The DOI matches its Crossref record; 123 of the 123 references it cites were found in a registry or an index.
Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance
Open accessAbstract
The efficiency in modern technologies and green energy solutions has boiled down to a thermal engineering problem on the nanoscale. Due to the magnitudes of the thermal mean free paths approaching or overpassing typical length scales in nanomaterials (i.e., materials with length scales less than one micrometer), the thermal transport across interfaces can dictate the overall thermal resistance in nanosystems. However, the fundamental mechanisms driving these electron and phonon interactions at nanoscale interfaces are difficult to predict and control since the thermal boundary conductance across interfaces is intimately related to the characteristics of the interface (structure, bonding, geometry, etc.) in addition to the fundamental atomistic properties of the materials comprising the interface itself. In this paper, I review the recent experimental progress in understanding the interplay between interfacial properties on the atomic scale and thermal transport across solid interfaces. I focus this discussion specifically on the role of interfacial nanoscale “imperfections,” such as surface roughness, compositional disorder, atomic dislocations, or interfacial bonding. Each type of interfacial imperfection leads to different scattering mechanisms that can be used to control the thermal boundary conductance. This offers a unique avenue for controlling scattering and thermal transport in nanotechnology.
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Cited by
Present and future thermal interface materials for electronic devices
Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J. (2018) · International Materials Reviews · doi:10.1080/09506608.2017.1296605 · Cited by 422
Thermal Boundary Conductance: A Materials Science Perspective
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Self-citationMechanisms of nonequilibrium electron-phonon coupling and thermal conductance at interfaces
Giri, A., Gaskins, J. T., Donovan, B. F., Szwejkowski, C., Warzoha, R. J., Rodriguez, M. A., Ihlefeld, J., & Hopkins, P. E. (2015) · Journal of Applied Physics · doi:10.1063/1.4914867 · Cited by 101
Self-citationThermal conductance of strongly bonded metal-oxide interfaces
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Metadata
- Authors
- Hopkins, P. E.
- Venue
- ISRN Mechanical Engineering
- Publisher
- Wiley
- Published
- 2013-01-30
- Volume
- 2013
- Pages
- 1-19
- ISSN
- 2090-5122 (ISSN-L)
- 2090-5130
- OpenAlex
- W2031036190
- Cited by
- 302
- References
- 123
- FWCI
- 8.88
- Type
- journal article
- Language
- en
- Open access
- diamond
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- Hopkins, P. E. (2013). Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance. ISRN Mechanical Engineering. https://doi.org/10.1155/2013/682586
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