Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules

Overview of Control and Grid Synchronization for Distributed Power Generation Systems

Blaabjerg, F., Teodorescu, R., Liserre, M., & Timbus, A. (2006) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2006.881997 · Cited by 5,226 · see citing works

Power electronics as efficient interface in dispersed power generation systems

Blaabjerg, F., Chen, Z., & Kjær, S. B. (2004) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2004.833453 · Cited by 2,593 · see citing works

An Industry-Based Survey of Reliability in Power Electronic Converters

Yang, S., Bryant, A. T., Mawby, P., Xiang, D., Ran, L., & Tavner, P. J. (2011) · IEEE Transactions on Industry Applications · doi:10.1109/tia.2011.2124436 · Cited by 2,058 · see citing works

Condition Monitoring for Device Reliability in Power Electronic Converters: A Review

Yang, S., Xiang, D., Bryant, A., Mawby, P., Ran, L., & Tavner, P. (2010) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2010.2049377 · Cited by 1,278 · see citing works

Selected failure mechanisms of modern power modules

Ciappa, M. (2002) · Microelectronics Reliability · doi:10.1016/s0026-2714(02)00042-2 · Cited by 1,039 · see citing works

Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities

Wang, H., Liserre, M., & Blaabjerg, F. (2013) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2013.2252958 · Cited by 919 · see citing works

Practical Reliability Engineering

O'Connor, P. D. T., & Kleyner, A. (2011) · Wiley eBooks · doi:10.1002/9781119961260 · Cited by 786 · see citing works

Semiconductor Power Devices

Lutz, J., Schlangenotto, H., Scheuermann, U., & Doncker, R. D. (2011) · Springer eBooks · doi:10.1007/978-3-642-11125-9 · Cited by 709 · see citing works

Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems

Choi, U., Blaabjerg, F., & Lee, K. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2373390 · Cited by 700 · see citing works

Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics

Wang, H., Liserre, M., Blaabjerg, F., de Place Rimmen, P., Jacobsen, J. B., Kvisgaard, T., & Landkildehus, J. (2014) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2013.2290282 · Cited by 693 · see citing works

Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

Smet, V., Forest, F., Huselstein, J.-J., Richardeau, F., Khatir, Z., Lefebvre, S., & Berkani, M. (2011) · IEEE Transactions on Industrial Electronics · doi:10.1109/tie.2011.2114313 · Cited by 620 · see citing works

Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters—A Review

Avenas, Y., Dupont, L., & Khatir, Z. (2011) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2011.2178433 · Cited by 559 · see citing works

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

Oh, H., Han, B., McCluskey, P., Han, C., & Youn, B. D. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2346485 · Cited by 515 · see citing works

Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter

Ma, K., Liserre, M., Blaabjerg, F., & Kerekes, T. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2312335 · Cited by 460 · see citing works

Power Cycle Testing of Power Switches: A Literature Survey

Reddy, L. G., Tolbert, L. M., & Ozpineci, B. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2359015 · Cited by 187 · see citing works

Online Vce measurement method for wear-out monitoring of high power IGBT modules

Bęczkowski, S., Ghimre, P., de Vega, A. R., Munk‐Nielsen, S., Rannestad, B., & Thøgersen, P. (2013) · European Conference on Power Electronics and Applications · doi:10.1109/epe.2013.6634390 · Cited by 170 · see citing works

Reliability Oriented Design Tool For the New Generation of Grid Connected PV-Inverters

Sintamarean, N. C., Blaabjerg, F., Wang, H., Iannuzzo, F., & Rimmen, P. D. P. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2361918 · Cited by 135 · see citing works

Improving Power Converter Reliability: Online Monitoring of High-Power IGBT Modules

Ghimire, P., de Vega, A. R., Bęczkowski, S., Rannestad, B., Munk‐Nielsen, S., & Thøgersen, P. (2014) · IEEE Industrial Electronics Magazine · doi:10.1109/mie.2014.2311829 · Cited by 123 · see citing works

Power cycling results for different control strategies

Scheuermann, U., & Schuler, S. C. (2010) · Microelectronics Reliability · doi:10.1016/j.microrel.2010.07.135 · Cited by 92 · see citing works

Reliability-Oriented Design of Three-Phase Power Converters for Aircraft Applications

Burgos, R. P., Chen, G., Wang, F., Boroyevich, D., Odendaal, W. G., & van Wyk, J. D. (2012) · IEEE Transactions on Aerospace and Electronic Systems · doi:10.1109/taes.2012.6178060 · Cited by 88 · see citing works

Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the V ce (T)-measurement

Schmidt, R., & Scheuermann, U. (2009) · European Conference on Power Electronics and Applications · Cited by 84 · see citing works

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

Czerny, B., Lederer, M., Nagl, B., et al. (2012) · Microelectronics Reliability · doi:10.1016/j.microrel.2012.06.081 · Cited by 82 · see citing works

Impact of load pulse duration on power cycling lifetime of Al wire bonds

Scheuermann, U., & Schmidt, R. (2013) · Microelectronics Reliability · doi:10.1016/j.microrel.2013.06.019 · Cited by 58 · see citing works

Junction temperature estimation method for a 600 V, 30A IGBT module during converter operation

