Thermal conductivity and electrical properties of 6 H silicon carbide
Abstract
Thermal conductivity measurements of 6H SiC crystals were done in the 300–500 K range by means of radiation thermometry. Both p- and n-type crystals with carrier concentrations in the 8×1015 to 1020 cm−3 range were used. For the purest samples it was found that the thermal conductivity normal to the c axis is proportional to T−1.49, the room-temperature value being 3.87 W/cm deg. It was also found that the thermal conductivity parallel to the c axis is about 30% lower than that normal to the c axis. Electrical data in the 100–1000 K range are also presented.
Integrity signals
Registry
Cites
Statistics
Claims the paper makes
Claims other papers make about this one
Each is checked against this paper’s own text: does it say what the citing paper says it does?
The thermal conductivity of 6H-SiC and 4H-SiC along the [0001] axis is about 20-30% less than along the [1000] axis at room temperature.
“Finally, the thermal conductivity of 6H-SiC and 4H-SiC along the [0001] axis has been found to be about 20–30% less than the thermal conductivity along the [1000] axis at room temperature1733.”
From Universal phonon mean free path spectra in crystalline semiconductors at high temperature (2013) · cites this paper as [33]
Cites
Wooldridge, M. S. (2015) · AccessScience · doi:10.1036/1097-8542.689300 · Cited by 887 · see citing works
Thermal Conductivity of Pure and Impure Silicon, Silicon Carbide, and Diamond
Slack, G. A. (1964) · Journal of Applied Physics · doi:10.1063/1.1713251 · Cited by 695 · see citing works
High-field transport in wide-band-gap semiconductors
Ferry, D. K. (1975) · Physical review. B, Solid state · doi:10.1103/physrevb.12.2361 · Cited by 264 · see citing works
Saturated electron drift velocity in 6H silicon carbide
von Muench, W., & Pettenpaul, E. (1977) · Journal of Applied Physics · doi:10.1063/1.323506 · Cited by 139 · see citing works
Self-citationBreakdown field in vapor-grown silicon carbide p-n junctions
von Muench, W., & Pfaffeneder, I. (1977) · Journal of Applied Physics · doi:10.1063/1.323509 · Cited by 111 · see citing works
Silicon carbide bipolar transistor
von Münch, W., & Hoeck, P. (1978) · Solid-State Electronics · doi:10.1016/0038-1101(78)90283-6 · Cited by 67 · see citing works
Preparation of Pure and Doped Silicon Carbide by Pyrolysis of Silane Compounds
von Muench, W., & Pettenpaul, E. (1978) · Journal of The Electrochemical Society · doi:10.1149/1.2131431 · Cited by 46 · see citing works
Self-citationSilicon carbide blue-emitting diodes produced by liquid-phase epitaxy
von Münch, W., & Kürzinger, W. (1978) · Solid-State Electronics · doi:10.1016/0038-1101(78)90348-9 · Cited by 32 · see citing works
High-power IMPATT diodes on diamond heat sinks
Decker, D. R., & Schorr, A. J. (1970) · IEEE Transactions on Electron Devices · doi:10.1109/t-ed.1970.17066 · Cited by 15 · see citing works
Thermal resistance at metal/diamond interfaces in relation to the mounting of microwave diodes
Burgemeister, E. A. (1977) · Journal of Physics D Applied Physics · doi:10.1088/0022-3727/10/14/008 · Cited by 10 · see citing works
Self-citation
Flagged first, then by citations
Cited by
Sorted by citations
SiC devices: physics and numerical simulation
Ruff, M., Mitlehner, H., & Helbig, R. (1994) · IEEE Transactions on Electron Devices · doi:10.1109/16.293319 · Cited by 509 · see citing works
High Lattice Thermal Conductivity Solids
Morelli, D. T., & Slack, G. A. (2006) · Springer eBooks · doi:10.1007/0-387-25100-6_2 · Cited by 483 · see citing works
