The DOI matches its Crossref record; 31 of the 31 references it cites were found in a registry or an index.
Ionized physical vapor deposition (IPVD): A review of technology and applications
Open accessOverview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
CRC Handbook of Chemistry and Physics
(2014) · doi:10.1201/b17118 · Cited by 57,706
Principles of Plasma Discharges and Materials Processing
Lieberman, M. A., & Lichtenberg, A. J. (2005) · doi:10.1002/0471724254 · Cited by 4,748
Magnetron sputtering: a review of recent developments and applications
Kelly, P. J., & Arnell, R. D. (2000) · Vacuum · doi:10.1016/s0042-207x(99)00189-x · Cited by 2,136
(2018) · Physics Subject Headings (PhySH) · doi:10.29172/a5866236-c99c-4828-b499-4f50cccf7a2b · Cited by 1,992
Hass, G., & Gerstenberg, D. (1964) · Journal of The Electrochemical Society · doi:10.1149/1.2426128 · Cited by 1,754
A novel pulsed magnetron sputter technique utilizing very high target power densities
Kouznetsov, V., Macák, K., Schneider, J. M., Helmersson, U., & Petrov, I. (1999) · Surface and Coatings Technology · doi:10.1016/s0257-8972(99)00292-3 · Cited by 1,080
Self-citationTitanium aluminum nitride films: A new alternative to TiN coatings
Münz, W. (1986) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.573713 · Cited by 965
Fundamental understanding and modeling of reactive sputtering processes
Berg, S., & Nyberg, T. (2005) · Thin Solid Films · doi:10.1016/j.tsf.2004.10.051 · Cited by 726
Review of inductively coupled plasmas for plasma processing
Hopwood, J. (1992) · Plasma Sources Science and Technology · doi:10.1088/0963-0252/1/2/006 · Cited by 690
Cathode spots of electric arcs
Jüttner, B. (2001) · Journal of Physics D Applied Physics · doi:10.1088/0022-3727/34/17/202 · Cited by 437
Charged particle fluxes from planar magnetron sputtering sources
Window, B., & Savvides, N. (1986) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.573470 · Cited by 424
Pulsed magnetron sputter technology
Schiller, S., Goedicke, K., Reschke, J., Kirchhoff, V., Schneider, S., & Milde, F. (1993) · Surface and Coatings Technology · doi:10.1016/0257-8972(93)90248-m · Cited by 338
Ionization of sputtered metals in high power pulsed magnetron sputtering
Böhlmark, J., Alami, J., Christou, C., et al. (2004) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.1818135 · Cited by 264
Waits, R. K. (1978) · Journal of Vacuum Science and Technology · doi:10.1116/1.569451 · Cited by 242
Approaches to rid cathodic arc plasmas of macro- and nanoparticles: a review
Anders, A. (1999) · Surface and Coatings Technology · doi:10.1016/s0257-8972(99)00460-0 · Cited by 242
Unbalanced dc magnetrons as sources of high ion fluxes
Window, B., & Savvides, N. (1986) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.573904 · Cited by 212
Spatial and temporal behavior of the plasma parameters in a pulsed magnetron discharge
Gudmundsson, J. T., Alami, J., & Helmersson, U. (2002) · Surface and Coatings Technology · doi:10.1016/s0257-8972(02)00518-2 · Cited by 211
Self-citationPetrov, I., Myers, A., Greene, J. E., & Abelson, J. R. (1994) · Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films · doi:10.1116/1.578955 · Cited by 199
Evolution of the electron energy distribution and plasma parameters in a pulsed magnetron discharge
Guðmundsson, J. T., Alami, J., & Helmersson, U. (2001) · Applied Physics Letters · doi:10.1063/1.1376150 · Cited by 153
Self-citationIonized physical vapor deposition of integrated circuit interconnects
Hopwood, J. (1998) · Physics of Plasmas · doi:10.1063/1.872829 · Cited by 142
