The DOI matches its Crossref record; 19 of the 19 references it cites were found in a registry or an index.
Pulse accumulation, radial heat conduction, and anisotropic thermal conductivity in pump-probe transient thermoreflectance
Abstract
The relationship between pulse accumulation and radial heat conduction in pump-probe transient thermoreflectance (TTR) is explored. The results illustrate how pulse accumulation allows TTR to probe two thermal length scales simultaneously. In addition, the conditions under which radial transport effects are important are described. An analytical solution for anisotropic heat flow in layered structures is given, and a method for measuring both cross-plane and in-plane thermal conductivities of thermally anisotropic thin films is described. As verification, the technique is used to extract the cross-plane and in-plane thermal conductivities of highly ordered pyrolytic graphite. Results are found to be in good agreement with literature values.
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In the citing paper
“In particular, time-domain thermoreflectance (TDTR) technique has been applied for measuring materials with thermal conductivity values ranging from a high end at ~2000 W m -1 K -1 (like diamond 36 and graphite 24, 37 ) to as low as 0.03 W m -1 K -1 (e.g., disordered WSe2 films 26 ).”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [24]
In the citing paper
“Over the past two decades, ultrafast laser-based time-domain thermoreflectance (TDTR) has emerged and evolved as a reliable, powerful, and versatile technique to measure the thermal properties of a wide range of bulk and thin film materials and their interfaces.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [24]
In the citing paper
“The transient thermoreflectance technique can be implemented as both the TDTR method 22, 24, 25 and the frequency-domain thermoreflectance (FDTR) method 93, 94 (see Section III(A) for more details of FDTR).”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [24]
In the citing paper
“Schmidt 24 further extended the model for anisotropic heat conduction where thin films are very likely anisotropic due to the size effect of energy carriers.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [24]
In the citing paper
“FDTR system can also be implemented using the less expensive continuous wave (CW) lasers as shown in Figure 14b, which achieves similar accuracy to TDTR measurement for thermal conductivity of many thin-film materials [98,105,106,109].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [98]
In the citing paper
“The transient thermoreflectance technique can be implemented as both time-domain thermoreflectance (TDTR) method [104,105] and frequency-domain thermoreflectance (FDTR) method [98,106].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [98]
In the citing paper
“This technique has recently been further developed over the last few years for measuring anisotropic thermal conductivity of thin films [97][98][99] and probing spectral phonon transport [100-103].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [98]
Citations
Cites
CRC Handbook of Chemistry and Physics
(2014) · doi:10.1201/b17118 · Cited by 57,706
Carslaw, H. S., & Jaeger, J. C. (1947) · International Linear Collider · Cited by 19,877
CRC Handbook of Chemistry and Physics
