Solid Layer Thermal-Conductivity Measurement Techniques
Abstract
The thermal conductivities of solid layers of thicknesses from 0.01 to 100 μm affect the performance and reliability of electronic circuits, laser systems, and microfabricated sensors. This work reviews techniques that measure the effective thermal conductivity along and normal to these layers. Recent measurements using microfabricated experimental structures show the importance of measuring the conductivities of layers that closely resemble those in the application. Several promising non-contact techniques use laser light for heating and infrared detectors for temperature measurements. For transparent layers these methods require optical coatings whose impact on the measurements has not been determined. There is a need for uncertainty analysis in many cases, particularly for those techniques which apply to very thin layers or to layers with very high conductivities.
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Electrical resistance thermometry has been applied to measure the thermal conductivity of low-dimensional solids in both direct and modulated current configurations.
“Electrical resistance thermometry has been applied to measure the thermal conductivity of low dimensional solids (films, membranes, wires, and bridges) [13-15] in both direct [16-20] and modulated (1-omega, 2-omega, 3-omega) [21,22] current configurations.”
From Mean Free Path Effects on the Experimentally Measured Thermal Conductivity of Single-Crystal Silicon Microbridges (2013) · cites this paper as [13]
Cites
Introduction to Solid State Physics
KITTEL, C., & Fan, H. (1957) · American Journal of Physics · doi:10.1119/1.1934457 · Cited by 22,539 · see citing works
Swartz, E. T., & Pohl, R. O. (1989) · Reviews of Modern Physics · doi:10.1103/revmodphys.61.605 · Cited by 2,937 · see citing works
Nonnenmacher, M., O’Boyle, M., & Wickramasinghe, H. K. (1991) · Applied Physics Letters · doi:10.1063/1.105227 · Cited by 2,349 · see citing works
Thermal resistance at interfaces
Swartz, E. T., & Pohl, R. O. (1987) · Applied Physics Letters · doi:10.1063/1.98939 · Cited by 410 · see citing works
Eichler, H. J., Salje, G., & Stahl, H. (1973) · Journal of Applied Physics · doi:10.1063/1.1662160 · Cited by 216 · see citing works
Unusually high thermal conductivity in diamond films
Graebner, J. E., Jin, S., Kammlott, G. W., Herb, J. A., & Gardinier, C. F. (1992) · Applied Physics Letters · doi:10.1063/1.107256 · Cited by 182 · see citing works
Thermal conductivity of dielectric thin films
Lambropoulos, J. C., Jolly, M. R., Amsden, C. A., Gilman, S. E., Sinicropi, M. J., Diakomihalis, D., & Jacobs, S. D. (1989) · Journal of Applied Physics · doi:10.1063/1.343963 · Cited by 164 · see citing works
Thermal conductivity of synthetic diamond films
Morelli, D. T., Beetz, C. P., & Perry, T. A. (1988) · Journal of Applied Physics · doi:10.1063/1.341571 · Cited by 104 · see citing works
Anisotropic thermal conductivity in chemical vapor deposition diamond
Graebner, J. E., Jin, S., Kammlott, G. W., Bacon, B., Seibles, L., & Banholzer, W. F. (1992) · Journal of Applied Physics · doi:10.1063/1.350553 · Cited by 98 · see citing works
Annealing-temperature dependence of the thermal conductivity of LPCVD silicon-dioxide layers
Goodson, K. E., Flik, M. I., Su, L. T., & Antoniadis, D. A. (1993) · IEEE Electron Device Letters · doi:10.1109/55.244740 · Cited by 94 · see citing works
Self-citationThe thermal conductivity of chemical-vapor-deposited diamond films on silicon
Graebner, J. E., Mucha, J. A., Seibles, L., & Kammlott, G. W. (1992) · Journal of Applied Physics · doi:10.1063/1.350981 · Cited by 88 · see citing works
Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers
Goodson, K. E., Flik, M. I., Su, L. T., & Antoniadis, D. A. (1994) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.2911402 · Cited by 87 · see citing works
Self-citationPowell, R. W. (1957) · Journal of Scientific Instruments · doi:10.1088/0950-7671/34/12/303 · Cited by 75 · see citing works
Visser, E. P., Versteegen, E. H., & van Enckevort, W. J. P. (1992) · Journal of Applied Physics · doi:10.1063/1.350970 · Cited by 71 · see citing works
Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics
Goodson, K. E., & Flik, M. I. (2003) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.1992.187749 · Cited by 59 · see citing works
Self-citationVölklein, F., & Kessler, E. (1984) · physica status solidi (a) · doi:10.1002/pssa.2210810222 · Cited by 50 · see citing works
Feasibility of infrared imaging arrays using high-T c superconducting bolometers
Verghese, S., Richards, P. L., Char, K., FORK, D. K., & Geballe, T. H. (1992) · Journal of Applied Physics · doi:10.1063/1.351063 · Cited by 49 · see citing works
Hatta, I., Kato, R., & Maesono, A. (1987) · Japanese Journal of Applied Physics · doi:10.1143/jjap.26.475 · Cited by 44 · see citing works
Prediction and Measurement of Temperature Fields in Silicon-on-Insulator Electronic Circuits
Goodson, K. E., Flik, M. I., Su, L. T., & Antoniadis, D. A. (1995) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.2822616 · Cited by 42 · see citing works
Self-citationHatta, I., Kato, R., & Maesono, A. (1986) · Japanese Journal of Applied Physics · doi:10.1143/jjap.25.l493 · Cited by 34 · see citing works
Measurement of thermal diffusivity for polymer film by flash radiometry
Tsutsumi, N., & Kiyotsukuri, T. (1988) · Applied Physics Letters · doi:10.1063/1.99437 · Cited by 24 · see citing works
New Laser-Flash Method for Measuring Thermal Diffusivity of Isotropic and Anisotropic Thin Films
Shibata, H., Ohta, H., & Waseda, Y. (1991) · Materials Transactions JIM · doi:10.2320/matertrans1989.32.837 · Cited by 22 · see citing works
Flagged first, then by citations
1 of the 23 references couldn’t be matched to a known paper.
Cited by
Sorted by citations
Review of thermal conductivity in composites: Mechanisms, parameters and theory
Burger, N., Laachachi, A., Ferriol, M., Lutz, M. P., Toniazzo, V., & Ruch, D. (2016) · Progress in Polymer Science · doi:10.1016/j.progpolymsci.2016.05.001 · Cited by 1,365 · see citing works
Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures
Cahill, D. G., Goodson, K., & Majumdar, A. (2002) · Journal of Heat Transfer · doi:10.1115/1.1454111 · Cited by 611 · see citing works
Self-citationAdvances in Thermal Conductivity
Toberer, E. S., Baranowski, L. L., & Dames, C. (2012) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070511-155040 · Cited by 332 · see citing works
HEAT CONDUCTION IN NOVEL ELECTRONIC FILMS
Goodson, K. E., & Ju, Y. S. (1999) · Annual Review of Materials Science · doi:10.1146/annurev.matsci.29.1.261 · Cited by 178 · see citing works
Self-citationThe thermal properties of FDM printed polymeric materials: A review
Shanmugam, V., Babu, K., Kannan, G., Mensah, R. A., Samantaray, S. K., & Das, O. (2024) · Polymer Degradation and Stability · doi:10.1016/j.polymdegradstab.2024.110902 · Cited by 180 · see citing works
Transient thermal gratings at surfaces for thermal characterization of bulk materials and thin films
K�ding, O. W., Skurk, H., Maznev, A. A., & Matthias, E. (1995) · Applied Physics A · doi:10.1007/bf01538190 · Cited by 141 · see citing works
Experimental investigation of thermal conduction normal to diamond-silicon boundaries
