The DOI matches its Crossref record; 31 of the 31 references it cites were found in a registry or an index.
Complete Loss and Thermal Model of Power Semiconductors Including Device Rating Information
Open accessAbstract
Thermal loading of power devices are closely related to the reliability performance of the whole converter system. The electrical loading and device rating are both important factors that determine the loss and thermal behaviors of power semiconductor devices. In the existing loss and thermal models, only the electrical loadings are focused and treated as design variables, while the device rating is normally predefined by experience with limited design flexibility. Consequently, a more complete loss and thermal model is proposed in this paper, which takes into account not only the electrical loading but also the device rating as input variables. The quantified correlation between the power loss, thermal impedance, and silicon area of insulated gate bipolar transistor (IGBT) is mathematically established. By this new modeling approach, all factors that have impacts to the loss and thermal profiles of the power devices can accurately be mapped, enabling more design freedom to optimize the efficiency and thermal loading of the power converter. The proposed model can be further improved by experimental tests, and it is well agreed by both circuit and finite element method (FEM) simulation results.
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A thorough six-step mission-profile-based lifetime estimation procedure assessing reliability of power electronics at both component and system levels has been proposed in [76].
“Moreover, a thorough six-step mission-profile-based lifetime estimation procedure, which assesses the reliability of power electronics, both at the component level and the system level, has been proposed in [76].”
From Reliability of Power Electronic Systems for EV/HEV Applications (2021) · cites this paper as [76]
The Introduction describes how semiconductor loss and thermal loading affect converter reliability, while Sections III and VII propose loss and thermal models for device-rating decisions. Searches for a six-step procedure, mission profiles, and lifetime estimation found no passage proposing the claimed component- and system-level reliability assessment; the References list a separate mission-profile lifetime-estimation paper, but do not establish that it contains the claimed procedure. (LLM, conf=0.75)
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Citations
Cites
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Self-citation
Flagged first, then by citations
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Cited by
Sorted by citations
Automotive Traction Inverters: Current Status and Future Trends
Reimers, J., Dorn-Gomba, L., Mak, C., & Emadi, A. (2019) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2019.2897899 · Cited by 375
Reliability of Power Electronic Systems for EV/HEV Applications
Blaabjerg, F., Wang, H., Vernica, I., Liu, B., & Davari, P. (2021) · Proceedings of the IEEE · doi:10.1109/jproc.2020.3031041 · Cited by 249
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The Predictive Closed-Loop Averaging Control of MMC Phase-Unit Losses Under Unbalanced Conditions
Xu, J., Yu, Y., & Zhao, C. (2019) · IEEE Transactions on Power Delivery · doi:10.1109/tpwrd.2018.2868772 · Cited by 14
Metadata
- Authors
- Ma, K., Bahman, A. S., Beczkowski, S., & Blaabjerg, F.
- Affiliations
- Aalborg University (DK)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2015-05
- Volume
- 30
- Issue
- 5
- Pages
- 2556-2569
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2131891757
- Cited by
- 199
- References
- 31
- Citations by year
- 2026: 7 · 2025: 11 · 2024: 15 · 2023: 15 · 2022: 15 · 2021: 18 · 2020: 29 · 2019: 33 · 2018: 17 · 2017: 18 · 2016: 12 · 2015: 9
- FWCI
- 6.91
- Type
- journal article
- Language
- en
- Open access
- bronze
- doi.org
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- VBN Forskningsportal (Aalborg Universitet) (submittedVersion, other-oa)
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Keywords
- power semiconductor devices, power loss modeling, thermal modeling, IGBT, thermal impedance, silicon area, electrical loading, power converter efficiency, converter reliability, design flexibility
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