Polymerized Polyamide Films for Reverse Osmosis Membranes

Dennison, J. M., Xie, X., Murphy, C. J., & Cahill, D. G. (2018) · ACS Applied Nano Materials · doi:10.1021/acsanm.8b01129 · Cited by 28 · see citing works

Influence of the thickness of a nanometric copper interlayer on Au/dielectric thermal boundary conductance

Blank, M., & Weber, L. (2018) · Journal of Applied Physics · doi:10.1063/1.5030049 · Cited by 28 · see citing works

Thermal rectification and negative differential thermal conductance in harmonic chains with nonlinear system-bath coupling

Yi, M., Li, H., & Ding, Z. (2016) · Physical review. E · doi:10.1103/physreve.93.032127 · Cited by 25 · see citing works

Thermal conductance of silicon interfaces directly bonded by room-temperature surface activation

Sakata, M., Oyake, T., Maire, J. K., Nomura, M., Higurashi, E., & Shiomi, J. (2015) · Applied Physics Letters · doi:10.1063/1.4913675 · Cited by 24 · see citing works

Steady-state measurements of thermal transport across highly conductive interfaces

Warzoha, R. J., Boteler, L. M., Smith, A. N., Getto, E., & Donovan, B. (2018) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2018.10.099 · Cited by 22 · see citing works

Interfacial thermal conductance at metal–nonmetal interface via electron–phonon coupling

Shi, B., Tang, X., Lu, T., Nakayama, T., Li, Y., & Zhou, J. (2018) · Modern Physics Letters B · doi:10.1142/s0217984918300041 · Cited by 23 · see citing works

Electrical Contact at the Interface between Silicon and Transfer-Printed Gold Films by Eutectic Joining

Keum, H., Chung, H., & Kim, S. (2013) · ACS Applied Materials & Interfaces · doi:10.1021/am4021236 · Cited by 23 · see citing works

Measurements and numerical calculations of thermal conductivity to evaluate the quality of β-gallium oxide thin films grown on sapphire and silicon carbide by molecular beam epitaxy

Vaca, D., Barry, M. C., Yates, L., Nepal, N., Katzer, D. S., Downey, B. P., Wheeler, V. D., Nyakiti, L. O., Meyer, D. J., Graham, S. L., et al. (2022) · Applied Physics Letters · doi:10.1063/5.0098048 · Cited by 22 · see citing works

Role of the electron-phonon coupling on the thermal boundary conductance of metal/diamond interfaces with nanometric interlayers

Blank, M., Schneider, G., Ordoñez-Miranda, J., & Weber, L. (2019) · Journal of Applied Physics · doi:10.1063/1.5115823 · Cited by 22 · see citing works

Electrostatically driven collapsible Au thin films assembled using transfer printing for thermal switching

Keum, H., Seong, M., Sinha, S., & Kim, S. (2012) · Applied Physics Letters · doi:10.1063/1.4720397 · Cited by 21 · see citing works

Deep learning-based data processing method for transient thermoreflectance measurements

Mao, Y., Zhou, S., Tang, W., Wu, M., Zhang, H., Sun, H., & Yuan, C. (2024) · Journal of Applied Physics · doi:10.1063/5.0192164 · Cited by 20 · see citing works

Stick-and-play system based on interfacial adhesion control enhanced by micro/nanostructures

Yoo, J. I., Kim, S. H., & Ko, H. C. (2021) · Nano Research · doi:10.1007/s12274-021-3533-6 · Cited by 18 · see citing works

Micro-LEGO for MEMS

Kim, S. (2019) · Micromachines · doi:10.3390/mi10040267 · Cited by 18 · see citing works

Micro-Masonry of MEMS Sensors and Actuators

Zhang, Y., Keum, H., Park, K., Bashir, R., & Kim, S. (2013) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2013.2273439 · Cited by 17 · see citing works

