Cited by 262Advancements in Semiconductor Devices and Circuit DesignLow-power high-performance VLSI designSemiconductor materials and devices

The DOI matches its Crossref record; 3 of the 3 references it cites were found in a registry or an index.

The Complementary FET (CFET) for CMOS scaling beyond N3

Abstract

The complementary FET (CFET) device consisting of a stacked n-type vertical sheet on a p-type fin is evaluated in a design-technology co-optimization (DTCO) framework. Through a double level access it offers a structural scaling of both standard cells (SDC) and SRAM by 50%. The proposed process flow requires accurate control of the elevation dimension for manufacturability. Based on TCAD analysis, the CFET can eventually outperform the finFET device and meet the N3 targets in power and performance. To achieve that, the dominating parasitic resistance of the deep vias needs to be reduced by the introduction of advanced MOL contacts featuring thin barriers.

Overview

Integrity signals

Registry

Crossref · 10.1109/vlsit.2018.8510618

Cites

3 of 3 references verified0 citation errors · 0 not checkable

Statistics

Recomputing p-values needs the paper’s full text.

Verification

Claims the paper makes

This paper’s full text isn’t openly available, so its claims and self-check weren’t run. The registry and citation checks still apply.

Claims other papers make about this one

Each is checked against this paper’s own text: does it say what the citing paper says it does?

  • In CFETs, n-channel and p-channel transistors are stacked vertically on top of each other, which can increase performance and density at the expense of processing complexity.

    “In these three -dimensional devices, the nchannel and pchannel transistors are stacked vertically on top of each other, which can increase performance and density at the expense of processing complexity 99 .”

    From Extreme ultraviolet lithography (2024) · cites this paper as [99]

Citations

Cites

Flagged first, then by citations

Research works printed but not linked: 3

  1. 0, Comsol Multiphysics
  2. 0, Coventor SEMulator3D®
  3. liebmann, 2016, IEEE Symposium on VLSI Technology, 112

Cited by

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Metadata

Authors
Ryckaert, J., Schuddinck, P., Weckx, P., Bouche, G., Vincent, B., Smith, J., Sherazi, Y., Mallik, A., Mertens, H., Demuynck, S., Bao, T. H., Veloso, A., Horiguchi, N., Mocuta, A., Mocuta, D., & Boemmels, J.
Affiliations
  • IMEC (BE)
  • Tokyo Electron (Japan) (JP)
Venue
2018 IEEE Symposium on VLSI Technology
Publisher
IEEE
Published
2018-06
Pages
141-142
OpenAlex
W2899004836
Cited by
262
References
3
Citations by year
2026: 58 · 2025: 71 · 2024: 45 · 2023: 29 · 2022: 23 · 2021: 18 · 2020: 10 · 2019: 6 · 2018: 2
FWCI
14.36
Type
conference paper
Language
en
Open access
closed
Locations
Symposium on VLSI Technology (publishedVersion)
Topics
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Advancements in Semiconductor Devices and Circuit Design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Low-power high-performance VLSI design
  • Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor materials and devices
Keywords
complementary FET, CFET, CMOS scaling, design-technology co-optimization, FinFET, thin barriers

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