Mechanisms for highly ionized magnetron sputtering
Hopwood, J., & Qian, F. (1995) · Journal of Applied Physics · doi:10.1063/1.360334 · Cited by 131
Pulsed dc Magnetron Discharges and their Utilization in Plasma Surface Engineering
Vlček, J., Pajdarová, A. D., & Musil, J. (2004) · Contributions to Plasma Physics · doi:10.1002/ctpp.200410083 · Cited by 129
Spatial electron density distribution in a high-power pulsed magnetron discharge
Böhlmark, J., Guðmundsson, J. T., Alami, J., Lattemann, M., & Helmersson, U. (2005) · IEEE Transactions on Plasma Science · doi:10.1109/tps.2005.845022 · Cited by 121
Self-citationPlasma dynamics in a highly ionized pulsed magnetron discharge
Alami, J., Guðmundsson, J. T., Böhlmark, J., Birch, J., & Helmersson, U. (2005) · Plasma Sources Science and Technology · doi:10.1088/0963-0252/14/3/015 · Cited by 115
Self-citationRecent developments in plasma assisted physical vapour deposition
Schneider, J. M., Rohde, S. L., Sproul, W. D., et al. (2000) · Journal of Physics D Applied Physics · doi:10.1088/0022-3727/33/18/201 · Cited by 111
Droplet formation on steel substrates during cathodic steered arc metal ion etching
Münz, W. ‐., Smith, I. J., Lewis, D. B., et al. (1997) · Vacuum · doi:10.1016/s0042-207x(96)00307-7 · Cited by 104
Ionized physical vapor deposition of titanium nitride: A global plasma model
Tao, K., Mao, D., & Hopwood, J. (2002) · Journal of Applied Physics · doi:10.1063/1.1455139 · Cited by 81
Schneider, J. M., Anders, A., Hjörvarsson, B., Petrov, I., Macák, K., Helmersson, U., & Sundgren, J. ‐. (1999) · Applied Physics Letters · doi:10.1063/1.123292 · Cited by 79
Self-citationThe design and application of electron cyclotron resonance discharges
Asmussen, J., Grotjohn, T. A., Mak, P. U., & Perrin, M. (1997) · IEEE Transactions on Plasma Science · doi:10.1109/27.650896 · Cited by 68
Advanced PVD-TiAlN coatings on carbide and cermet cutting tools
Prengel, H.-G., Santhanam, A. T., Penich, R. M., Jindal, P. C., & Wendt, K. (1997) · Surface and Coatings Technology · doi:10.1016/s0257-8972(97)00503-3 · Cited by 66
Schönjahn, C., Ehiasarian, A. P., Lewis, D. B., et al. (2001) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/1.1349726 · Cited by 31
Self-citation
Cited by
High power pulsed magnetron sputtering: A review on scientific and engineering state of the art
Sarakinos, K., Alami, J., & Konstantinidis, S. (2010) · Surface and Coatings Technology · doi:10.1016/j.surfcoat.2009.11.013 · Cited by 1,075
Recent Advances and Applications of Semiconductor Photocatalytic Technology
Zhang, F., Wang, X., Liu, H., Liu, C., Wan, Y., Long, Y., & Cai, Z. (2019) · Applied Sciences · doi:10.3390/app9122489 · Cited by 543
Physics and technology of magnetron sputtering discharges
Gudmundsson, J. T. (2020) · Plasma Sources Science and Technology · doi:10.1088/1361-6595/abb7bd · Cited by 532
Self-citationReview of the progress in preparing nano TiO2: An important environmental engineering material
Wang, Y., He, Y., Lai, Q., & Fan, M. (2014) · Journal of Environmental Sciences · doi:10.1016/j.jes.2014.09.023 · Cited by 278
Anders, A. (2014) · Applied Physics Letters · doi:10.1063/1.4904713 · Cited by 55
Metadata
- Authors
- Helmersson, U., Lattemann, M., Bohlmark, J., Ehiasarian, A. P., & Gudmundsson, J. T.
- Venue
- Thin Solid Films
- Publisher
- Elsevier BV
- Published
- 2006-08
- Volume
- 513
- Issue
- 1-2
- Pages
- 1-24
- ISSN
- 0040-6090 (ISSN-L)
- OpenAlex
- W2161508873
- Cited by
- 1,081
- References
- 31
- FWCI
- 37.79
- Type
- journal article
- Language
- en
- Open access
- green
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.