Haynes, W. M. (2016) · CRC Press eBooks · doi:10.1201/9781315380476 · Cited by 14,299
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543
Lattice Dynamics of Pyrolytic Graphite
Nicklow, R. M., Wakabayashi, N., & Smith, H. G. (1972) · Physical review. B, Solid state · doi:10.1103/physrevb.5.4951 · Cited by 748
Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K
Stoner, R. J., & Maris, H. J. (1993) · Physical Review B · doi:10.1103/physrevb.48.16373 · Cited by 646
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611
Transient thermoreflectance from thin metal films
Paddock, C. A., & Eesley, G. L. (1986) · Journal of Applied Physics · doi:10.1063/1.337642 · Cited by 530
Thermal conductance of epitaxial interfaces
Costescu, R. M., Wall, M. A., & Cahill, D. G. (2003) · Physical Review B · doi:10.1103/physrevb.67.054302 · Cited by 486
Capinski, W. S., Maris, H. J., Ruf, T., Cardona, M., Ploog, K., & Katzer, D. S. (1999) · Physical Review B · doi:10.1103/physrevb.59.8105 · Cited by 471
Research works printed but not linked: 2
- 1996, Signals and Systems
- 2003, User’s Manual, Model SR844 RF Lock-In Amplifier
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Sorted by citations
Items 501–600 of 655
Hori, T. (2019) · Physical review. B./Physical review. B · doi:10.1103/physrevb.100.214116 · Cited by 4
Thermal model for time-domain thermoreflectance experiments in a laser-flash geometry
Peng, W., & Wilson, R. B. (2022) · Journal of Applied Physics · doi:10.1063/5.0082549 · Cited by 4
Localized Phonon Transport Study of GaN/SiO2Core/shell Nanowires under Thermal-Stress Coupling
Chen, J., Hu, B., & Wang, Z. (2024) · Langmuir · doi:10.1021/acs.langmuir.4c00167 · Cited by 4
Ikeda, Y., Akura, Y., Shimofuri, M., Banerjee, A., Tsuchiya, T., & Hirotani, J. (2025) · Journal of Applied Physics · doi:10.1063/5.0248430 · Cited by 7
Jarzembski, A., Nair, S., Hodges, W., Jordan, M. B., McDonald, A. E., Antiporda, L., Pickrell, G. W., Walsh, T., Semperlotti, F., Neely, J. C., et al. (2025) · Advanced Materials Interfaces · doi:10.1002/admi.202401039 · Cited by 4
Arima, H., Yamashita, Y., & Yagi, T. (2025) · Science and Technology of Advanced Materials · doi:10.1080/14686996.2025.2523240 · Cited by 4
Wada, K., Morikawa, S., & Takashiri, M. (2018) · Transactions of the Materials Research Society of Japan · doi:10.14723/tmrsj.43.311 · Cited by 4
Synergistic phonon scattering in epitaxial silicon multilayers with germanium nanodot inclusions
Oyake, T., Feng, L., Kashiwagi, M., Shiga, T., Hori, T., Yamasaka, S., Nakamura, Y., & Shiomi, J. (2021) · Physical review. B./Physical review. B · doi:10.1103/physrevb.104.054301 · Cited by 4
Laser heating with doughnut-shaped beams
Jian, C., Ye, Z., & Pickel, A. D. (2022) · Journal of Applied Physics · doi:10.1063/5.0103369 · Cited by 4
Zhang, P., Ma, Z., & Li, D. (2023) · Brazilian Journal of Physics · doi:10.1007/s13538-023-01280-2 · Cited by 4
Ye, Z., Park, J., Zhang, Y., Meng, X., Disiena, M. N., Banerjee, S. K., Lin, J., & Wang, Y. (2023) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2023.2255243 · Cited by 4
Du, Y., Bo, Z., Ma, W., Wang, W., & Zhang, X. (2023) · Journal of Applied Physics · doi:10.1063/5.0167635 · Cited by 4
Ichihashi, H., Ueno, S., Fukunaga, T., Takayanagi, S., & Matsukawa, M. (2022) · IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control · doi:10.1109/tuffc.2022.3165519 · Cited by 4