Davis, R. F., Kelner, G., Shur, M. S., Palmour, J. W., & Edmond, J. A. (1991) · Proceedings of the IEEE · doi:10.1109/5.90132 · Cited by 407 · see citing works
Thermal Boundary Resistance Between GaN and Substrate in AlGaN/GaN Electronic Devices
Sarua, A., Ji, H., Hilton, K. P., Wallis, D. J., Uren, M. J., Martin, T., & Kuball, M. (2007) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.908874 · Cited by 305 · see citing works
SiC materials-progress, status, and potential roadblocks
Powell, A. R., & Rowland, L. B. (2002) · Proceedings of the IEEE · doi:10.1109/jproc.2002.1021560 · Cited by 236 · see citing works
Nitrogen donors in 4H-silicon carbide
Götz, W., Schöner, A., Pensl, G., Suttrop, W., Choyke, W. J., Stein, R. A., & Leibenzeder, S. (1993) · Journal of Applied Physics · doi:10.1063/1.352983 · Cited by 206 · see citing works
Zheng, Q., Li, C., Rai, A., Leach, J. H., Broido, D. A., & Cahill, D. G. (2019) · Physical Review Materials · doi:10.1103/physrevmaterials.3.014601 · Cited by 177 · see citing works
Qian, X., Jiang, P., & Yang, R. (2017) · Materials Today Physics · doi:10.1016/j.mtphys.2017.12.005 · Cited by 174 · see citing works
Universal phonon mean free path spectra in crystalline semiconductors at high temperature
Freedman, J. P., Leach, J. H., Preble, E. A., Sitar, Z., Davis, R. F., & Malen, J. A. (2013) · Scientific Reports · doi:10.1038/srep02963 · Cited by 171 · see citing works
Thin films and devices of diamond, silicon carbide and gallium nitride
Davis, R. F. (1993) · Physica B Condensed Matter · doi:10.1016/0921-4526(93)90210-w · Cited by 139 · see citing works
Accurate Temperature Estimation of SiC Power mosfets Under Extreme Operating Conditions
Tsibizov, A., Kovacevic-Badstuebner, I., Kakarla, B., & Großner, U. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2917221 · Cited by 135 · see citing works
Phonon scattering in strained transition layers for GaN heteroepitaxy
Cho, J., Li, Y., Hoke, W. E., Altman, D. H., Asheghi, M., & Goodson, K. E. (2014) · Physical Review B · doi:10.1103/physrevb.89.115301 · Cited by 128 · see citing works
Heller, E. R., & Crespo, A. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.01.090 · Cited by 118 · see citing works
Channel Temperature Analysis of GaN HEMTs With Nonlinear Thermal Conductivity
Darwish, A. M., Bayba, A. J., & Hung, H.-L. A. (2015) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2015.2396035 · Cited by 111 · see citing works
Low Thermal Resistances at GaN–SiC Interfaces for HEMT Technology
Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., & Goodson, K. E. (2012) · IEEE Electron Device Letters · doi:10.1109/led.2011.2181481 · Cited by 109 · see citing works
Thermometry of AlGaN/GaN HEMTs Using Multispectral Raman Features
Choi, S., Heller, E. R., Dorsey, D. L., Vetury, R., & Graham, S. L. (2013) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2013.2255102 · Cited by 104 · see citing works
Au–Sn bonding material for the assembly of power integrated circuit module
Zhu, Z. X., Li, C. C., Liao, L. L., Liu, C. K., & Kao, C. R. (2016) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2016.02.065 · Cited by 101 · see citing works
Kong, H., Glass, J. T., & Davis, R. F. (1989) · Journal of materials research/Pratt's guide to venture capital sources · doi:10.1557/jmr.1989.0204 · Cited by 95 · see citing works
Thermal conductivity of liquid phase sintered silicon carbide
Sigl, L. S. (2003) · Journal of the European Ceramic Society · doi:10.1016/s0955-2219(02)00271-6 · Cited by 93 · see citing works
Phonon thermal transport in 2H, 4H and 6H silicon carbide from first principles
