Cited by 7Neuroscience and Neural EngineeringAnalog and Mixed-Signal Circuit DesignWireless Body Area Networks

Integrated neural interfaces

Open access
Walker, Ross M., Rieth, Loren, Iyer, Subramanian S., Bajwa, Adeel A., Silver, Jason, Ahmed, Taufiq, Tasneem, Naila, Sharma, Mohit +1 more·2017·2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)

Abstract

Electronic interfaces to the nervous system are increasingly important for experimental neuroscience as well as medical diagnostics and therapies. Existing neural interfaces are limited, however, by the use of passive recording and stimulation devices that are connected to active electronics on separate physical platforms through large amounts of passive wiring. This manuscript proposes a new approach to integrate active electronics directly with neural recording and stimulation devices using state-of-the-art silicon processing, assembly, and packaging techniques. System concepts are described for fully wireless operation as well as wireline interfacing through FDA-cleared implantable leads and connectors. The approach offers a more modular paradigm of neural interface design, which is greatly needed as the demand for higher channel counts grows.

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Integrity signals

Registry

Crossref · 10.1109/mwscas.2017.8053106

Cites

29 of 29 references verified0 citation errors · 0 not checkable

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  • Techniques such as micro-rivet bonding and flip-chip bonding have been under development to enable scalable interface solutions with increased electrode density and improved electrical performance.

    “With the increase of active interface systems that aim to increase electrode density and improve electrical performance, techniques such as micro-rivet bonding and flip-chip bonding have been under development to enable scalable interface solutions [210], [211].”

    From Active Neural Interface Circuits and Systems for Selective Control of Peripheral Nerves: A Review (2024) · cites this paper as [210]

    In “A. Architecture and Physical Integration” (page not available), the paper describes thermal-compression flip-chip bonding to integrate Chiplets with a microelectrode array, with low-parasitic routing. The Introduction and Conclusions present this approach as a way to scale neural interfaces. Our copy does not mention micro-rivet bonding, so it supports only the flip-chip part of the cited claim. (LLM, conf=0.88)

    Experimental — accuracy not yet measured

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Cites

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Research works printed but not linked: 2

  1. C. M. Lopez, S. Mitra, et al., "A 966-electrode neural probe with 384 configurable channels in 0.13μm SOI CMOS," ISSCC, pp. 392-394, Jan. 2016.
  2. P. Tathireddy, A. Sharma, et al., "Silicon lid for encapsulation of electronics on implantable systems," Nanotech Conf. Expo, Anaheim, CA, 2010.

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Authors
Walker, R. M., Rieth, L., Iyer, S. S., Bajwa, A. A., Silver, J., Ahmed, T., Tasneem, N., Sharma, M., & Gardner, A. T.
Affiliations
  • University of Utah (US)
  • University of California, Los Angeles (US)
Venue
2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)
Publisher
IEEE
Published
2017-08
Pages
1045-1048
ISSN
1548-3746 (ISSN-L)
OpenAlex
W2758792587
Cited by
7
References
29
Citations by year
2025: 1 · 2024: 1 · 2023: 1 · 2021: 1 · 2019: 1 · 2018: 2
FWCI
3.20
Type
conference paper
Language
en
Open access
Locations
  • IEEE International Midwest Symposium on Circuits and Systems (MWSCAS) (publishedVersion)
  • eScholarship (California Digital Library) (submittedVersion)
Topics
  • Life Sciences › Neuroscience › Cellular and Molecular Neuroscience › Neuroscience and Neural Engineering
  • Physical Sciences › Engineering › Biomedical Engineering › Analog and Mixed-Signal Circuit Design
  • Physical Sciences › Engineering › Biomedical Engineering › Wireless Body Area Networks
Keywords
neural interfaces, neural recording, neurostimulation

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