The DOI matches its Crossref record; 2 of the 2 references it cites were found in a registry or an index.
Optimum semiconductors for high-power electronics
Abstract
Elemental and compound semiconductors, including wide-bandgap semiconductors, are critically examined for high-power electronic applications in terms of several parameters. On the basis of an analysis applicable to a wide range of semiconducting materials and by using the available measured physical parameters, it is shown that wide-bandgap semiconductors such as SiC and diamond could offer significant advantages compared to either silicon or group III-V compound semiconductors for these applications. The analysis uses peak electric field strength at avalanche breakdown as a critical material parameter for evaluating the quality of a semiconducting material for high-power electronics. Theoretical calculations show improvement by orders of magnitude in the on-resistance, twentyfold improvement in the maximum frequency of operation, and potential for successful operation at temperatures beyond 600 degrees C for diamond high-power devices. New figures of merit for power-handling capability that emphasize electrical and thermal conductivities of the material are derived and are applied to various semiconducting materials. It is shown that an improvement in power-handling capabilities of semiconductor devices by three orders of magnitude is feasible by replacing silicon with silicon carbide; improvement in power-handling capability by six orders of magnitude is projected for diamond-based devices.>
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Cites
Physics of Semiconductor Devices
Sze, S. M., & Ng, K. K. (2006) · doi:10.1002/0470068329 · Cited by 14,627
Irreversibility and heat generation in the computing process
Landauer, R. (1961) · IBM Journal of Research and Development · doi:10.1147/rd.53.0183 · Cited by 4,980
Cited by
Comparison of 6H-SiC, 3C-SiC, and Si for power devices
Bhatnagar, M., & Baliga, B. J. (1993) · IEEE Transactions on Electron Devices · doi:10.1109/16.199372 · Cited by 1,120
Self-citationSilicon carbide benefits and advantages for power electronics circuits and systems
Elasser, A., & Chow, T. P. (2002) · Proceedings of the IEEE · doi:10.1109/jproc.2002.1021562 · Cited by 537
SiC devices: physics and numerical simulation
Ruff, M., Mitlehner, H., & Helbig, R. (1994) · IEEE Transactions on Electron Devices · doi:10.1109/16.293319 · Cited by 508
Reliability and performance limitations in SiC power devices
Singh, R. (2006) · Microelectronics Reliability · doi:10.1016/j.microrel.2005.10.013 · Cited by 284
Comparison of Wide-Bandgap Semiconductors for Power Electronics Applications
Ozpineci, B. (2004) · doi:10.2172/885849 · Cited by 186
Metadata
- Authors
- Shenai, K., Scott, R. S., & Baliga, B. J.
- Venue
- IEEE Transactions on Electron Devices
- Published
- 1989-09
- Volume
- 36
- Issue
- 9
- Pages
- 1811-1823
- ISSN
- 0018-9383 (ISSN-L)
- 1557-9646
- OpenAlex
- W1998370272
- Cited by
- 617
- References
- 2
- FWCI
- 13.19
- Type
- journal article
- Language
- en
- Open access
- closed
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- Shenai, K., Scott, R. S., & Baliga, B. J. (1989). Optimum semiconductors for high-power electronics. IEEE Transactions on Electron Devices. https://doi.org/10.1109/16.34247
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Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
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