Methodology for Active Thermal Cycle Reduction of Power Electronic Modules
Abstract
This paper proposes a methodology for active thermal control of power electronic modules in ac applications, which includes a loss manipulation unit, a thermal observer structure, and an active thermal cycle reduction algorithm. It aims to reduce the thermo-mechanical strain in the inter-connects of the module in order to enhance its reliability and lifetime. The loss manipulation unit operates in a minimally invasive manner by manipulating adaptive gate resistances and the pulsewidth modulation frequency. This allows the individual thermal control of multiple devices within a power module, which has not been achieved in prior work. A thermal observer structure that estimates averaged junction temperatures by combination of a thermal model and sensor information is introduced. The observer technology makes this paper the first to realize closed-loop control of averaged temperatures achieving an increased robustness and insensitivity to modeling errors. A key element of the active thermal cycle reduction algorithm is the virtual heat sink that derives feasible and stress-relieving thermal trajectories. The trajectories are applied with a unique thermal feedback control that smoothly manipulates the averaged junction temperature of the power module even in the presence of loss manipulation limits. The active thermal control methodology is evaluated experimentally with a state-of-the-art insulated-gate bipolar transistor (IGBT) power module.
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In some EV/HEV applications, the main inverter is reused for OBC, referred to as onboard integrated chargers or propulsion-system-integrated OBCs.
“Due to their higher power capabilities, in some EV/HEV applications, the main inverter is reused for OBC, which are referred to as onboard integrated chargers or propulsionsystem-integrated OBCs [30], [49].”
From Reliability of Power Electronic Systems for EV/HEV Applications (2021) · cites this paper as [30]
In most commercial vehicles, due to power density and size limitations, the three-phase OBC power level is from 11 up to 20 kW except for Renault Zoe, which is rated at 43 kW using the integrated motor drive and OBC configuration.
“In most commercial vehicles due to power density and size limitations, the three-phase OBC power level is from 11 up to 20 kW except for Renault Zoe, which is rated at 43 kW using the integrated motor drive and OBC configuration [30].”
From Reliability of Power Electronic Systems for EV/HEV Applications (2021) · cites this paper as [30]
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Reliability of Power Electronic Systems for EV/HEV Applications
Blaabjerg, F., Wang, H., Vernica, I., Liu, B., & Davari, P. (2021) · Proceedings of the IEEE · doi:10.1109/jproc.2020.3031041 · Cited by 249 · see citing works
“To minimize the thermal swings due to active power cycling, active thermal control methods can be applied [52]–[54].”
MethodAC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
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“A thermal observer structure is proposed for active thermal control of AC power cycling in [36] where in [37] a methodology for the AC power cycling test is proposed.”
Method
- Authors
- van der Broeck, C. H., Ruppert, L. A., Lorenz, R. D., & De Doncker, R. W.
- Affiliations
- RWTH Aachen University (DE)
- University of Wisconsin–Madison (US)
- Venue
- IEEE Transactions on Power Electronics
- Published
- 2019-08
- Volume
- 34
- Issue
- 8
- Pages
- 8213-8229
- ISSN
- 0885-8993 (ISSN-L)
- 1941-0107
- OpenAlex
- W2900947174
- Cited by
- 85
- References
- 79
- Citations by year
- 2026: 5 · 2025: 11 · 2024: 15 · 2023: 12 · 2022: 5 · 2021: 16 · 2020: 12 · 2019: 8 · 2018: 1
- FWCI
- 3.54
- Type
- journal article
- Language
- en
- Open access
- closed
- Licence
- Locations
- IEEE Transactions on Power Electronics (publishedVersion)
- RWTH Publications (RWTH Aachen) (submittedVersion)
- Funders
- German Academic Exchange Service
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Silicon Carbide Semiconductor Technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Multilevel Inverters and Converters
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Advanced DC-DC Converters
- Keywords
- active thermal control, power modules, interconnect reliability, junction temperature estimation, IGBT modules, closed-loop temperature control
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