Goodson, K. E., Käding, O. W., Rösler, M., & Zachai, R. (1995) · Journal of Applied Physics · doi:10.1063/1.358950 · Cited by 139 · see citing works
Self-citationMeasurement of the thermal conductivity anisotropy in polyimide films
Kurabayashi, K., Asheghi, M., Touzelbaev, M. N., & Goodson, K. E. (1999) · Journal of Microelectromechanical Systems · doi:10.1109/84.767114 · Cited by 134 · see citing works
Self-citationPhoto-Acoustic Measurement of Thermal Conductivity of Thin Films and Bulk Materials
Wang, X., Hu, H., & Xu, X. (2000) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.1337652 · Cited by 104 · see citing works
Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating
Ju, Y. S., Kurabayashi, K., & Goodson, K. E. (1999) · Thin Solid Films · doi:10.1016/s0040-6090(98)01328-5 · Cited by 104 · see citing works
Self-citationThermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film
Chien, H.-C., Yao, D., Huang, M., & Chang, T.-Y. (2008) · Review of Scientific Instruments · doi:10.1063/1.2927253 · Cited by 99 · see citing works
Thermal transport properties of gold-covered thin-film silicon dioxide
Burzo, M. G., Komarov, P. L., & Raad, P. E. (2003) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2003.811467 · Cited by 75 · see citing works
Wilson, A. A., Rojo, M. M., Mayor, B. A., Pérez, J., Maiz, J., Schomacker, J., Martín‐González, M., Borca‐Tasciuc, D., & Borca‐Tasciuc, T. (2015) · Nanoscale · doi:10.1039/c5nr03274a · Cited by 66 · see citing works
Bengtsson, S. L., Bergh, M., Choumas, M., Olesen, C. O. C., & Jeppson, K. (1996) · Japanese Journal of Applied Physics · doi:10.1143/jjap.35.4175 · Cited by 66 · see citing works
Brites, C. D. S., Fuertes, M. C., Angelomé, P. C., Martínez, E. D., Lima, P. P., Soler‐Illia, G. J. A. A., & Carlos, L. D. (2017) · Nano Letters · doi:10.1021/acs.nanolett.7b01433 · Cited by 64 · see citing works
Zhang, H., Li, M.-J., Fang, W.-Z., Dan, D., Li, Z.-Y., & Tao, W.-Q. (2014) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2014.01.058 · Cited by 55 · see citing works
Two-dimensional phonon hydrodynamics in narrow strips
Sellitto, A., Carlomagno, I., & Jou, D. (2015) · Proceedings of the Royal Society A Mathematical Physical and Engineering Sciences · doi:10.1098/rspa.2015.0376 · Cited by 55 · see citing works
A new method for measuring thermal conductivity of thin films
Govorkov, S. A., Ruderman, W., Horn, M. W., Goodman, R. B., & Rothschild, M. (1997) · Review of Scientific Instruments · doi:10.1063/1.1148035 · Cited by 55 · see citing works
Adamczyk, W. P., Pawlak, S., & Ostrowski, Z. (2018) · Measurement · doi:10.1016/j.measurement.2018.04.022 · Cited by 53 · see citing works
Kulish, V., Lage, J. L. C., Komarov, P. L., & Raad, P. E. (2001) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.1416688 · Cited by 49 · see citing works
Thermal wave propagation in thin films on substrates
Maznev, A. A., Hartmann, J., & Reichling, M. (1995) · Journal of Applied Physics · doi:10.1063/1.359702 · Cited by 47 · see citing works
Review of the Thermal Conductivity of Thin Films
Mirmira, S., & Fletcher, L. S. (1998) · Journal of Thermophysics and Heat Transfer · doi:10.2514/2.6321 · Cited by 43 · see citing works
Buckling analysis of composite panels
Gal, E., Levy, R., Abramovich, H., & Pavsner, P. (2006) · Composite Structures · doi:10.1016/j.compstruct.2005.11.052 · Cited by 42 · see citing works
Zhang, Y., Zhu, W., & Borca‐Tasciuc, T. (2020) · Nanoscale Advances · doi:10.1039/d0na00657b · Cited by 36 · see citing works
Thermal characterization of film-on-substrate systems with modulated thermoreflectance microscopy
