IGBT module with user accessible on-chip current and temperature sensors
Abstract
This paper describes the characteristics of a new power module having user accessible on-chip temperature and current sensing features. Temperature sensing is accomplished by measuring the forward voltage drop of a string of diodes fabricated on the IGBT chip's surface. Current sensing is accomplished using a current mirror structure that diverts a small portion of the main emitter current to an auxiliary “sense” emitter. The on-chip sensing features are directly accessible to the end user enabling control and protection to be tailored to the specific needs of the intended application. The new module also features a unique transfer molded structure that is designed to function as a “known-good” building block for use in a wide range of power electronic assemblies.
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Junction temperature can be monitored directly by optical sensors and integrated on-chip sensors.
“Junction temperature can be monitored directly by optical sensors [80] and integrated on-chip sensors [81].”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [81]
Optical and integrated on-chip sensor techniques are considered invasive and expensive.
“However, these techniques are considered invasive and expensive.”
From AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters (2023) · cites this paper as [81]
Cites
Direct Beam Lead Bonding for Trench MOSFET & CSTBT
Narazaki, A. (2005) · doi:10.1109/ispsd.2005.1487954 · Cited by 13 · see citing works
Chip Improvements for Future IGBT Modules
Donlon, J. F., Motto, E. R., Takahashi, T., et al. (2008) · Conference record · doi:10.1109/08ias.2008.368 · Cited by 12 · see citing works
Self-citationSasaki, Takao, †., Shikano, et al. (2004) · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · doi:10.1109/wct.2004.239991 · Cited by 9 · see citing works
Wire-bonding-less Interconnection Technique for high current power modules
Sudo, S. (2004) · Medical Entomology and Zoology · Cited by 2 · see citing works
Flagged first, then by citations
Cited by
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Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
Wang, H., Liserre, M., Blaabjerg, F., de Place Rimmen, P., Jacobsen, J. B., Kvisgaard, T., & Landkildehus, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2290282 · Cited by 693 · see citing works
Hanif, A., Yu, Y., DeVoto, D., & Khan, F. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2860587 · Cited by 272 · see citing works
Evaluation of Aging's Effect on Temperature-Sensitive Electrical Parameters in SiC mosfets
Yang, F., Ugur, E., & Akin, B. (2020) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2019.2950311 · Cited by 121 · see citing works
AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works
“Junction temperature can be monitored directly by optical sensors [80] and integrated on-chip sensors [81].”
Background
- Authors
- Motto, E. R., & Donlon, J. F.
- Venue
- 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC)
- Publisher
- IEEE
- Published
- 2012-02
- Pages
- 176-181
- ISSN
- 1048-2334 (ISSN-L)
- OpenAlex
- W2128134943
- Cited by
- 92
- References
- 4
- Citations by year
- 2026: 4 · 2025: 8 · 2024: 10 · 2023: 10 · 2022: 5 · 2021: 7 · 2020: 9 · 2019: 7 · 2018: 7 · 2017: 7 · 2016: 6 · 2015: 6 · 2014: 4 · 2013: 2
- FWCI
- 4.89
- Type
- conference paper
- Language
- en
- Open access
- closed
- Locations
- Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition (publishedVersion)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Magnetic Field Sensors Techniques
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Electrical and Thermal Properties of Materials
- Keywords
- IGBT modules, on-chip temperature sensing, current mirror, transfer molding, power electronics packaging
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