Protik, N. H., Katre, A., Lindsay, L., Carrete, J., Mingo, N., & Broido, D. (2017) · Materials Today Physics · doi:10.1016/j.mtphys.2017.05.004 · Cited by 90 · see citing works
NEAR-JUNCTION THERMAL MANAGEMENT: THERMAL CONDUCTION IN GALLIUM NITRIDE COMPOSITE SUBSTRATES
Cho, J., Li, Z., Asheghi, M., & Goodson, K. E. (2015) · Annual Reviews of Heat Transfer · doi:10.1615/annualrevheattransfer.2015011335 · Cited by 87 · see citing works
Pelletier, J., Gervais, D., & Pomot, C. (1984) · Journal of Applied Physics · doi:10.1063/1.333156 · Cited by 79 · see citing works
Bagnall, K. R., Moore, E. A., Bǎdescu, Ş. C., Zhang, L., & Wang, E. N. (2017) · Review of Scientific Instruments · doi:10.1063/1.5010225 · Cited by 78 · see citing works
Heteroepitaxial growth of β-Ga2O3 films on SiC via molecular beam epitaxy
Nepal, N., Katzer, D. S., Downey, B. P., Wheeler, V. D., Nyakiti, L. O., Storm, D. F., Hardy, M. T., Freitas, J. A., Jin, E. N., Vaca, D., et al. (2020) · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · doi:10.1116/6.0000452 · Cited by 77 · see citing works
Epitaxial growth of β-SiC thin films on 6H α-SiC substrates via chemical vapor deposition
Kong, H., Glass, J. T., & Davis, R. F. (1986) · Applied Physics Letters · doi:10.1063/1.97479 · Cited by 76 · see citing works
VO2‐Based Reconfigurable Antenna Platform with Addressable Microheater Matrix
Gerislioglu, B., Ahmadivand, A., Karabiyik, M., Sinha, R., & Pala, N. (2017) · Advanced Electronic Materials · doi:10.1002/aelm.201700170 · Cited by 75 · see citing works
Silicon carbide for power devices
Palmour, J. W., Singh, R., Glass, R. C., Kordina, O., & Carter, C. H., Jr. (2002) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd.1997.601423 · Cited by 74 · see citing works
Experimental Characterization of the Thermal Time Constants of GaN HEMTs Via Micro-Raman Thermometry
Bagnall, K. R., Saadat, O. I., Joglekar, S. J., Palacios, T., & Wang, E. N. (2017) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2017.2679978 · Cited by 61 · see citing works
Tan, T.-H., & Yan, J. (2016) · Acta Materialia · doi:10.1016/j.actamat.2016.10.045 · Cited by 60 · see citing works
Paskova, T., Slomski, M., Leach, J. H., Muth, J. F., & Paskova, T. (2017) · AIP Advances · doi:10.1063/1.4989626 · Cited by 57 · see citing works
Effect of additives on the thermal conductivity of zirconium diboride based composites – A review
Guria, J. F., Bansal, A., & Kumar, V. (2020) · Journal of the European Ceramic Society · doi:10.1016/j.jeurceramsoc.2020.08.051 · Cited by 56 · see citing works
Effects of Elemental Additives on Electrical Resistivity of Silicon Carbide Ceramics
Takeda, Y., Nakamura, K., MAEDA, K., & Matsushita, Y. (1987) · Journal of the American Ceramic Society · doi:10.1111/j.1151-2916.1987.tb04895.x · Cited by 55 · see citing works
Santhosh, B., Ionescu, E., Andreolli, F., Biesuz, M., Reitz, A., Albert, B., & Sorarù, G. D. (2020) · Journal of the European Ceramic Society · doi:10.1016/j.jeurceramsoc.2020.09.028 · Cited by 54 · see citing works
Aw, M. S., Zorko, M., Djinović, P., & Pintar, A. (2014) · Applied Catalysis B: Environmental · doi:10.1016/j.apcatb.2014.09.012 · Cited by 53 · see citing works
Thermal Conductivity of SiC Calculated by Molecular Dynamics
Kawamura, T., Hori, D., Kangawa, Y., Kakimoto, K., Yoshimura, M., & Mori, Y. (2008) · Japanese Journal of Applied Physics · doi:10.1143/jjap.47.8898 · Cited by 52 · see citing works
Modeling nonlinear electromechanical behavior of shocked silicon carbide
Clayton, J. D. (2010) · Journal of Applied Physics · doi:10.1063/1.3277030 · Cited by 50 · see citing works
Chapter 1 Materials Properties and Characterization of SiC