Li, B., Pottier, L., Roger, J. P., Fournier, D., & Welsch, E. (2000) · Review of Scientific Instruments · doi:10.1063/1.1150598 · Cited by 35 · see citing works
Design criteria for improving insulation effectiveness of multilayer walls
Gori, P., Guattari, C., Evangelisti, L., & Asdrubali, F. (2016) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2016.07.077 · Cited by 34 · see citing works
Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
Ju, Y. S., & Goodson, K. E. (1999) · Microsystems · doi:10.1007/978-1-4615-5211-6 · Cited by 31 · see citing works
Self-citationThin-Film Thermophysical Property Characterization by Scanning Laser Thermoelectric Microscope
Borca‐Tasciuc, T., & Chen, G. (1998) · International Journal of Thermophysics · doi:10.1023/a:1022586032424 · Cited by 29 · see citing works
Thermal-wave measurement of thin-film thermal diffusivity with different laser beam configurations
Yu, X., Zhang, L., & Chen, G. (1996) · Review of Scientific Instruments · doi:10.1063/1.1146938 · Cited by 29 · see citing works
Touzelbaev, M. N., & Goodson, K. E. (1998) · Diamond and Related Materials · doi:10.1016/s0925-9635(97)00199-4 · Cited by 28 · see citing works
Self-citationPhotothermal deflection measurement on heat transport in GaAs epitaxial layers
George, S. D., Radhakrishnan, P., Nampoori, V. P. N., & Vallabhan, C. P. G. (2003) · Physical review. B, Condensed matter · doi:10.1103/physrevb.68.165319 · Cited by 26 · see citing works
Measuring thermal conductivity tensor of orthotropic solid bodies
Adamczyk, W. P., Białecki, R. A., & Kruczek, T. (2017) · Measurement · doi:10.1016/j.measurement.2017.01.023 · Cited by 25 · see citing works
Burzo, M. G., Komarov, P. L., & Raad, P. E. (2002) · Microelectronics Journal · doi:10.1016/s0026-2692(02)00052-6 · Cited by 25 · see citing works
Thermal-conductivity apparatus for steady-state, comparative measurement of ceramic coatings
Slifka, A. J. (2000) · Journal of Research of the National Institute of Standards and Technology · doi:10.6028/jres.105.050 · Cited by 24 · see citing works
Experimental Techniques for Thin-Film Thermal Conductivity Characterization
Borca-Tasciuc, T., & Chen, G. (2006) · Physics of Solids and Liquids · doi:10.1007/0-387-26017-x_9 · Cited by 23 · see citing works
Thermal response of an on-chip assembly of RTD heaters, sputtered sample and microthermocouples
Imran, M., & Bhattacharyya, A. (2005) · Sensors and Actuators A Physical · doi:10.1016/j.sna.2005.02.019 · Cited by 22 · see citing works
The geometric stiffness of triangular composite-materials shell elements
Gal, E., & Levy, R. (2005) · Computers & Structures · doi:10.1016/j.compstruc.2005.03.032 · Cited by 21 · see citing works
Heat diffusion at the boundary of stratified media
Fudym, O., Batsale, J., & Lecomte, D. (2003) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2003.11.014 · Cited by 18 · see citing works
Photo-Thermoelectric Technique for Anisotropic Thermal Diffusivity Measurements
Borca‐Tasciuc, T., Borca-Tasciuc, D. A., & Chen, G. (2007) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2007.906343 · Cited by 15 · see citing works
English, T. S., Phinney, L. M., Hopkins, P. E., & Serrano, J. R. (2013) · Journal of Heat Transfer · doi:10.1115/1.4024357 · Cited by 14 · see citing works
Asheghi, M., & Yang, Y. (2005) · Springer eBooks · doi:10.1007/3-540-26449-3_4 · Cited by 14 · see citing works
Research on Thermal Conductivity of the Wood and Analysis of Results Obtained by the Hot Wire Method
Prałat, K. (2016) · Experimental Techniques · doi:10.1007/s40799-016-0096-7 · Cited by 14 · see citing works
