The DOI matches its Crossref record; 6 of the 6 references it cites were found in a registry or an index.
Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller
Abstract
Copper wires were prepared in a silicon oxide matrix using the methods of semiconductor manufacturing and were electrically characterized. The width of the smallest structure was 40 nm and of the largest, 1000 nm; the heights were 50, 155, and 230 nm. Many samples of each size have been measured in order to perform a systematic investigation. The resistivity of the sample was extracted using the temperature coefficient of resistance. A significant increase in the resistivity was found for the small structures (roughly a factor 2 for 50-nm width). A model based on physical parameters was used in the analysis of the electrical data and very good agreement was obtained. The sensitivity of the various model parameters obtained by a best-fit procedure to the experimental data has been investigated. The impact of width and height on the resistivity, the influence of electron scattering at grain boundaries compared to surface scattering, and the impact of grain sizes and impurities will be discussed in detail.
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Cites
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Sondheimer, E. H. (1952) · Advances in Physics · doi:10.1080/00018735200101151 · Cited by 2,614
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Size-dependent resistivity of metallic wires in the mesoscopic range
Steinhögl, W., Schindler, G., Steinlesberger, G., & Engelhardt, M. (2002) · Physical Review B · doi:10.1103/physrevb.66.075414 · Cited by 541
Self-citationSize effects in the electrical resistivity of polycrystalline nanowires
Durkan, C., & Welland, M. E. (2000) · Physical Review B · doi:10.1103/physrevb.61.14215 · Cited by 284
Microstructural characterization of inlaid copper interconnect lines
Besser, P. R., Zschech, E., Blum, W., Winter, D., Ortega, R., Rose, S., Herrick, M., Gall, M., Thrasher, S. R., Tiner, M., et al. (2001) · Journal of Electronic Materials · doi:10.1007/s11664-001-0038-7 · Cited by 70
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Nanoscale thermal transport. II. 2003–2012
Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews · doi:10.1063/1.4832615 · Cited by 1,763
Fundamental transmitting properties of carbon nanotube antennas
Hanson, G. W. (2005) · IEEE Transactions on Antennas and Propagation · doi:10.1109/tap.2005.858865 · Cited by 444
Bid, A., Bora, A., & Raychaudhuri, A. K. (2006) · Physical Review B · doi:10.1103/physrevb.74.035426 · Cited by 414
Conductance Modeling for Graphene Nanoribbon (GNR) Interconnects
Naeemi, A., & Meindl, J. D. (2007) · IEEE Electron Device Letters · doi:10.1109/led.2007.895452 · Cited by 257
Liang, J., Yeh, S., Wong, S. S., & Wong, H.-S. P. (2013) · ACM Journal on Emerging Technologies in Computing Systems · doi:10.1145/2422094.2422103 · Cited by 71
Metadata
- Authors
- Steinhögl, W., Schindler, G., Steinlesberger, G., Traving, M., & Engelhardt, M.
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2004-12-27
- Volume
- 97
- Issue
- 2
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W2034089924
- Cited by
- 531
- References
- 6
- FWCI
- 11.30
- Type
- journal article
- Language
- en
- Open access
- closed
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- Steinhögl, W., Schindler, G., Steinlesberger, G., Traving, M., & Engelhardt, M. (2005). Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller. Journal of Applied Physics. https://doi.org/10.1063/1.1834982
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