Järrendahl, K., & Davis, R. F. (1998) · Semiconductors and semimetals · doi:10.1016/s0080-8784(08)62843-4 · Cited by 50 · see citing works
Kong, H., Wang, Y. C., Glass, J. T., & Davis, R. F. (1988) · Journal of materials research/Pratt's guide to venture capital sources · doi:10.1557/jmr.1988.0521 · Cited by 48 · see citing works
Progress in the industrial production of SiC substrates for semiconductor devices
Müller, S. G., Glass, R. C., Hobgood, H. M., Tsvetkov, V. F., Brady, M. F., Henshall, D., Malta, D. M., Singh, R., Palmour, J. W., & Carter, C. H., Jr. (2001) · Materials Science and Engineering B · doi:10.1016/s0921-5107(00)00658-9 · Cited by 46 · see citing works
Kong, H., Palmour, J. W., Glass, J. T., & Davis, R. F. (1987) · Applied Physics Letters · doi:10.1063/1.98416 · Cited by 46 · see citing works
Davis, R. F. (1989) · Thin Solid Films · doi:10.1016/0040-6090(89)90468-9 · Cited by 44 · see citing works
Growth and microhardness of SiC films by plasma-enhanced chemical vapor deposition
Seo, J., Yoon, S.-Y., Niihara, K., & Kim, K. H. (2002) · Thin Solid Films · doi:10.1016/s0040-6090(02)00061-5 · Cited by 43 · see citing works
Carbon-mediated effects in silicon and in silicon-related materials
Skorupa, W., & Yankov, R. A. (1996) · Materials Chemistry and Physics · doi:10.1016/0254-0584(95)01673-i · Cited by 42 · see citing works
Phonon-electron scattering in single crystal silicon carbide
Morelli, D. T., Heremans, J. P., Beetz, C. P., Yoo, W. S., & Matsunami, H. (1993) · Applied Physics Letters · doi:10.1063/1.110229 · Cited by 41 · see citing works
Tsibidis, G. D., Mouchliadis, L., Pedio, M., & Stratakis, E. I. (2020) · Physical review. B./Physical review. B · doi:10.1103/physrevb.101.075207 · Cited by 38 · see citing works
Siddiqua, P., Hadi, W. A., Shur, M. S., & O’Leary, S. K. (2015) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-015-3055-7 · Cited by 38 · see citing works
Bae, D. G., Mandel, R. K., Dessiatoun, S. V., Rajgopal, S., Roberts, S. P., Mehregany, M., & Ohadi, M. M. (2017) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2017.7992511 · Cited by 38 · see citing works
Solidification of particle-reinforced metal-matrix composites
Hanumanth, G. S., & Irons, G. A. (1996) · Metallurgical and Materials Transactions B · doi:10.1007/bf02915665 · Cited by 38 · see citing works
Transient stress characterization of AlGaN/GaN HEMTs due to electrical and thermal effects
Jones, J. P., Heller, E. R., Dorsey, D. L., & Graham, S. L. (2015) · Microelectronics Reliability · doi:10.1016/j.microrel.2015.08.019 · Cited by 37 · see citing works
Zheng, Y., Swinnich, E., & Seo, J. (2020) · ECS Journal of Solid State Science and Technology · doi:10.1149/2162-8777/ab981e · Cited by 36 · see citing works
Theory of Thermal Time Constants in GaN High-Electron-Mobility Transistors
Bagnall, K. R., & Wang, E. N. (2017) · IEEE Transactions on Components Packaging and Manufacturing Technology · doi:10.1109/tcpmt.2017.2773065 · Cited by 34 · see citing works
Kim, H. J., & Davis, R. F. (1986) · Journal of Applied Physics · doi:10.1063/1.337075 · Cited by 34 · see citing works
Thermal Conductivity of ZrB2and HfB2
Harrington, G. J. K., & Hilmas, G. E. (2014) · doi:10.1002/9781118700853.ch9 · Cited by 34 · see citing works
Takeda, Y., Nakamura, K., MAEDA, K., & Ura, M. (1986) · Advanced Ceramic Materials · doi:10.1111/j.1551-2916.1986.tb00009.x · Cited by 32 · see citing works
Thermal conductivity of ultra-wide bandgap thin layers – High Al-content AlGaN and β-Ga2O3
Tran, D. Q., Blumenschein, N. A., Mock, A. L., Sukkaew, P., Zhang, H., Muth, J. F., Paskova, T., Paskova, T., & Darakchieva, V. (2019) · Physica B Condensed Matter · doi:10.1016/j.physb.2019.411810 · Cited by 31 · see citing works
