Selected failure mechanisms of modern power modules

Uhlig's Corrosion Handbook

Revie, R. W., & Uhlig, H. H. (2011) · Wiley eBooks · doi:10.1002/9780470872864 · Cited by 1,517 · see citing works

Modern power devices

Baliga, B. J. (1987) · Medical Entomology and Zoology · Cited by 677 · see citing works

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

Lall, P., PECHT, M. G., & Hakim, E. B. (1997) · Medical Entomology and Zoology · Cited by 137 · see citing works

Lifetime prediction of IGBT modules for traction applications

Ciappa, M., & Fïchtner, W. (2002) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/relphy.2000.843917 · Cited by 108 · see citing works

Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules

Hamidi, A., Beck, N., Thomas, K., & Herr, E. (1999) · Microelectronics Reliability · doi:10.1016/s0026-2714(99)00164-x · Cited by 106 · see citing works

Crack mechanism in wire bonding joints

Ramminger, S., Türkes, P., & Wachutka, G. (1998) · Microelectronics Reliability · doi:10.1016/s0026-2714(98)00141-3 · Cited by 91 · see citing works

Thermal Cycling and Surface Reconstruction in Aluminum Thin Films

Santoro, C. J. (1969) · Journal of The Electrochemical Society · doi:10.1149/1.2411847 · Cited by 73 · see citing works

Numerical analysis of short-circuit safe operating area for p-channel and n-channel IGBTs

Iwamuro, N., Okamoto, A., Tagami, S., et al. (1991) · IEEE Transactions on Electron Devices · doi:10.1109/16.69910 · Cited by 70 · see citing works

Modelling thermal effects of large contiguous voids in solder joints

Ciampolini, L., Ciappa, M., Malberti, P., et al. (1999) · Microelectronics Journal · doi:10.1016/s0026-2692(99)00073-7 · Cited by 52 · see citing works

Cosmic ray induced failures in high power semiconductor devices

Zeller, H. R. (1997) · Microelectronics Reliability · doi:10.1016/s0026-2714(97)00146-7 · Cited by 51 · see citing works

PLASTIC-STRAIN OF ALUMINIUM INTERCONNECTIONS DURING PULSED OPERATION OF IGBT MULTICHIP MODULES

Ciappa, M., & Malberti, P. (1996) · Quality and Reliability Engineering International · doi:10.1002/(sici)1099-1638(199607)12:4 · Cited by 50 · see citing works

Reliability of AlN substrates and their solder joints in IGBT power modules

Mitić, G., Beinert, R., Klofac, P., et al. (1999) · Microelectronics Reliability · doi:10.1016/s0026-2714(99)00165-1 · Cited by 42 · see citing works

Surface Reconstruction of Aluminum Metallization -- a New Potential Wearout Mechanism

Philofsky, E., Ravi, K. V., Hall, E. L., et al. (1971) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1971.362503 · Cited by 39 · see citing works

Substrate-to-base solder joint reliability in high power IGBT modules

Herr, E., Frey, T., Schlegel, R., Stuck, A., & Zehringer, R. (1997) · Microelectronics Reliability · doi:10.1016/s0026-2714(97)00147-9 · Cited by 36 · see citing works

Effects of Intermetallics on the Reliability of Tin Coated Cu, Ag, and Ni Parts

Olsen, D., Wright, R., & Berg, H. M. (1975) · IEEE International Reliability Physics Symposium proceedings · doi:10.1109/irps.1975.362679 · Cited by 28 · see citing works

Thermal characterization of IGBT power modules

Cova, P., Ciappa, M., Franceschini, G., Malberti, P., & Fantini, F. (1997) · Microelectronics Reliability · doi:10.1016/s0026-2714(97)00150-9 · Cited by 26 · see citing works

Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules

Rodriguez, M. P., Shammas, N. Y. A., Plumpton, A., et al. (2000) · Microelectronics Reliability · doi:10.1016/s0026-2714(99)00250-4 · Cited by 25 · see citing works

Extrapolation of cosmic ray induced failures from test to field conditions for IGBT modules

Findeisen, C., Herr, E., Schenkel, M., et al. (1998) · Microelectronics Reliability · doi:10.1016/s0026-2714(98)00151-6 · Cited by 23 · see citing works

Testing and fabrication of wire-bond electrical connections :

Schafft, H. A. (1972) · doi:10.6028/nbs.tn.726 · Cited by 20 · see citing works

Explosion tests on IGBT high voltage modules

Gekenidis, S., Ramezani, E., & Zeller, H. R. (2003) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd.1999.764079 · Cited by 16 · see citing works

A power-cycling-induced failure mechanism in IGBT multichip modules

Malberti, P., Ciappa, M., & Cattomio, R. (1995) · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · Cited by 10 · see citing works

Reliability Analysis/Assessment of Advanced Technologies

Garry, W. J., Seidl, R.-C., Jennings, T. A., et al. (1990) · Defense Technical Information Center (DTIC) · Cited by 4 · see citing works