Experimental and numerical investigation of phonon mean free path distribution
Zeng, L. (2013) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 4
Phonon Localization in Heat ConductionPreprint
Luckyanova, M. N., Mendoza, J. M., Lü, H., Huang, S., Zhou, J., Li, M., Kirby, B. J., Grutter, A. J., Puretzky, A. A., Dresselhaus, M. S., et al. (2016) · arXiv (Cornell University) · doi:10.48550/arxiv.1602.05057 · Cited by 4
Self-citationLu, J., Xie, Z., Chen, R., Lin, Z., Lai, T., Wang, Z., & Chen, K. (2025) · Journal of Applied Physics · doi:10.1063/5.0281403 · Cited by 3
Anisotropic Thermal Transport in Quasi-2D Ruddlesden-Popper Hybrid Perovskite Superlattices
Chen, D., Chu, T. T. M., Li, Y., Li, S., Hu, Q., Park, J. Y., Wang, T., Dai, L., Lu, M., Liu, M., et al. (2025) · Physical Review X · doi:10.1103/kh5d-jrxw · Cited by 3
Machine learning-driven data analysis for three-layer time-domain thermoreflectance measurements
Wang, Z., Linghu, B., Li, D., Zhu, J., & Tang, D. (2025) · International Communications in Heat and Mass Transfer · doi:10.1016/j.icheatmasstransfer.2025.110398 · Cited by 4
Chen, Y., Xie, K., & Hu, W. (2025) · Thermochimica Acta · doi:10.1016/j.tca.2025.180211 · Cited by 3
Development of a Next-Generation Thermopile Detector for Cold-Body Space Applications
Eom, B. H., Pepper, B. J., Branco, R. B. N., Greenhagen, B. T., & Kenyon, M. E. (2025) · IEEE Sensors Journal · doi:10.1109/jsen.2025.3595487 · Cited by 3
Jensen, W. A., Liu, N., Donovan, B., Tomko, J. A., Hopkins, P. E., & Floro, J. A. (2017) · Materials Chemistry and Physics · doi:10.1016/j.matchemphys.2017.12.038 · Cited by 3
Sandell, S., Maire, J. K., Chávez‐Ángel, E., Torres, C. M. S., & He, J. (2020) · Electronic System-Integration Technology Conference (ESTC) · doi:10.1109/estc48849.2020.9229862 · Cited by 3
Quiambao-Tomko, K. F., White, R. R., Tomko, J. A., Rost, C. M., Backman, L., Opila, E. J., & Hopkins, P. E. (2022) · Journal of Applied Physics · doi:10.1063/5.0069094 · Cited by 3
Extreme in-plane thermal conductivity anisotropy in Rhenium-based dichalcogenides
Tahbaz, S., & Pisana, S. (2024) · Journal of Physics Materials · doi:10.1088/2515-7639/ad1d8b · Cited by 3
Thermal properties of carbon-based materials
Watkins, E., Parekh, M. N., Bhattacharya, S., Rao, R. S., & Rao, A. M. (2024) · Materials Chemistry and Physics · doi:10.1016/j.matchemphys.2024.129527 · Cited by 3
Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance
Bougher, T. L., Taphouse, J. H., & Cola, B. A. (2015) · doi:10.1115/ipack2015-48587 · Cited by 3
Alaili, K., Ordoñez-Miranda, J., & Ezzahri, Y. (2018) · Journal of Applied Physics · doi:10.1063/1.5058747 · Cited by 3
Cola, B. A., Daiguji, H., Dames, C., Fang, N. X., Fushinobu, K., Inoue, S., Kikugawa, G., Masamichi Kohno, B., Kumar, S., Li, D., et al. (2013) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2012.745913 · Cited by 3
Thermal Conductivity Measurement of Graphene Exfoliated on Silicon Dioxide
Seol, J. H., Moore, A. L., Jo, I., Yao, Z., & Shi, L. (2010) · International Heat Transfer Conference (IHTC) · doi:10.1115/ihtc14-23295 · Cited by 3
Multi-scale Thermal Conductivity Measurements for Cryobiological Applications