The role of optical phonons in intermediate layer-mediated thermal transport across solid interfaces
Lee, E., & Luo, T. (2017) · Physical Chemistry Chemical Physics · doi:10.1039/c7cp02982a · Cited by 30 · see citing works
Matsutani, T., Asanuma, T., Liu, C., Kiuchi, M., & Takeuchi, T. (2003) · Surface and Coatings Technology · doi:10.1016/s0257-8972(03)00130-0 · Cited by 30 · see citing works
Layer-by-layer growth of SiC at low temperatures
Sumakeris, J. J., Rowland, L. B., Kern, R. S., Tanaka, S., & Davis, R. F. (1993) · Thin Solid Films · doi:10.1016/0040-6090(93)90158-l · Cited by 30 · see citing works
Electronic and atomic structure of the 6H−SiC(0001¯) surface studied by ARPES, LEED, and XPS
Hollering, M., Bernhardt, J., Schardt, J., Ziegler, A., Graupner, R., Mattern, B., Stampfl, A. P. J., Starke, U., Heinz, K., & Ley, L. (1998) · Physical review. B, Condensed matter · doi:10.1103/physrevb.58.4992 · Cited by 30 · see citing works
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Pearson, R., Chatterjee, B., Kim, S. H., Graham, S. L., Rattner, A. S., & Choi, S. (2020) · Journal of Electronic Packaging · doi:10.1115/1.4046620 · Cited by 29 · see citing works
Chowdhury, M. A. R., Wang, K., Jia, Y., & Xu, C. (2019) · Journal of the American Ceramic Society · doi:10.1111/jace.16961 · Cited by 29 · see citing works
Thermal Characterization of SiC Amorphous Thin Films
Jeong, T., Zhu, J., Mao, S., Pan, T., & Tang, Y. (2012) · International Journal of Thermophysics · doi:10.1007/s10765-012-1193-1 · Cited by 29 · see citing works
Zhang, R., Zhao, W., Yin, W., Zhao, Z. G., & Zhou, H. (2014) · Diamond and Related Materials · doi:10.1016/j.diamond.2014.12.001 · Cited by 28 · see citing works
On the Substrate Thermal Optimization in SiC-Based Backside-Mounted High-Power GaN FETs
Cappelluti, F., Furno, M., Angelini, A., Bonani, F., Pirola, M., & Ghione, G. (2007) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2007.899380 · Cited by 27 · see citing works
Analysis of silicon carbide power device performance
Bhatnagar, M., & Baliga, B. J. (2002) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/ispsd.1991.146093 · Cited by 27 · see citing works
Microwave and millimeter-wave power generation in silicon carbide avalanche devices
Mehdi, I., Haddad, G. I., & Mains, R. K. (1988) · Journal of Applied Physics · doi:10.1063/1.341829 · Cited by 27 · see citing works
Nanostructures on SiC surface created by laser microablation
Fedorenko, L. L., Medvid', A., Yusupov, M., Yukhimchuck, V., Krylyuk, S. G., & Еvtukh, А. А. (2007) · Applied Surface Science · doi:10.1016/j.apsusc.2007.08.048 · Cited by 25 · see citing works
Analysis of the thermal behavior of AlGaN/GaN HEMTs
Russo, S., d’Alessandro, V., Costagliola, M., Sasso, G., & Rinaldi, N. (2012) · Materials Science and Engineering B · doi:10.1016/j.mseb.2012.03.024 · Cited by 25 · see citing works
Sane, A. R., Nigay, P., Minh, D. P., Toussaint, C., Germeau, A., Semlal, N., Boulif, R., & Nzihou, A. (2019) · Journal of Thermal Analysis and Calorimetry · doi:10.1007/s10973-019-08964-5 · Cited by 24 · see citing works
Darwish, A. M., Bayba, A. J., Khorshid, A., Rajaie, A., & Hung, H. A. (2012) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2012.2200040 · Cited by 22 · see citing works
Davis, R. F., Palmour, J. W., & Edmond, J. A. (1992) · Diamond and Related Materials · doi:10.1016/0925-9635(92)90009-d · Cited by 22 · see citing works
Goni, M., Patelka, M., Ikeda, S., Sato, T., & Schmidt, A. J. (2018) · Review of Scientific Instruments · doi:10.1063/1.5025173 · Cited by 21 · see citing works
