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Adhesive wafer bonding
Abstract
Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.
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Cited by
III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects
Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., & Bowers, J. (2010) · Laser & Photonics Reviews · doi:10.1002/lpor.200900033 · Cited by 555
Weigel, P. O., Zhao, J., Fang, K., Al-Rubaye, H., Trotter, D., Hood, D., Mudrick, J., Dallo, C., Pomerene, A. T., Starbuck, A. L., et al. (2018) · Optics Express · doi:10.1364/oe.26.023728 · Cited by 338
An overview of through-silicon-via technology and manufacturing challenges
Gambino, J. P., Adderly, S. A., & Knickerbocker, J. U. (2015) · Microelectronic Engineering · doi:10.1016/j.mee.2014.10.019 · Cited by 317
Hybrid Integrated Platforms for Silicon Photonics
Liang, D., Roelkens, G., Baets, R., & Bowers, J. (2010) · Materials · doi:10.3390/ma3031782 · Cited by 316
Roelkens, G., Brouckaert, J., Van Thourhout, D., Baets, R., Nötzel, R., & Smit, M. (2006) · Journal of The Electrochemical Society · doi:10.1149/1.2352045 · Cited by 133
Metadata
- Authors
- Niklaus, F., Stemme, G., Lu, J. Q., & Gutmann, R. J.
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2006-02-01
- Volume
- 99
- Issue
- 3
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W2040946508
- Cited by
- 472
- References
- 0
- FWCI
- 29.35
- Type
- journal article
- Language
- en
- Open access
- closed
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- Niklaus, F., Stemme, G., Lu, J. Q., & Gutmann, R. J. (2006). Adhesive wafer bonding. Journal of Applied Physics. https://doi.org/10.1063/1.2168512
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