Feng, X., Zhi-Xin, L., & Zengyuan, G. (2001) · Chinese Physics Letters · doi:10.1088/0256-307x/18/3/336 · Cited by 14 · see citing works
Thermal transport properties of gold-covered thin-film silicon dioxide
Burzo, M. G., Komarov, P. L., & Raad, P. E. (2003) · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · doi:10.1109/itherm.2002.1012450 · Cited by 13 · see citing works
Adamczyk, W. P., Ostrowski, Z., & Ryfa, A. (2020) · Measurement · doi:10.1016/j.measurement.2020.108078 · Cited by 13 · see citing works
Temperature Dependence of Thermal Conductivity for Silicon Dioxide
Yao, D., Lai, W.-C., & Chien, H.-C. (2008) · ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B · doi:10.1115/mnht2008-52052 · Cited by 11 · see citing works
Investigation of thermophysical properties of thin-layered paint
Panas, A., Stryczniewicz, W., & Szczepaniak, R. (2018) · Thermochimica Acta · doi:10.1016/j.tca.2018.01.022 · Cited by 11 · see citing works
Nanoscale thermoelastic probing of megahertz thermal diffusion
Tomoda, M., Wright, O. B., & Voti, R. L. (2007) · Applied Physics Letters · doi:10.1063/1.2770769 · Cited by 10 · see citing works
Varandani, D., Agarwal, K., Brügger, J., & Mehta, B. R. (2016) · Review of Scientific Instruments · doi:10.1063/1.4960332 · Cited by 9 · see citing works
Impact of Experimental Timescale and Geometry on Thin-Film Thermal Property Measurements
Touzelbaev, M. N., & Goodson, K. E. (2001) · International Journal of Thermophysics · doi:10.1023/a:1006724123069 · Cited by 9 · see citing works
Self-citationBorca‐Tasciuc, T., Borca-Tasciuc, D. A., & Chen, G. (2005) · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · doi:10.1109/stherm.2005.1412193 · Cited by 8 · see citing works
Heat Conduction of Air in Nano Spacing
Zhang, Y., Zhao, B., Huang, G.-Y., Yang, Z., & Zhang, Y. (2009) · Nanoscale Research Letters · doi:10.1007/s11671-009-9335-5 · Cited by 7 · see citing works
Quantitative thermosensation in a single touch
Pan, B., Zhu, D., & Zhang, M. (2021) · Sensors and Actuators A Physical · doi:10.1016/j.sna.2021.112584 · Cited by 7 · see citing works
Measurement Methods and Standards for Processing and Application of Thermal Barrier Coatings
Dapkunas, S. J. (1997) · Journal of Thermal Spray Technology · doi:10.1007/bf02646314 · Cited by 6 · see citing works
The geometric stiffness of thick shell triangular finite elements for large rotations
Levy, R., & Gal, E. (2005) · International Journal for Numerical Methods in Engineering · doi:10.1002/nme.1491 · Cited by 6 · see citing works
Analysis and Interpretation of Results of Thermal Conductivity Obtained by the Hot Wire Method
Heim, D., Mrowiec, A., & Prałat, K. (2014) · Experimental Techniques · doi:10.1111/ext.12092 · Cited by 6 · see citing works
Imran, M., & Bhattacharyya, A. (2006) · Ferroelectrics · doi:10.1080/00150190600946278 · Cited by 6 · see citing works
Thermal Characterization of the High-Thermal-Conductivity Dielectrics
Yang, Y., Sadeghipour, S. M., Liu, W., Asheghi, M., & Touzelbaev, M. N. (2006) · Springer eBooks · doi:10.1007/0-387-25100-6_3 · Cited by 5 · see citing works
Phonon Heat Conduction in Superlattices
Bao, Y., & Chen, G. (2003) · Fundamental materials research · doi:10.1007/978-1-4419-9278-9_9 · Cited by 5 · see citing works
Thermal Conductivity and Thermal Interface Resistance Measurements of Thin Films using 3ω Method
Kuthati, S., & Pattamatta, A. (2013) · International Journal of Micro-Nano Scale Transport · doi:10.1260/1759-3093.4.3-4.85 · Cited by 4 · see citing works
Microsensors for Automotive Applications – Metrology and Test
Flik, G., Eisenschmid, H., Raudzis, C., Schatz, F., Schönenborn, W., & Trah, H. (2001) · MRS Proceedings · doi:10.1557/proc-687-b1.1 · Cited by 4 · see citing works