Sun, Z., Yuan, K., Zhang, X., & Tang, D. (2019) · Physical Chemistry Chemical Physics · doi:10.1039/c8cp07516f · Cited by 21 · see citing works
Investigation on thermo-mechanical responses in high power multi-finger AlGaN/GaN HEMTs
Zhang, R., Zhao, W., & Yin, W. (2013) · Microelectronics Reliability · doi:10.1016/j.microrel.2013.10.017 · Cited by 20 · see citing works
Zhang, B., Fan, Z., Zhao, C., & Gu, X. (2021) · Journal of Physics Condensed Matter · doi:10.1088/1361-648x/ac268d · Cited by 19 · see citing works
Heller, E. R. (2008) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2008.2003220 · Cited by 19 · see citing works
Thermal Transport in Superlattice Castellated Field Effect Transistors
Middleton, C., Dalcanale, S., Pomeroy, J. W., Uren, M. J., Chang, J., Parke, J. A., Wathuthanthri, I., Nagamatsu, K. A., Saluru, S., Gupta, S., et al. (2019) · IEEE Electron Device Letters · doi:10.1109/led.2019.2929424 · Cited by 17 · see citing works
Electron transport within the wurtzite and zinc-blende phases of gallium nitride and indium nitride
Siddiqua, P., & O’Leary, S. K. (2018) · Journal of Materials Science Materials in Electronics · doi:10.1007/s10854-017-8324-1 · Cited by 17 · see citing works
Equations for electrical and electrothermal simulation of anisotropic semiconductors
Lindefelt, U. (1994) · Journal of Applied Physics · doi:10.1063/1.357368 · Cited by 17 · see citing works
High-Efficiency GaN Frequency Doubler Based on Thermal Resistance Analysis for Continuous Wave Input
Dong, Y., Liang, H., Liang, S., Zhou, H., Yu, J., Guo, H., Zeng, H., Feng, Z., & Zhang, Y. (2023) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2023.3294897 · Cited by 16 · see citing works
A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs
Azarifar, M., & Donmezer, F. N. (2017) · Microelectronics Reliability · doi:10.1016/j.microrel.2017.05.020 · Cited by 16 · see citing works
Powell, A., Jenny, J. R., Müller, S. G., Hobgood, H. M., Tsvetkov, V. F., LENOARD, R., & Carter, C. H., Jr. (2006) · International Journal of High Speed Electronics and Systems · doi:10.1142/s0129156406004016 · Cited by 16 · see citing works
d’Alessandro, V., Catalano, A. P., Scognamillo, C., Müller, M. A., Schröter, M., Zampardi, P. J., & Codecasa, L. (2022) · Energies · doi:10.3390/en15155457 · Cited by 15 · see citing works
Alleviation of Self-Heating Effect in Top-Gated Ultrathin In2O3 FETs Using a Thermal Adhesion Layer
Liao, P.-Y., Khot, K., Alajlouni, S., Snure, M., Noh, J., Si, M., Zhang, Z., Shakouri, A., Ruan, X., & Ye, P. D. (2022) · IEEE Transactions on Electron Devices · doi:10.1109/ted.2022.3221358 · Cited by 15 · see citing works
β-SiC Thin film growth using microwave plasma activated CH4-SiH4 sources
Kim, H. S., Park, Y. J., Choi, I. H., & Baik, Y. (1999) · Thin Solid Films · doi:10.1016/s0040-6090(98)01538-7 · Cited by 15 · see citing works
Near-junction “hot spot” suppression with integral SiC microcontact TEC
Manno, M., Yang, B., & Bar‐Cohen, A. (2017) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2017.07.081 · Cited by 14 · see citing works
Thermoelectric Properties of Single-Crystalline SiC and Dense Sintered SiC for Self-Cooling Devices
Fukuda, S., Kato, T., Okamoto, Y., Nakatsugawa, H., Kitagawa, H., & Yamaguchi, S. (2011) · Japanese Journal of Applied Physics · doi:10.1143/jjap.50.031301 · Cited by 14 · see citing works
High heat flux cooling solutions for thermal management of high power density gallium nitride HEMT
Bhunia, A., Boutros, K. S., & Chen, C.-L. (2004) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2004.1318255 · Cited by 14 · see citing works
