The DOI matches its Crossref record; 110 of the 110 references it cites were found in a registry or an index.
3D Printing of Multilayered and Multimaterial Electronics: A Review
Abstract
3D printing, also known as additive manufacturing, is a manufacturing process in which the materials are deposited layer by layer in an additive manner. With the advancement in materials and manufacturing technology, 3D printing has found its applications in the field of electronics manufacturing. Initially, 3D printing is used for the fabrication of electronic components with single material designs such as resistors, inductors, circuits, antennas, strain gauges, etc. Recently, there are many works involving the use of 3D printing fabrication techniques for advanced electronic components and devices such as parallel plate capacitors, inductors, organic light‐emitting diodes, photovoltaics, transistors, displays, etc. which involve multilayer multimaterial printing. Despite these many works, there has been no review on the design and fabrication consideration for the 3D printing of multilayered and multimaterial (MLMM) electronics. As such, this review aims to summarize the current landscape of 3D printing of MLMM electronics and provide some insights on the design consideration, fabrication strategies, and challenges of 3D printing of MLMM electronics. In particular, the focus will be placed on discussing the interface conditions between different materials such as surface wettability, surface roughness, material compatibility, and the considerations for postprocessing treatments.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
ASME International Mechanical Engineering Congress and Exposition
(2001) · The Journal of the Acoustical Society of America · doi:10.1121/1.4776777 · Cited by 2,619
Derby, B. (2010) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070909-104502 · Cited by 1,984
Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review
Khan, S., Lorenzelli, L., & Dahiya, R. S. (2015) · IEEE Sensors Journal · doi:10.1109/jsen.2014.2375203 · Cited by 1,225
Inkjet-Printed Graphene Electronics
Torrisi, F., Hasan, T., Wu, W., Sun, Z., Lombardo, A., Kulmala, T. S., Hsieh, G.-W., Jung, S., Bonaccorso, F., Paul, P. J., et al. (2012) · ACS Nano · doi:10.1021/nn2044609 · Cited by 1,195
Inkjet-Printed Line Morphologies and Temperature Control of the Coffee Ring Effect
Soltman, D., & Subramanian, V. (2008) · Langmuir · doi:10.1021/la7026847 · Cited by 994
A New Frontier of Printed Electronics: Flexible Hybrid Electronics
Khan, Y., Thielens, A., Muin, S., Ting, J., Baumbauer, C., & Arias, A. C. (2020) · Advanced Materials · doi:10.1002/adma.201905279 · Cited by 891
Ko, S. H., Pan, H., Grigoropoulos, C. P., Luscombe, C. K., Fréchet, J. M. J., & Poulikakos, D. (2007) · Nanotechnology · doi:10.1088/0957-4484/18/34/345202 · Cited by 770
Graphene Oxide‐Based Electrode Inks for 3D‐Printed Lithium‐Ion Batteries
Fu, K., Wang, Y., Yan, C., Yao, Y., Chen, Y., Dai, J., Lacey, S., Wang, Y., Wan, J., Li, T., et al. (2016) · Advanced Materials · doi:10.1002/adma.201505391 · Cited by 758
Influence of Fluid Physical Properties on Ink-Jet Printability
Jang, D., Kim, D., & Moon, J. (2009) · Langmuir · doi:10.1021/la900059m · Cited by 745
Hybrid 3D Printing of Soft Electronics
Valentine, A. D., Busbee, T. A., Boley, J. W., Raney, J. R., Chortos, A., Kotikian, A., Berrigan, J. D., Durstock, M. F., & Lewis, J. A. (2017) · Advanced Materials · doi:10.1002/adma.201703817 · Cited by 688
Cited by
Nazir, A., Gokcekaya, O., Md Masum Billah, K., Ertugrul, O., Jiang, J., Sun, J., & Hussain, S. (2023) · Materials & Design · doi:10.1016/j.matdes.2023.111661 · Cited by 773
Extrusion-based additive manufacturing technologies: State of the art and future perspectives
Altıparmak, S. C., Yardley, V. A., Shi, Z., & Lin, J. (2022) · Journal of Manufacturing Processes · doi:10.1016/j.jmapro.2022.09.032 · Cited by 320
Post-Production Finishing Processes Utilized in 3D Printing Technologies
Kantaros, A., Ganetsos, T., Petrescu, F., Ungureanu, L., & Munteanu, I. (2024) · Processes · doi:10.3390/pr12030595 · Cited by 80
Metadata
- Authors
- Goh, G. L., Zhang, H., Chong, T. H., & Yeong, W. Y.
- Venue
- Advanced Electronic Materials
- Publisher
- Wiley
- Published
- 2021-07-16
- Volume
- 7
- Issue
- 10
- ISSN
- 2199-160X (ISSN-L)
- OpenAlex
- W3184677434
- Cited by
- 319
- References
- 110
- FWCI
- 14.19
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: 3D Printing of Multilayered and Multimaterial Electronics: A Review. https://app.cochat.ai/papers/10.1002/aelm.202100445
- The paper
- Goh, G. L., Zhang, H., Chong, T. H., & Yeong, W. Y. (2021). 3D Printing of Multilayered and Multimaterial Electronics: A Review. Advanced Electronic Materials. https://doi.org/10.1002/aelm.202100445
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