Natesan, H., Choi, J., Lubner, S., Dames, C., & Bischof, J. C. (2016) · Frontiers in nanobiomedical research · doi:10.1142/9789814733199_0005 · Cited by 3
In-plane Thermal Conductivity Measurement with Nanosecond Grating Imaging Technique
Jeong, J., Chen, K., Walker, E. S., Roy, N. K., He, F., Liu, P., Willson, C. G., Cullinan, M. A., Bank, S. R., & Wang, Y. (2017) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2017.1416713 · Cited by 3
Methods Used to Determine Heat Transport and Related Properties, With Comparisons
Hofmeister, A. M. (2018) · Elsevier eBooks · doi:10.1016/b978-0-12-809981-0.00004-8 · Cited by 3
Li, Z., Wang, H., Zhao, H., Wang, J., Wei, X., & Gu, H. (2021) · Vacuum · doi:10.1016/j.vacuum.2021.110676 · Cited by 3
Ramu, A. T., & Bowers, J. E. (2015) · arXiv (Cornell University) · doi:10.48550/arxiv.1502.06005 · Cited by 3
Non-diffusive Heat Conduction in Nano-/Micro-scale Structures
Wang, D. (2015) · eScholarship (California Digital Library) · Cited by 3
Heat Management by Colloidal Self‐assembly
Song, Q., Schöttle, M., Ruckdeschel, P., Nutz, F. A., & Retsch, M. (2022) · Wiley eBooks · doi:10.1002/9783527828722.ch14 · Cited by 3
Harper, A. N., Boisvert, J., Grammatikopoulos, T. A., Stolow, A., & Pegoraro, A. F. (2025) · Optics Express · doi:10.1364/oe.569993 · Cited by 2
Thermal transport in amorphous carbon nanotubes
Liang, N., Fiorentino, A., & Song, B. (2025) · Physical review. B./Physical review. B · doi:10.1103/klhj-x3f2 · Cited by 2
Quasi-Ballistic Heat Transfer From Metal Nanostructures on Sapphire
Minnich, A. J., & Chen, G. (2011) · ASME/JSME Thermal Engineering Joint Conference (AJTEC) · doi:10.1115/ajtec2011-44094 · Cited by 2
Self-citationDonovan, B., Jensen, W. A., Chen, L., Giri, A., Poon, S. J., Floro, J. A., & Hopkins, P. E. (2018) · Applied Physics Letters · doi:10.1063/1.5019269 · Cited by 2
1D thermal characterization of micro/nano-cantilevers for Suspended ThermoReflectance measurements
Sarkar, D., Brady, J., Baboly, M. G., Xu, L., Singh, G., & Leseman, Z. C. (2019) · AIP Advances · doi:10.1063/1.5115512 · Cited by 2
A scattering matrix formalism to model periodic heat diffusion in stratified solid media
Tao, L., & Chen, Z. (2022) · Journal of Applied Physics · doi:10.1063/5.0111267 · Cited by 2
Anisotropic thermal conductivity in two-dimensional van der Waals crystals
Jang, M., Singh, S., & Suh, J. (2023) · Ceramist · doi:10.31613/ceramist.2023.26.1.08 · Cited by 2
Zhang, L., Nomoto, T., Yamashita, S., Akutsu, H., Krivchikov, A. I., & Nakazawa, Y. (2023) · Low Temperature Physics · doi:10.1063/10.0017814 · Cited by 2
High-Throughput Thermophysical Characterization of Semiconductors
Zhou, S., Mao, Y., Ma, Y., Ma, G., & Yuan, C. (2024) · IEEE Transactions on Instrumentation and Measurement · doi:10.1109/tim.2024.3485440 · Cited by 2
Li, M., Dai, L., Wu, H. Y., Yan, Y., Kang, J. S., King, S. C., McNeil, P. E., Butts, D. M., Galy, T., Marszewski, M., et al. (2025) · Materials Today Physics · doi:10.1016/j.mtphys.2025.101659 · Cited by 2
Milich, M., OLSON, D. H. L., Tiernan, E. M., Harrington, G. J. K., Golden, R. A., Chamberlain, A. L., & Hopkins, P. E. (2025) · Acta Materialia · doi:10.1016/j.actamat.2025.120802 · Cited by 2
Ивакин, Е. В., Tolstik, A. L., Gorbach, D. V., & Stankevich, A. A. (2022) · Journal of Engineering Physics and Thermophysics · doi:10.1007/s10891-022-02568-x · Cited by 2