High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer

Wu, K., Zhou, Q., Zou, H., Leng, K., Zeng, Y., & Wu, Z. (2019) · Micromachines · doi:10.3390/mi10030160 · Cited by 14 · see citing works

Enhanced thermal conductance at interfaces between gold and amorphous silicon and between gold and amorphous silica

Hajj, J. E., Adessi, C., Féliciano, M. D. S., Ledoux, G., & Mérabia, S. (2024) · Physical review. B./Physical review. B · doi:10.1103/physrevb.110.115437 · Cited by 13 · see citing works

Ultrasensitive Molecular Detection Using Thermal Conductance of a Hydrophobic Gold–Water Interface

Green, A. J., Alaulamie, A. A., Baral, S., & Richardson, H. H. (2013) · Nano Letters · doi:10.1021/nl401717y · Cited by 13 · see citing works

Energy confinement and thermal boundary conductance effects on short-pulsed thermal ablation thresholds in thin films

Tomko, J. A., Giri, A., Donovan, B., Bubb, D. M., O’Malley, S. M., & Hopkins, P. E. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.96.014108 · Cited by 13 · see citing works

Molecular dynamics simulation of thermal conduction across mechanical interfaces with sub-nm roughness

Gao, B., Zou, Z., Li, M., & Hao, M. (2024) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2024.107622 · Cited by 12 · see citing works

Simultaneous measurement of cross-plane thermal conductivity and interfacial thermal conductance of nano-metal films on a low thermal diffusivity substrate using TDTR

Zeng, Y., Li, L., Wang, S., Sun, F., Wang, Z., Tu, X., & Li, C. (2024) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2024.125542 · Cited by 11 · see citing works

Transient thermoreflectance from graphene composites with matrix of indium and copper

Zheng, H., & Jagannadham, K. (2013) · AIP Advances · doi:10.1063/1.4794801 · Cited by 11 · see citing works

Recent developments in graphene conductive ink: Preparation, printing technology and application

JIANG, X., Zhao, X., Li, J., Lin, S., & Zhu, H. (2017) · Chinese Science Bulletin (Chinese Version) · doi:10.1360/n972017-00288 · Cited by 11 · see citing works

Modulating interfacial thermal conductance of atomic-scale Si/Si and Al/Al interfaces via adjusting twist angles

Dong, Y., Cheng, H. L., Yi, T., Ding, Y., Huang, M., & Zhang, X. (2024) · Applied Surface Science · doi:10.1016/j.apsusc.2024.161948 · Cited by 10 · see citing works

Understanding Phonon Transport Properties Using Classical Molecular Dynamics SimulationsPreprint

Muraleedharan, M. G., Gordiz, K., Rohskopf, A., Wyant, S., Cheng, Z., Graham, S. L., & Henry, A. S. (2020) · arXiv (Cornell University) · doi:10.48550/arxiv.2011.01070 · Cited by 10 · see citing works

Intrinsic thermal interfacial resistance measurement in bonded metal–polymer foils

Rajagopal, M. C., Man, T., Agrawal, A., Kuntumalla, G., & Sinha, S. (2020) · Review of Scientific Instruments · doi:10.1063/5.0012404 · Cited by 9 · see citing works

Area of contact and thermal transport across transfer-printed metal-dielectric interfaces

Seong, M., Singh, P., & Sinha, S. (2013) · Journal of Applied Physics · doi:10.1063/1.4773532 · Cited by 7 · see citing works

Thermal science and engineering of β-Ga2O3 materials and devices

Cheng, Z., Shi, J., Yuan, C., Kim, S. H., & Graham, S. L. (2021) · Semiconductors and semimetals · doi:10.1016/bs.semsem.2021.06.001 · Cited by 8 · see citing works

Why does thermal shock produce smaller particles of zeolite?

