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Characterization of thin metal films via frequency-domain thermoreflectance
Abstract
Frequency-domain thermoreflectance is extended to the characterization of thin metals films on low thermal diffusivity substrates. We show how a single noncontact measurement can yield both the thickness and thermal conductivity of a thin metal film with high accuracy. Results are presented from measurements of gold and aluminum films 20–100 nm thick on fused silica substrate. The thickness measurements are verified independently with atomic force microscope cross sections, and the thermal conductivity measurements are verified through electrical conductivity measurements via the Wiedemann–Franz law. The thermoreflectance thermal conductivity values are in good agreement with the Wiedemann–Franz results for all the films at least 30 nm thick, indicating that our method can be used to estimate electrical conductivity along with thermal conductivity for sufficiently thick films.
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The technique has recently been further developed for measuring anisotropic thermal conductivity of thin films and probing spectral phonon transport.
“This technique has recently been further developed over the last few years for measuring anisotropic thermal conductivity of thin films [97][98][99] and probing spectral phonon transport [100-103].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [97]
When FDTR is implemented using CW lasers, the thermoreflectance signal is directly proportional to the single frequency response H(ω0).
“When an FDTR system is implemented using CW lasers, the thermoreflectance signal is instead directly proportional to single frequency response 𝐻(𝜔 0 ) [97,113,114]:”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [97]
A low thermal conductivity substrate can be used to further improve sensitivity to the in-plane thermal conductivity of the thin film.
“A low thermal conductivity substrate can be used to further improve the sensitivity to the in-plane thermal conductivity of the thin film [97,99,116].”
From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [97]
Citations
Cites
Schmidt, A. J., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.3006335 · Cited by 655
Self-citationA frequency-domain thermoreflectance method for the characterization of thermal properties
Schmidt, A. J., Cheaito, R., & Chiesa, M. (2009) · Review of Scientific Instruments · doi:10.1063/1.3212673 · Cited by 543
Self-citationCapinski, W. S., Maris, H. J., Ruf, T., Cardona, M., Ploog, K., & Katzer, D. S. (1999) · Physical Review B · doi:10.1103/physrevb.59.8105 · Cited by 471
An optical pump-probe technique for measuring the thermal conductivity of liquids
Schmidt, A., Chiesa, M., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.2937458 · Cited by 184
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Kim, S., Du, C., Sheridan, P., Ma, W., Choi, S., & Lu, W. D. (2015) · Nano Letters · doi:10.1021/acs.nanolett.5b00697 · Cited by 603
Zhao, D., Qian, X., Gu, X., Jajja, S. A., & Yang, R. (2016) · Journal of Electronic Packaging · doi:10.1115/1.4034605 · Cited by 559
Zhu, J., Tang, D., Wang, W., Liu, J., Holub, K. W., & Yang, R. (2010) · Journal of Applied Physics · doi:10.1063/1.3504213 · Cited by 232
Zheng, Q., Braun, P. V., & Cahill, D. G. (2016) · Advanced Materials Interfaces · doi:10.1002/admi.201600234 · Cited by 51
Modeling optical absorption for thermoreflectance measurements
Yang, J., Ziade, E., & Schmidt, A. J. (2016) · Journal of Applied Physics · doi:10.1063/1.4943176 · Cited by 37
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Metadata
- Authors
- Schmidt, A. J., Cheaito, R., & Chiesa, M.
- Affiliations
- Massachusetts Institute of Technology 1 Department of Mechanical Engineering, Cambridge, Massachusetts, USA
- Masdar Institute of Science and Technology 2 Department of Mechanical Engineering, , Abu Dhabi, United Arab Emirates
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 2010-01-15
- Volume
- 107
- Issue
- 2
- ISSN
- 0021-8979
- 1089-7550
- Cited by
- 156
- References
- 4
- Language
- en
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