Cited by 47Advancements in Semiconductor Devices and Circuit DesignLow-power high-performance VLSI designVLSI and FPGA Design Techniques

The DOI matches its Crossref record; 32 of the 32 references it cites were found in a registry or an index.

Complementary FET (CFET) Standard Cell Design for Low Parasitics and Its Impact on VLSI Prediction at 3-nm Process

Park, Eunbin, Song, Taigon·2023·IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Abstract

Complementary field-effect transistor (CFET) is a future transistor type with a high potential to be used beyond 3-nm technology nodes. Despite its high future value, studies related to CFETs mostly focused on the device aspects. In other words, the path of CFET full-chip IC design is not fully demystified, knowing that various design factors/steps (such as schematic, layout, parasitics, design flow) must be considered on top of device traits for full-chip level IC. Therefore, this study focuses on enlightening the remaining factors/steps for full-chip IC design. In detail, we notify the importance of parasitics from various aspects of CFET design and provide optimization solutions. Compared to nanosheet FET (NSFET) on the full-chip scale, CFET shows a reduction of the area by −48.2%, power by −29.4%, total wirelength by −32.5%, and the number of cells by −18.1%.

Overview

Integrity signals

Registry

Crossref · 10.1109/tvlsi.2022.3220339

Cites

32 of 32 references verified0 citation errors · 0 not checkable

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Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • According to the Imec device roadmap, GAAFET devices are expected to push technologies until 2032.

    “According to the device roadmap of Imec 98 , the se devices are expected to push technologies until 2032.”

    From Extreme ultraviolet lithography (2024) · cites this paper as [98]

Citations

Cites

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Research works printed but not linked: 8

  1. 2018, International Roadmap for Device and Systems
  2. Bae, 3 nm GAA technology featuring multi-bridge-channel FET for low power and high performance applications, 28.7.1
  3. Prasad, Buried power rails and back-side power grids: Arm CPU power delivery network design beyond 5 nm, 19.1.1
  4. 2020, RaphaelT Reference Manual
  5. 2019, HSPICE User Guide
  6. 2019, BSIM-CMG Model
  7. Ryckaert, Enabling sub-5 nm CMOS technology scaling thinner and taller!, 29.4.1
  8. 2019, OpenCores

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Metadata

Authors
Park, E., & Song, T.
Affiliations
  • Pohang University of Science and Technology (KR)
  • Kyungpook National University (KR)
Venue
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Published
2023-02
Volume
31
Issue
2
Pages
177-187
ISSN
  • 1063-8210 (ISSN-L)
  • 1557-9999
OpenAlex
W4312992159
Cited by
47
References
32
Citations by year
2026: 11 · 2025: 23 · 2024: 6 · 2023: 7
FWCI
2.47
Type
journal article
Language
en
Open access
closed
Locations
IEEE Transactions on Very Large Scale Integration (VLSI) Systems (publishedVersion)
Funders
  • National Research and Development Program through the National Research Foundation of Korea
  • Ministry of Science and ICT (2020M3H2A1078045)
  • Basic Science Research Program through the National Research Foundation of Korea
  • Ministry of Education (2022R1I1A3073214)
  • IC Design Education Center (IDEC), Korea
  • Samsung Electronics Company, Ltd
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Semiconductor Devices and Circuit Design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Low-power high-performance VLSI design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › VLSI and FPGA Design Techniques
Keywords
CFET, parasitic effects, 3 nm technology node, nanosheet FET, energy consumption reduction, wirelength minimization, area reduction, design flow

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