Wibowo, E., Sutisna, Rokhmat, M., Khairurrijal, K., & Abdullah, M. (2016) · Powder Technology · doi:10.1016/j.powtec.2016.07.034 · Cited by 7 · see citing works

Effect of Surface Property on Transfer-Print of Au Thin-Film to Micro-Structured Substrate

Kaneko, A., Murakami, H., & Yamashita, T. (2015) · International Journal of Automation Technology · doi:10.20965/ijat.2015.p0411 · Cited by 7 · see citing works

Hybrid semiconductor/metal nanomembrane superlattices for thermoelectric application

Li, G., Grimm, D. F., Engemaier, V., Lösch, S., Manga, K., Bandari, V. K., Zhu, F., & Schmidt, O. G. (2015) · physica status solidi (a) · doi:10.1002/pssa.201532604 · Cited by 6 · see citing works

Reliable peripheral anchor-assisted transfer printing of ultrathin SiO2 for a transparent and flexible IGZO-based inverter

Yoo, J. I., Jang, H. S., Jang, J., Yoon, J., Kwon, O. Y., Park, J. J., Kang, S. M., Yoo, T. J., Kim, S. H., Lee, B. H., et al. (2018) · Microelectronic Engineering · doi:10.1016/j.mee.2018.05.003 · Cited by 6 · see citing works

Thermal Conductance across beta-Ga2O3-diamond Van der Waals Heterogeneous InterfacesPreprint

Cheng, Z., Yates, L., Shi, J., Tadjer, M. J., Hobart, K. D., & Graham, S. L. (2019) · arXiv (Cornell University) · doi:10.48550/arxiv.1901.02961 · Cited by 5 · see citing works

Spatial variation of thermal properties in thermal interface materials using a frequency domain thermoreflectance method

Zhang, Z., Kulkarni, P., Chang, J.-Y., Daeumer, M. A., Gharaibeh, A. R., Sammakia, B. G., & Schiffres, S. N. (2026) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2026.130942 · Cited by 5 · see citing works

Improved Thermal Performance of InGaAs/GaAs Nanomembrane HEMTs Transferred onto Various Substrates by Epitaxial Lift-Off

Gucmann, F., Meng, B., Chvála, A., Kúdela, R., Yuan, C., Ťapajna, M., Florovič, M., Egyenes, F., Eliáš, P., Hrubišák, F., et al. (2024) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.4c00659 · Cited by 4 · see citing works

Thermal metrology for deeply buried low-thermal-resistance interfaces

Gaitonde, A. U., Weibel, J. A., & Marconnet, A. M. (2025) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2024.126591 · Cited by 4 · see citing works

Micro Fabrication of Au Thin-Film by Transfer-Printing Using Atomic Diffusion Bonding

Kaneko, A., Katayama, T., & Morishita, S. (2019) · International Journal of Automation Technology · doi:10.20965/ijat.2019.p0810 · Cited by 4 · see citing works

In situ and ex situ processes for synthesizing metal multilayers with electronically conductive interfaces

Angeles, F., Shi, X., & Wilson, R. B. (2022) · Journal of Applied Physics · doi:10.1063/5.0084573 · Cited by 4 · see citing works

Microassembly of MEMS actuators and sensors via micro-masonry

Zhang, Y., Keum, H., & Kim, S. (2013) · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · doi:10.1109/memsys.2013.6474233 · Cited by 4 · see citing works

High thermal conductivity near phonon ballistic transport of nanoscale AlN thin films prepared by atomic layer annealing

Jhong, F.-J., Chen, C.-C., Lin, H.-C., Hsieh, W., & Chen, M. (2025) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2025.181586 · Cited by 3 · see citing works

First-principles calculations of thermal transport at metal/silicon interfaces: Evidence of interfacial electron-phonon coupling

Féliciano, M. D. S., Adessi, C., Hajj, J. E., Horny, N., Detcheverry, F., Cobián, M., & Mérabia, S. (2025) · Physical review. B./Physical review. B · doi:10.1103/94kx-5l8h · Cited by 2 · see citing works