Ezzahri, Y., Pernot, G., Joulain, K., & Shakouri, A. (2011) · MRS Proceedings · doi:10.1557/opl.2011.1495 · Cited by 2
Vermeersch, B., Pernot, G., Koh, Y., Abumov, P., & Shakouri, A. (2012) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2012.6231462 · Cited by 2
Dilute Bismuthides on an InP Platform
Zhong, Y., Dongmo, P., & Zide, J. M. O. (2013) · Springer series in materials science · doi:10.1007/978-1-4614-8121-8_4 · Cited by 2
Thermal conductivity in nanocrystalline-SiC/C superlattices
Habermehl, S., & Serrano, J. R. (2015) · Applied Physics Letters · doi:10.1063/1.4936094 · Cited by 2
Relativistic stable processes in quasiballistic heat conduction in semiconductors
Chakraborty, P., Vermeersch, B., Shakouri, A., & Tindel, S. (2020) · Physical review. E · doi:10.1103/physreve.101.042110 · Cited by 2
Donovan, B., Gray, T. L., Wilson, A. A., & Warzoha, R. J. (2022) · Review of Scientific Instruments · doi:10.1063/5.0089075 · Cited by 2
Yu, K., Enright, R., & McCloskey, D. M. (2022) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm54085.2022.9899691 · Cited by 2
Battaglia, J., Schick, V., Kusiak, A., Rossignol, C., Wiemer, C., & Lamperti, A. (2011) · Inverse Problems in Science and Engineering · doi:10.1080/17415977.2011.637205 · Cited by 2
Experimental investigations of solid-solid thermal interface conductance
Collins, K. C. (2010) · DSpace@MIT (Massachusetts Institute of Technology) · Cited by 2
Nanoscale Thermal Transport at Graphene-Soft Material Interfaces
Liu, Y. (2016) · VTechWorks (Virginia Tech) · Cited by 2
Minimizing thermal conductivity in laser deposited multilayers
Döring, F. (2017) · eDiss (Georg-August-Universität Göttingen) · doi:10.53846/goediss-6093 · Cited by 2
Ultrahigh through-plane thermal conductivity of graphite by reducing inter-plane twistPreprint
Sun, B., Zhao, L., Chen, Z., Hu, S. J., Zhi, A., Wu, J., Kang, F., Tian, X., & Gu, X. (2024) · Research Square · doi:10.21203/rs.3.rs-5186005/v1 · Cited by 2
Oyake, T., & Shiomi, J. (2013) · TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B · doi:10.1299/kikaib.79.1694 · Cited by 1
Li, Z., Wang, H., Zhao, H., Gu, H., Chen, K., & Wang, J. (2019) · Review of Scientific Instruments · doi:10.1063/1.5095824 · Cited by 1
Fast-Converging and Asymptotic-Preserving Simulation of Frequency Domain Thermoreflectance
Liu, J. L. J., & Wu, L. (2023) · Communications in Computational Physics · doi:10.4208/cicp.oa-2023-0053 · Cited by 1
Vallin, M. P., Yamaguchi, H., Park, J. B., Lee, C.-H., Martinez, R. M., Fensin, S. J., Zhang, R. Z., & Pettes, M. T. (2025) · Heat Transfer · doi:10.1002/htj.70040 · Cited by 1
Defect-engineering induced ultralow thermal conductivity in the diamondlike compound C u 2 HgSnS e 4
Ma, P., Yuan, M.-Q., Zhang, Y.-J., Jin, Y., Xue, Y., Zhang, Y., Chen, J.-Z., Lv, Y., Xu, Z., Feng, J., et al. (2025) · Physical review. B./Physical review. B · doi:10.1103/ly69-1gll · Cited by 1
MBE growth, structural, optical, and thermal properties of AlBN
Savant, C., Vishwakarma, S., Nguyen, T., van Deurzen, L., Lee, J., Alvarez, G., Huang, H.-W., Nomoto, K., Tian, Z., Rana, F., et al. (2026) · Journal of Applied Physics · doi:10.1063/5.0307890 · Cited by 1
Ding, L., Zhang, J., Xu, T., Jiang, X., Ji, J., Liu, Y., Geng, J., Rümmeli, M. H., & Geng, F. L. C. (2026) · Advanced Energy Materials · doi:10.1002/aenm.70909 · Cited by 1
