Trapping and trap creation studies on nitrided and reoxidized-nitrided silicon dioxide films on silicon
Abstract
Alternative gate insulators for silicon-based technologies involving nitridation or reoxidation-nitridation of silicon dioxide layers are shown to be inferior to as-grown oxide in terms of charge trapping over a wide range of fields under uniform electron-injection conditions. Although nitrided layers seem to suppress trap generation more effectively than does silicon dioxide, background trapping in the as-fabricated oxynitride layers formed near their interfaces is greatly increased. The apparent reduction in trapped charges universally reported in reoxidized-nitrided oxides under high-field injection conditions is shown to be due to a decrease in occupation of these sites at fields exceeding 8 MV/cm.
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- Authors
- DiMaria, D. J., & Stathis, J. H.
- Affiliations
- IBM Research - Thomas J. Watson Research Center (US)
- ORCID
- Stathis, J. H.
- Venue
- Journal of Applied Physics
- Publisher
- AIP Publishing
- Published
- 1991-08-01
- Volume
- 70
- Issue
- 3
- Pages
- 1500-1509
- ISSN
- 0021-8979 (ISSN-L)
- 1089-7550
- OpenAlex
- W1986207778
- Cited by
- 111
- References
- 46
- Citations by year
- 2019: 2 · 2018: 1 · 2017: 1 · 2014: 2 · 2013: 4 · 2012: 2
- FWCI
- 10.21
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Journal of Applied Physics (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
- Physical Sciences › Physics and Astronomy › Atomic and Molecular Physics, and Optics › Semiconductor materials and interfaces
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Ferroelectric and Negative Capacitance Devices
- Keywords
- charge trapping, SiO2 thin films, gate dielectric, electron injection, trap generation, Si/SiO2 interface
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