Ultralow Contact Thermal Resistance between Bismuth Selenide Nanoribbons Achieved by Current-Induced Annealing

Xiong, Y., Li, S., Wang, R., Cheng, Z., Yang, J., Li, D., Liu, X., & Xu, D. (2024) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.4c10789 · Cited by 2 · see citing works

Fundamental understanding of thermal transport across solid interfaces

Cheng, Z., Shi, J., & Graham, S. L. (2022) · Elsevier eBooks · doi:10.1016/b978-0-12-821084-0.00005-6 · Cited by 1 · see citing works

The interfacial thermal conductance of epitaxial metal-semiconductor interfaces

Ye, N. (2024) · Library, Museums and Press - UDSpace (University of Delaware) · doi:10.58088/qe0b-fh09 · Cited by 1 · see citing works

Thermal Conductance and Seebeck Effect in Mesoscopic Systems

Aly, A. H., & El-Gawaad, N. S. A. (2015) · International Journal of Thermophysics · doi:10.1007/s10765-015-1974-4

Repeated thermal shock processes for fragmenting zeolite particles and the possible existence of a critical size

Cahyaningrum, D. T., Rahmayanti, H. D., Wibowo, E., Khairurrijal, K., & Abdullah, M. (2017) · Powder Technology · doi:10.1016/j.powtec.2017.11.053

Novel nontraditional transfer printing technologies

Kim, S., & Keum, H. (2024) · Elsevier eBooks · doi:10.1016/b978-0-443-18845-9.00008-9

Transfer printing and in-situ bonding for ultra-high-density integration

Kim, U., Kim, J., Jeong, S., Keum, H., & Kim, S. (2026) · Results in Engineering · doi:10.1016/j.rineng.2026.111194

High Thermal Conductivity Transfer-Printed Polycrystalline Diamond Membranes for Device- and Chip-Level Thermal Management

Walwil, H. M., Wang, C., Kim, S., Zhou, X., Suter, L., Muehle, M., Kim, T. K., Kim, M. Y., Oh, J., Kwak, J. S., et al. (2026) · ACS Applied Electronic Materials · doi:10.1021/acsaelm.6c00310

Fourier-number criterion for accurate steady-state thermoreflectance measurements of low-thermal-conductivity materials

Kim, H., Park, H. M., Joo, K.-N., & Oh, D. (2026) · Case Studies in Thermal Engineering · doi:10.1016/j.csite.2026.108547

Area of contact and thermal transport across transfer-printed metal-dielectric interfaces

Seong, M., Singh, P., & Sinha, S. (2013) · Journal of Applied Physics · doi:10.1063/1.4773532 · Cited by 7 · see citing works

Microcontact Printing: Interfacial Thermal Conductance of Transfer‐Printed Metal Films (Adv. Mater. 43/2011)

Oh, D., Kim, S., Rogers, J. A., Cahill, D. G., & Sinha, S. (2011) · Advanced Materials · doi:10.1002/adma.201190170 · Cited by 1 · see citing works

Thermal transport across transfer printed metal-dielectric interfaces: influence of contact mechanics and nanoscale energy transport

Singh, P. K. (2013) · Illinois Digital Environment for Access to Learning and Scholarship (University of Illinois at Urbana-Champaign)

Temperature-Dependent Thermal Boundary Conductance at Metal/Indium-Based III–V Semiconductor Interfaces

Larkin, L. S., Redding, M. R., Le, N. Q., & Norris, P. M. (2017) · Journal of Heat Transfer · doi:10.1115/1.4034938 · Cited by 10 · see citing works

AN EXPERIMENTAL INVESTIGATION OF THERMAL CONTACT CONDUCTANCE BETWEEN INTERFACES OF TWO CONTACTED SOLID MATERIALS

(2017) · International Journal of Advance Engineering and Research Development · doi:10.21090/ijaerd.28397