Analysis of scanning thermal microscopy measurements on CVD graphene
Zhang, H., Napolitano, A., & Tortello, M. (2026) · Applied Physics Letters · doi:10.1063/5.0320106 · Cited by 1
Chandra, M., Zhou, Y., Borges, C., Chatterji, A., Ivanov, I. N., Nghiem, D., Sun, L., Santos, M., & Xu, Y. (2026) · Surfaces and Interfaces · doi:10.1016/j.surfin.2026.109602 · Cited by 1
Direct Thermal Resistance Measurement of a Single Defect in Graphite
Bai, T., Zhang, T., Pei, S., Mao, R., Liu, F., Li, J., Shi, R., Du, J., Xian, L., Ren, W., et al. (2026) · ACS Nano · doi:10.1021/acsnano.6c02016 · Cited by 1
From Growth to Performance: Emerging Frontiers in Diamond Materials for High‐Performance Devices
Zhang, X., Liu, J., Sun, S., Park, J., Kang, D. D., Li, X., Gray, T., Zhu, H., Terrones, D., Ngan, K., et al. (2026) · Advanced Materials · doi:10.1002/adma.74765 · Cited by 1
Investigation of thermal transport across solid interfaces with randomly distributed nanostructures
Lee, E., & Luo, T. (2017) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2017.7992495 · Cited by 1
Heat transport in polycrystalline diamond from the meso to the nano scale
Sood, A. (2022) · Elsevier eBooks · doi:10.1016/b978-0-12-821084-0.00009-3 · Cited by 1
Study on the temperature effect on line-scan profile of nanorods under electron irradiation
Zhang, P., Ma, Z., & Li, D. (2022) · Physica Scripta · doi:10.1088/1402-4896/aca634 · Cited by 1
Perez, C., Talreja, D., Kirch, J. D., Zhang, S., Gopalan, V., Botez, D., Foley, B. M., Ramos-Alvarado, B., & Mawst, L. J. (2023) · APL Materials · doi:10.1063/5.0141252 · Cited by 1
Reflections on My Research in Heat and Energy
Chen, G. (2024) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4066899 · Cited by 1
Self-citationTanjaya, N. K., Baba, T., Imura, M., Mori, T., & Ishii, S. (2024) · Optics & Laser Technology · doi:10.1016/j.optlastec.2024.112128 · Cited by 1
A complex thermal conductivity to model quasi-ballistic phonon transport under periodic heating
Li, T., Jiang, B., & Chen, Z. (2025) · Newton · doi:10.1016/j.newton.2025.100092 · Cited by 1
Thermal Boundary Conductance Between Thin Metal Films and Graphite Substrates
Smoyer, J. L., Duda, J. C., Norris, P. M., & Lichtenberger, A. W. (2011) · ASME/JSME Thermal Engineering Joint Conference (AJTEC) · doi:10.1115/ajtec2011-44333 · Cited by 1
Thermal Boundary Conductance Mapping at Metal-MoSe2 Interface
Brown, D. B., Li, X., Xiao, K., Geohegan, D. B., & Kumar, S. (2018) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2018.8419470 · Cited by 1
Graphene-based thermal nanocomposites: fundamentals and applications
Liu, Y., & Qiao, R. (2020) · Elsevier eBooks · doi:10.1016/b978-0-12-817682-5.00010-6 · Cited by 1
Wilson, A. A., Sharar, D. J., Maddux, J. R., Fish, M., & Kierzewski, I. M. (2021) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm51669.2021.9503256 · Cited by 1
Soliton Generation in Negative Thermal Expansion Materials
Curry, E. B., Lyszak, K., Sheets, D., Occhialini, C. A., Rozman, M. G., & Hancock, J. (2021) · Frontiers in Materials · doi:10.3389/fmats.2021.742195 · Cited by 1
Sousa, J. B., Ventura, J. O., & Pereira, A. D. A. (2021) · Elsevier eBooks · doi:10.1016/b978-0-323-46097-2.00002-1 · Cited by 1
Dongmo, P. (2024) · Library, Museums and Press - UDSpace (University of Delaware) · doi:10.58088/w6jk-r113 · Cited by 1