Thermal conductivity measurement at micrometer length scales based on a temperature-balance method
Ganguli, S., Wheeler, R. W., Sihn, S., Shade, P. A., & Roy, A. K. (2013) · Measurement Science and Technology · doi:10.1088/0957-0233/24/7/075006 · Cited by 3 · see citing works
Thermal properties of thin films studied by ultrafast laser spectroscopy: Theory and experiment
Poletkin, K., Gurzadyan, G. G., Shang, J., & Kulish, V. (2014) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2014.04.054 · Cited by 3 · see citing works
Thermal conductivity measurement and microscopy of thin film structures
Borca‐Tasciuc, T., Chen, G., Wang, D., & Wang, K. L. (2002) · International Conference on Thermoelectrics (ICT) · doi:10.1109/ict.1997.667632 · Cited by 3 · see citing works
Interface Contributions to Localized Heating of Dielectric Thin Films
Lambropoulos, J. C., & Hwang, S. S. (1998) · The Journal of Adhesion · doi:10.1080/00218469808011098 · Cited by 2 · see citing works
Measurement of the In-Plane Thermal Conductivity of Long Fiber Composites by Inverse Analysis
Assaf, B., Sobotka, V., & Trochu, F. (2017) · Open Journal of Composite Materials · doi:10.4236/ojcm.2017.72005 · Cited by 1 · see citing works
Thermal modeling of pulse current trimming
Polstyankin, A. V., & Gridchin, V. A. (2013) · International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices · doi:10.1109/edm.2013.6641933
Son, Y., Mazumder, M., & Borca‐Tasciuc, T. (2006) · doi:10.1115/imece2006-16296
Thermal conductivity measurement at the micrometer scales
Ganguli, S. (2021) · Elsevier eBooks · doi:10.1016/b978-0-12-819117-0.00002-4
Zhang, Y., Choudhary, A., Zhu, W., Efstathiadis, H., Bao, Y., & Borca‐Tasciuc, T. (2025) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4067819
Nakhostin, E., Richardson, M. C., Mueller, D. R., Kenny, S., & Devine, B. (2025) · Journal of Cold Regions Engineering · doi:10.1061/jcrgei.creng-948
Badarlis, A., Kumar, V., Pfau, A., & Kalfas, A. I. (2013) · SENSOR International Conference on Sensors and Measurement Technology (SENSOR) · doi:10.5162/sensor2013/d2.2
Electrothermal Behaviour of Constrained Carbon/Epoxy Laminates Under Various Electric Currents
Zhou, G. Y., & Sun, W. (2026) · Polymers · doi:10.3390/polym18080941
Wyznaczanie przewodności cieplnej drewna metodą „gorącego drutu”
Prałat, K., Mrowiec, A., & Walczak, A. (2013) · Inżynieria i Aparatura Chemiczna
- Authors
- Goodson, K. E., & Flik, M. I.
- Affiliations
- Daimler (Germany) (DE)
- Behr GmbH & Co, Postfach 300920, 70449 Stuttgart, Germany
- ORCID
- Goodson, K. E.
- Venue
- Applied Mechanics Reviews
- Publisher
- ASME International
- Published
- 1994-03-01
- Volume
- 47
- Issue
- 3
- Pages
- 101-112
- ISSN
- 0003-6900 (ISSN-L)
- 2379-0407
- OpenAlex
- W2056892465
- Cited by
- 75
- References
- 23
- Citations by year
- 2026: 1 · 2025: 2 · 2024: 1 · 2021: 2 · 2020: 2 · 2018: 2 · 2017: 3 · 2016: 4 · 2015: 2 · 2014: 3 · 2013: 6 · 2012: 1
- FWCI
- 2.35
- Type
- journal article
- Language
- en
- Open access
- closed
- Locations
- Applied Mechanics Reviews (publishedVersion)
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Engineering › Computational Mechanics › Heat Transfer and Numerical Methods
- Physical Sciences › Engineering › Mechanics of Materials › Thermography and Photoacoustic Techniques
- Keywords
- thermal conductivity measurement, effective thermal conductivity, laser heating, infrared thermography, non-contact measurement, transparent layer, optical coatings, measurement uncertainty evaluation, electronic packaging thermal management
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