Measurement of chip currents in IGBT modules

Palmer, P., Joyce, J. C., & Stark, B. (1997) · Cambridge University Engineering Department Publications Database · Cited by 3 · see citing works

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P. (2010) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2010.2049377 · Cited by 1,278 · see citing works

Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics

Wang, H., Liserre, M., Blaabjerg, F., de Place Rimmen, P., Jacobsen, J. B., Kvisgaard, T., & Landkildehus, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2290282 · Cited by 693 · see citing works

Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

Smet, V., Forest, F., Huselstein, J.-J., Richardeau, F., Khatir, Z., Lefebvre, S., & Berkani, M. (2011) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2011.2114313 · Cited by 620 · see citing works

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

Hanif, A., Yu, Y., DeVoto, D., & Khan, F. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2860587 · Cited by 272 · see citing works

Overview of Real-Time Lifetime Prediction and Extension for SiC Power Converters

Ni, Z., Lyu, X., Yadav, O. P., Singh, B. N., Zheng, S., & Cao, D. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2962503 · Cited by 261 · see citing works

Power Cycling Reliability of Power Module: A Survey

Durand, C., Klingler, M., Coutellier, D., & Naceur, H. (2016) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2016.2516044 · Cited by 239 · see citing works

Evaluation of $V_{\rm ce}$ Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling

Smet, V., Forest, F., Huselstein, J.-J., Rashed, A., & Richardeau, F. (2013) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2012.2196894 · Cited by 232 · see citing works

Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules

Choi, U.-M., Joergensen, S., & Blaabjerg, F. (2016) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2016.2521899 · Cited by 200 · see citing works

Real-Time Measurement of Temperature Sensitive Electrical Parameters in SiC Power MOSFETs

Griffo, A., Wang, J., Colombage, K., & Kamel, T. (2018) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2017.2739687 · Cited by 175 · see citing works

A Voltage-Based Open-Circuit Fault Detection and Isolation Approach for Modular Multilevel Converters With Model-Predictive Control

Zhou, D., Yang, S., & Tang, Y. (2018) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2796584 · Cited by 143 · see citing works

A New Complete Condition Monitoring Method for SiC Power MOSFETs

Ugur, E., Xu, C., Yang, F., Pu, S., & Akin, B. (2021) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2020.2970668 · Cited by 126 · see citing works

Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules

Luo, H., Iannuzzo, F., & Turnaturi, M. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2894717 · Cited by 82 · see citing works

Review of Topside Interconnections for Wide Bandgap Power Semiconductor Packaging

Wang, L., Wang, W., Hueting, R. J. E., Rietveld, G., & Ferreira, J. A. (2023) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2022.3200469 · Cited by 73 · see citing works

Long-Term Reliability Evaluation of Power Modules With Low Amplitude Thermomechanical Stresses and Initial Defects

Hu, B., Konaklieva, S., Kourra, N., Williams, M. A., Ran, L., & Lai, W. (2021) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2958737 · Cited by 46 · see citing works

Review of SiC MOSFET based three-phase inverter lifetime prediction

Ni, Z., Lyu, X., Yadav, O. P., & Cao, D. (2017) · 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) · doi:10.1109/apec.2017.7930819 · Cited by 40 · see citing works

Evaluation and Design Tools for the Reliability of Wind Power Converter System

Ma, K., Zhou, D., & Blaabjerg, F. (2015) · Journal of Power Electronics · doi:10.6113/jpe.2015.15.5.1149 · Cited by 34 · see citing works

AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters

Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works

Load-Dependent Active Thermal Control of Grid-Forming Converters

Andresen, M., De Carne, G., & Liserre, M. (2020) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2020.2966573 · Cited by 10 · see citing works

Thermal Analysis and Test Condition Definition of Power cycling Tests for a 6-in-1 Double Side Cooling SiC Power Module

Tang, G. (2022) · IEEE Electronics Packaging Technology Conference (EPTC) · doi:10.1109/eptc56328.2022.10013156 · Cited by 4 · see citing works

Investigation of Power Semiconductor Devices for High Frequency High Density Power Converters

Wang, H. (2007) · VTechWorks (Virginia Tech) · Cited by 12 · see citing works

Development of packaging technologies for SiC power module

Liu, C.-K., Chao, Y.-L., Li, W., et al. (2015) · International Microsystems, Packaging, Assembly and Circuits Technology Conference · doi:10.1109/impact.2015.7365232 · Cited by 6 · see citing works

A multi-physics approach to condition monitoring of SiC power module

Hologne, M., Mogniotte, J.-F., Le, M., Allard, B., Clerc, G., & Cottinet, P. (2021) · Microelectronic Engineering · doi:10.1016/j.mee.2021.111633 · Cited by 7 · see citing works

Advanced packaging of SiC power module for automotive applications

Liang, Z., Ning, P., & Wang, F. (2013) · IEEE Energy Conversion Congress and Exposition (ECCE) · doi:10.1109/ecce.2013.6647076 · Cited by 12 · see citing works