Thermal Transport in Nanostructured Polymers
Líu, J. (2013) · CU Scholar (University of Colorado Boulder) · Cited by 1
Design, Construction, and Applications of a High-Resolution Terahertz Time-Domain Spectrometer
Holland, D. B. (2014) · CaltechTHESIS (California Institute of Technology) · doi:10.7907/z91j97qr · Cited by 1
Feng, Y., Witkoske, E., Küçükgök, B., Koh, Y. R., Shakouri, A., Ferguson, I. T., & Lü, N. (2019) · arXiv (Cornell University) · doi:10.48550/arxiv.1905.03769 · Cited by 1
Investigation of Electrical Properties of P3HT:PCPBM Organic Solar Cells
Shen, Y. (2013) · doi:10.18130/v36230 · Cited by 1
Measurement Techniques of Thermoelectric‐related Performance
Ding, J., Li, Z., Zhang, F., Zou, Y., & Di, C. (2022) · Wiley eBooks · doi:10.1002/9783527835492.ch10 · Cited by 1
Optical Methods for the Measurement of Thermal Conductivity
Bandaru, P. R., & Aubain, M. S. (2013) · doi:10.1002/9781118436707.hmse036
Wu, S.-Z., Zhang, S.-Y., & Sun, H.-X. (2012) · International Journal of Thermophysics · doi:10.1007/s10765-012-1355-1
Analysing Transient Thermoreflectance Data Using Network Identification by Deconvolution
Ezzahri, Y., & Shakouri, A. (2009) · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · doi:10.1115/interpack2009-89200
Collins, K. C., & Chen, G. (2010) · International Heat Transfer Conference (IHTC) · doi:10.1115/ihtc14-23357
Self-citationInterfacial electron and phonon scattering processes in high-powered nanoscale applications.
Hopkins, P. E. (2011) · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · doi:10.2172/1029772
TSUJI, A., & Nagano, H. (2017) · Transactions of the JSME (in Japanese) · doi:10.1299/transjsme.16-00296
Darwish, A. M., Moore, S., Dorlus, W., Bastian, T., Sarkisov, S. S., Mele, P., Saini, S., Koplitz, B. D., & Zhang, X. (2017) · Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications · doi:10.1117/12.2273400
Darwish, A. M., Sarkisov, S. S., Mele, P., & Saini, S. (2017) · InTech eBooks · doi:10.5772/intechopen.70678
Metadata
- Authors
- Schmidt, A. J., Chen, X., & Chen, G.
- Affiliations
- Massachusetts Institute of Technology (US)
- Venue
- Review of Scientific Instruments
- Publisher
- AIP Publishing
- Published
- 2008-11-01
- Volume
- 79
- Issue
- 11
- Pages
- 114902-114902
- ISSN
- 0034-6748 (ISSN-L)
- 1089-7623
- OpenAlex
- W2025194570
- Cited by
- 655
- References
- 19
- Citations by year
- 2026: 31 · 2025: 46 · 2024: 47 · 2023: 26 · 2022: 42 · 2021: 38 · 2020: 47 · 2019: 43 · 2018: 54 · 2017: 59 · 2016: 44 · 2015: 41 · 2014: 26 · 2013: 27 · 2012: 29
- FWCI
- 9.35
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Review of Scientific Instruments (publishedVersion)
- PubMed (publishedVersion)
- Funders
- National Science Foundation
- U.S. Department of Defense
- University of Illinois at Urbana-Champaign
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Physical Sciences › Engineering › Mechanics of Materials › Thermoelastic and Magnetoelastic Phenomena
- Keywords
- transient thermoreflectance, pulse accumulation, radial heat conduction, anisotropic thermal conductivity, through-plane thermal conductivity, in-plane thermal conductivity, thin films, layered structure, pyrolytic graphite, analytical solution
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