Choi, U., Blaabjerg, F., Iannuzzo, F., et al. (2015) · Microelectronics Reliability · doi:10.1016/j.microrel.2015.06.146 · Cited by 56 · see citing works

Using the Chip as a Temperature Sensor - The Influence of Steep Lateral Temperature Gradients on the VCE(T)-Measurement

Schmidt, R., & Scheuermann, U. (2011) · EPE Journal · doi:10.1080/09398368.2011.11463790 · Cited by 54 · see citing works

Characterization of high-voltage IGBT module degradations under PWM power cycling test at high ambient temperature

Tounsi, M., Oukaour, A., Tala‐Ighil, B., Gualous, H., Boudart, B., & Aı̈ssani, D. (2010) · Microelectronics Reliability · doi:10.1016/j.microrel.2010.07.059 · Cited by 52 · see citing works

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Dugal, F., & Ciappa, M. (2014) · Microelectronics Reliability · doi:10.1016/j.microrel.2014.08.001 · Cited by 45 · see citing works

Packaging and Reliability of Power Modules

Lutz, J. (2014) · Cited by 39 · see citing works

Degradation Assessment in IGBT Modules Using Four-Point Probing Approach

Pedersen, K. B., Kristensen, P. K., Popok, V. N., et al. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2344174 · Cited by 36 · see citing works

Revisiting power cycling test for better life-time prediction in traction

Mermet-Guyennet, M., Perpiñà, X., & Piton, M. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.07.099 · Cited by 36 · see citing works

Product Level Accelerated Reliability Testing of Motor Drives With Input Power Interruptions

Pippola, J., Vaalasranta, I., Marttila, T., Kiilunen, J., & Frisk, L. (2014) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2359734 · Cited by 27 · see citing works

Enhanced power cycling performance of IGBT modules with a reinforced emitter contact

Özkol, E., Brem, F., Liu, C., Hartmann, S., & Kopta, A. (2015) · Microelectronics Reliability · doi:10.1016/j.microrel.2015.03.013 · Cited by 25 · see citing works

Methodology and apparatus for rapid power cycle accumulation and in-situ incipient failure monitoring for power electronic modules

Davis, R. I., & Sprenger, D. J. (2014) · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · doi:10.1109/ectc.2014.6897576 · Cited by 19 · see citing works

Advanced power cycling test for power module with on-line on-state VCE measurement

Choi, U., Trintis, I., Blaabjerg, F., Jorgensen, S., & Svarre, M. L. (2015) · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition · doi:10.1109/apec.2015.7104765 · Cited by 13 · see citing works

Accelerated life testing of a traction inverter

Oates, C. (1999) · Power Engineering Journal · doi:10.1049/pe:19990511 · Cited by 10 · see citing works

Accelerated life testing of a traction inverter

Oates, C. (1998) · doi:10.1049/ic:19980071 · Cited by 6 · see citing works

A Comprehensive Review Toward the State-of-the-Art in Failure and Lifetime Predictions of Power Electronic Devices

Hanif, A., Yu, Y., DeVoto, D., & Khan, F. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2860587 · Cited by 272 · see citing works

Methodology for Active Thermal Cycle Reduction of Power Electronic Modules

van der Broeck, C. H., Ruppert, L. A., Lorenz, R. D., & De Doncker, R. W. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2882184 · Cited by 85 · see citing works

Role of Threshold Voltage Shift in Highly Accelerated Power Cycling Tests for SiC MOSFET Modules

Luo, H., Iannuzzo, F., & Turnaturi, M. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2894717 · Cited by 82 · see citing works

Constant <italic>ΔT<sub>j</sub> </italic> Power Cycling Strategy in DC Mode for Top-Metal and Bond-Wire Contacts Degradation Investigations

Tran, S.-H., Khatir, Z., Lallemand, R., Ibrahim, A., Ousten, J.-P., Ewanchuk, J., & Mollov, S. V. (2019) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2018.2847234 · Cited by 26 · see citing works

AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters

Farhadi, M., Vankayalapati, B. T., Sajadi, R., & Akin, B. (2023) · IEEE Transactions on Vehicular Technology · doi:10.1109/tvt.2023.3271251 · Cited by 24 · see citing works

Effect of Power Cycling Duration on Coupled Power and Thermal Cycling Reliability of Board-level Chip-scale Packages

Wang, T. H., Lai, Y., & Lee, C.-C. (2006) · Electronic Packaging Technology Conference · doi:10.1109/eptc.2005.1614378 · Cited by 1 · see citing works

Correlation between power cycling and thermal cycling fatigue reliabilities of chip-scale packages

Wang, T. H., Lee, C. C., Lai, Y., et al. (2004) · IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEMT) · doi:10.1109/iemt.2004.1321627 · Cited by 14 · see citing works

Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages

Lai, Y., Wang, T. H., & Lee, C.-C. (2008) · IEEE Transactions on Device and Materials Reliability · doi:10.1109/tdmr.2007.915045 · Cited by 21 · see citing works

Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions

Wang, T. H., Lai, Y., & Lin, Y. (2007) · Microelectronics Reliability · doi:10.1016/j.microrel.2007.02.011 · Cited by 8 · see citing works

Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?

SUHIR, E. (1989) · Journal of Electronic Packaging · doi:10.1115/1.3226553 · Cited by 4 · see citing works