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Achieving brittle-intermetallic-free and high-conductivity aluminum/copper joints using nickel-phosphorus coatings
Abstract
Mechanical degradation due to brittle intermetallic compounds (IMCs) formed at the faying interface is a predominant deficiency in dissimilar metal joints. In copper/aluminum (Cu/Al) joints, additional defects (such as partially-bonded interfaces, porosity and cracks) lead to further weakened strength and lowered electrical conductivity. In this study, nickel‑phosphorus (Ni-P) coatings are deposited on Al to address these issues. With the aid of Ni-P coatings, the detrimental Cu-Al IMC is eliminated, a donut-shaped weld with a partially-bonded interface is evolved into an hourglass-shaped weld with a fully-bonded interface, while the porosity and cracks are inhibited. Numerical simulations indicate that, during the welding without Ni-P coating, the Al oxide aggravates the inhomogeneity of heat generation at the Cu/Al interface, promoting the formation of donut-shaped weld and defects. Microstructural characterization suggests that the Ni-P coatings obstruct the Cu-Al interdiffusion which results in CuAl2-free interfaces, while the amorphous Ni-P convert into eutectic microstructure composed of nanocrystalline Ni and fine Ni3P grains through a solid-state transformation. Using the Ni-P coatings, joints gain an improvement of 140% in lap-shear peak load and a 25-fold increase in lap-shear maximum elongation, as well as an 84% reduction in electrical resistance.
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Metadata
- Authors
- Chen, N., Wang, H., Veeresh, P., Li, J., Oswald, J., Xi, L., Wagner, S., Sekol, R., Liu, V., Wang, K., Perry, T., & Schroth, J.
- Venue
- Materials & Design
- Publisher
- Elsevier BV
- Published
- 2021-02
- Volume
- 199
- Pages
- 109435
- ISSN
- 0264-1275
- Cited by
- 21
- References
- 31
- Language
- en
- Licence
- www.elsevier.com/tdm/userlicense/1.0/ (tdm)
- www.elsevier.com/legal/tdmrep-license (tdm)
- creativecommons.org/licenses/by/4.0/ (vor)
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