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An Ultraviolet-Curable Mold for Sub-100-nm Lithography
Abstract
We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.
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Metadata
- Authors
- Choi, S.-J., Yoo, P. J., Baek, S. J., Kim, T. W., & Lee, H. H.
- Venue
- Journal of the American Chemical Society
- Publisher
- American Chemical Society (ACS)
- Published
- 2004-06-01
- Volume
- 126
- Issue
- 25
- Pages
- 7744-7745
- ISSN
- 0002-7863 (ISSN-L)
- 1520-5126
- OpenAlex
- W1976988389
- Cited by
- 294
- References
- 0
- FWCI
- 13.12
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: An Ultraviolet-Curable Mold for Sub-100-nm Lithography. https://app.cochat.ai/papers/10.1021/ja048972k
- The paper
- Choi, S.-J., Yoo, P. J., Baek, S. J., Kim, T. W., & Lee, H. H. (2004). An Ultraviolet-Curable Mold for Sub-100-nm Lithography. Journal of the American Chemical Society. https://doi.org/10.1021/ja048972k
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
