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The DOI matches its Crossref record; 4 of the 4 references it cites were found in a registry or an index.

Thermal conductance imaging of graphene contacts

Yang, Jia, Ziade, Elbara, Maragliano, Carlo, Crowder, Robert, Wang, Xuanye, Stefancich, Marco, Chiesa, Matteo, Swan, Anna K., Schmidt, Aaron J.·2014·Journal of Applied Physics
DOI 10.1063/1.4889928
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Abstract

Suspended graphene has the highest measured thermal conductivity of any material at room temperature. However, when graphene is supported by a substrate or encased between two materials, basal-plane heat transfer is suppressed by phonon interactions at the interfaces. We have used frequency domain thermoreflectance to create thermal conductance maps of graphene contacts, obtaining simultaneous measurements of the basal-plane thermal conductivity and cross-plane thermal boundary conductance for 1–7 graphitic layers encased between titanium and silicon dioxide. We find that the basal-plane thermal conductivity is similar to that of graphene supported on silicon dioxide. Our results have implications for heat transfer in two-dimensional material systems, and are relevant for applications such as graphene transistors and other nanoelectronic devices.

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Crossref · 10.1063/1.4889928

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4 of 4 references verified0 citation errors · 0 not checkable

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  • Transient thermoreflectance has been widely applied to explore thermal properties of novel materials ranging from low thermal conductivity ≤0.1 W/m·K of hybrid materials and fullerene derivatives to very high thermal conductivity such as graphene.

    “Transient thermoreflectance method has been widely applied to explore thermal properties of novel materials that ranging from low thermal conductivity of ≤ 0.1 W/m•K of hybrid materials [132,133] and fullerene derivatives [134,135], to very high thermal conductivity such as graphene [136].”

    From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [135]

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Metadata

Authors
Yang, J., Ziade, E., Maragliano, C., Crowder, R., Wang, X., Stefancich, M., Chiesa, M., Swan, A. K., & Schmidt, A. J.
Affiliations
  • Boston University 1 Department of Mechanical Engineering, , Boston, Massachusetts 02215, USA
  • Institute Center for Energy, Masdar Institute of Science and Technology 2 , Abu Dhabi, United Arab Emirates
  • Boston University 3 Department of Electrical and Computer Engineering, , Boston, Massachusetts 02215, USA
Venue
Journal of Applied Physics
Publisher
AIP Publishing
Published
2014-07-11
Volume
116
Issue
2
ISSN
  • 0021-8979
  • 1089-7550
DOI
10.1063/1.4889928
Cited by
85
References
4
Language
en

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