Vallejo, J. P., Febrero-Garrido, L., Cacabelos, A., González-Gil, A., & Lugo, L. (2023) · Powder Technology · doi:10.1016/j.powtec.2023.119299 · Cited by 13 · see citing works
A simplified method of measuring thermal conductivity of β-Ga 2 O 3 nanomembrane
Zheng, Y., & Seo, J. (2020) · Nano Express · doi:10.1088/2632-959x/abc1c4 · Cited by 12 · see citing works
A Numerical Investigation of Heat Suppression in HEMT for Power Electronics Application
Arivazhagan, L., Nirmal, D., Reddy, P. P. K., Ajayan, J., Godfrey, D., Prajoon, P., & Ray, A. K. (2020) · Silicon · doi:10.1007/s12633-020-00647-3 · Cited by 12 · see citing works
Charge transport in silicon carbide: Atomic and microscopic effects
Schroeder, A., Pelster, R., Grunow, V., Lennartz, W., Nimtz, G., & Friederich, K. M. (1996) · Journal of Applied Physics · doi:10.1063/1.363054 · Cited by 12 · see citing works
Electrothermal analysis of SiC power devices using physically-based device simulation
Lades, M., & Wachutka, G. (2000) · Solid-State Electronics · doi:10.1016/s0038-1101(99)00243-9 · Cited by 12 · see citing works
Joshi, R. P., Pathak, S., & McAdoo, J. A. (1995) · Journal of Applied Physics · doi:10.1063/1.359982 · Cited by 12 · see citing works
Pędrak, P., Drajewicz, M., Dychtoń, K., & Nowotnik, A. (2016) · Journal of Thermal Analysis and Calorimetry · doi:10.1007/s10973-016-5608-2 · Cited by 11 · see citing works
Electrical contact resistance and its relationship to hardness
Wieczorek, L., Howes, V. R., & Goldsmid, H. J. (1986) · Journal of Materials Science · doi:10.1007/bf00553283 · Cited by 11 · see citing works
Chen, B., Huang, Y., Tang, S., Liu, W., & Ma, Y. (2021) · Journal of Materials Research and Technology · doi:10.1016/j.jmrt.2021.06.100 · Cited by 10 · see citing works
Thermal properties of AlGaN/GaN high electron mobility transistors on 4H and 6H SiC substrates
Killat, N., Pomeroy, J. W., Jimenez, J. L., & Kuball, M. (2014) · physica status solidi (a) · doi:10.1002/pssa.201431440 · Cited by 10 · see citing works
Optimizing GaN-on-Diamond Transistor Geometry for Maximum Output Power
Pomeroy, J. W., & Kuball, M. (2014) · Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium · doi:10.1109/csics.2014.6978572 · Cited by 10 · see citing works
Tuning the spectral emittance of α-SiC open-cell foams up to 1300 K with their macro porosity
Rousseau, B., Guévelou, S., Monthe, A. M., Vicente, J., del Campo, L., Meneses, D. D. S., Echégut, P., Caliot, C., & Flamant, G. (2016) · AIP Advances · doi:10.1063/1.4955142 · Cited by 9 · see citing works
- Authors
- Burgemeister, E. A., von Muench, W., & Pettenpaul, E.
- Affiliations
- D. Drukker Zn N.V., Sarphatikade 12, Amsterdam, The Netherlands
- Institut fuer Halbleitertechnik, Breitscheidstrasse 2, D-7000 Stuttgart, Germany
- Siemens (Germany) (DE)
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 1979-09-01
- Volume
- 50
- Issue
- 9
- Pages
- 5790-5794
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W2047210737
- Cited by
- 168
- References
- 10
- Citations by year
- 2026: 6 · 2025: 3 · 2024: 5 · 2023: 7 · 2022: 7 · 2021: 3 · 2020: 11 · 2019: 11 · 2018: 2 · 2017: 12 · 2016: 5 · 2015: 7 · 2014: 7 · 2013: 5 · 2012: 5
- FWCI
- 0.00
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Journal of Applied Physics (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Materials Science › Materials Chemistry › Advanced Thermoelectric Materials and Devices
- Keywords
- 6H-SiC, thermal conductivity, electrical properties, radiation thermometry, carrier concentration, temperature dependence, anisotropy, low-temperature electrical transport
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review