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Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN
Abstract
In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composites through combination of ice-templating self-assembly and infiltration methods. The polymer composites possess much higher thermal conductivity up to 4.42 W m –1 K –1 at relatively low loading 34 vol % than that of random distribution composites (1.81 W m –1 K –1 for epoxy/random 3D-BN composites, 1.16 W m –1 K –1 for epoxy/random BN composites) and exhibit a high glass transition temperature (178.9–229.2 °C) and dimensional stability (22.7 ppm/K). We attribute the increased thermal conductivity to the unique oriented 3D-BN thermally conducive network, in which the much higher thermal conductivity along the in-plane direction of BN microplatelets is most useful. This study paves the way for thermally conductive polymer composites used as thermal interface materials for next-generation electronic packaging and 3D integration circuits.
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Metadata
- Authors
- Hu, J., Huang, Y., Yao, Y., Pan, G., Sun, J., Zeng, X., Sun, R., Xu, J.-B., Song, B., & Wong, C.-P.
- Venue
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Published
- 2017-04-05
- Volume
- 9
- Issue
- 15
- Pages
- 13544-13553
- ISSN
- 1944-8244 (ISSN-L)
- 1944-8252
- OpenAlex
- W2601470361
- Cited by
- 499
- References
- 40
- FWCI
- 20.89
- Type
- journal article
- Language
- en
- Open access
- closed
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