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Hybrid Integrated Platforms for Silicon Photonics
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A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics.
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“Integration proximity of the (dissimilar) materials in direct bonding facilitates superior optical coupling and heat transportation between them56.”
From Roadmapping the next generation of silicon photonics (2024) · cites this paper as [56]
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Device Requirements for Optical Interconnects to Silicon Chips
Miller, D. A. B. (2009) · Proceedings of the IEEE · doi:10.1109/jproc.2009.2014298 · Cited by 2,000
Electrically pumped hybrid AlGaInAs-silicon evanescent laser
Fang, A. W., Park, H., Cohen, O., Jones, R., Paniccia, M. J., & Bowers, J. E. (2006) · Optics Express · doi:10.1364/oe.14.009203 · Cited by 1,244
Self-citationBonding of silicon wafers for silicon-on-insulator
Maszara, W., Goetz, G., Caviglia, A. L., & McKitterick, J. B. (1988) · Journal of Applied Physics · doi:10.1063/1.342443 · Cited by 878
Gösele, U., & Tong, Q.-Y. (1998) · Annual Review of Materials Science · doi:10.1146/annurev.matsci.28.1.215 · Cited by 600
SemiConductor Wafer Bonding: Science and Technology
Tong, Q., & Gösele, U. (1998) · Cited by 555
Campenhout, J. V., Romeo, P. R., Régreny, P., Seassal, C., Thourhout, D. V., Verstuyft, S., Cioccio, L. D., Fédéli, J.-M., Lagahe, C., & Baets, R. (2007) · Optics Express · doi:10.1364/oe.15.006744 · Cited by 513
Self-citationNiklaus, F., Stemme, G., Lu, J., & Gutmann, R. J. (2006) · Journal of Applied Physics · doi:10.1063/1.2168512 · Cited by 473
Magneto-optical isolator with silicon waveguides fabricated by direct bonding
Shoji, Y., Mizumoto, T., Yokoi, H., Hsieh, I.-W., & Osgood, R. M. (2008) · Applied Physics Letters · doi:10.1063/1.2884855 · Cited by 336
Miller, D. A. B., & Özaktaş, H. M. (1997) · Journal of Parallel and Distributed Computing · doi:10.1006/jpdc.1996.1285 · Cited by 290
Plasma-assisted InP-to-Si low temperature wafer bonding
Pasquariello, D. M., & Hjort, K. (2002) · IEEE Journal of Selected Topics in Quantum Electronics · doi:10.1109/2944.991407 · Cited by 250
IRENE, E. A., Tierney, E., & Angilello, J. (1982) · Journal of The Electrochemical Society · doi:10.1149/1.2123617 · Cited by 230
A distributed feedback silicon evanescent laser
Fang, A. W., Lively, E., Kuo, Y.-H., Liang, D., & Bowers, J. E. (2008) · Optics Express · doi:10.1364/oe.16.004413 · Cited by 228
Self-citationIII-V/Si photonics by die-to-wafer bonding
Roelkens, G., Campenhout, J. V., Brouckaert, J., Thourhout, D. V., Baets, R., Romeo, P. R., Régreny, P., Kaźmierczak, A., Seassal, C., Letartre, X., et al. (2007) · Materials Today · doi:10.1016/s1369-7021(07)70178-5 · Cited by 221
Self-citationRoelkens, G., Thourhout, D. V., Baets, R., Nötzel, R., & Smit, M. K. (2006) · Optics Express · doi:10.1364/oe.14.008154 · Cited by 215
Self-citationA hybrid AlGaInAs-silicon evanescent waveguide photodetector
Park, H., Fang, A. W., Jones, R., Cohen, O. M., Raday, O., Sysak, M. N., Paniccia, M. J., & Bowers, J. E. (2007) · Optics Express · doi:10.1364/oe.15.006044 · Cited by 187
Self-citationIntegrated AlGaInAs-silicon evanescent race track laser and photodetector
Fang, A. W., Jones, R., Park, H., Cohen, O. M., Raday, O., Paniccia, M. J., & Bowers, J. E. (2007) · Optics Express · doi:10.1364/oe.15.002315 · Cited by 187
Self-citationElectrically-pumped compact hybrid silicon microring lasers for optical interconnects
Liang, D., Marco Fiorentino, B., Okumura, T., Chang, H.-H., Spencer, D. T., Kuo, Y.-H., Fang, A. W., Daoxin Dai, A., Beausoleil, R. G., & Bowers, J. E. (2009) · Optics Express · doi:10.1364/oe.17.020355 · Cited by 174
Self-citationBlanco, F. J., Agirregabiria, M., Garcia, J., Berganzo, J., Tijero, M., Arroyo, M. T., Ruano-López, J. M., Aramburu, I., & Mayora, K. (2004) · Journal of Micromechanics and Microengineering · doi:10.1088/0960-1317/14/7/027 · Cited by 171
Silicon‐On‐Insulator by Wafer Bonding: A Review
Maszara, W. (1991) · Journal of The Electrochemical Society · doi:10.1149/1.2085575 · Cited by 170
Hybrid silicon evanescent devices
Fang, A. W., Park, H., Kuo, Y.-H., Jones, R., Cohen, O. M., Liang, D., Raday, O., Sysak, M. N., Paniccia, M. J., & Bowers, J. E. (2007) · Materials Today · doi:10.1016/s1369-7021(07)70177-3 · Cited by 155
Self-citationChen, L., Dong, P., & Lipson, M. F. (2008) · Optics Express · doi:10.1364/oe.16.011513 · Cited by 154
A Hybrid AlGaInAs–Silicon Evanescent Amplifier
Park, H., Fang, A. W., Cohen, O. M., Jones, R., Paniccia, M. J., & Bowers, J. E. (2007) · IEEE Photonics Technology Letters · doi:10.1109/lpt.2007.891188 · Cited by 151
Self-citationWafer fusion: materials issues and device results
Black, A., Hawkins, A. R., Margalit, N. M., Babic, D. I., Holmes, A. L., Chang, Y., Abraham, P., Bowers, J. E., & Hu, E. L. (1997) · IEEE Journal of Selected Topics in Quantum Electronics · doi:10.1109/2944.640648 · Cited by 142
Self-citationMode-locked silicon evanescent lasers
Koch, B. R., Fang, A. W., Cohen, O. M., & Bowers, J. E. (2007) · Optics Express · doi:10.1364/oe.15.011225 · Cited by 136
Self-citationRoelkens, G., Brouckaert, J., Van Thourhout, D., Baets, R., Nötzel, R., & Smit, M. (2006) · Journal of The Electrochemical Society · doi:10.1149/1.2352045 · Cited by 133
Self-citationA Distributed Bragg Reflector Silicon Evanescent Laser
Fang, A., Koch, B. R., Jones, R., Lively, E., Liang, D., Kuo, Y.-H., & Bowers, J. E. (2008) · IEEE Photonics Technology Letters · doi:10.1109/lpt.2008.2003382 · Cited by 131
Self-citationLiang, D., & Bowers, J. E. (2008) · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · doi:10.1116/1.2943667 · Cited by 130
Self-citationLow-temperature wafer bonding: a study of void formation and influence on bonding strength
Zhang, X. X., & Raskin, J. (2005) · Journal of Microelectromechanical Systems · doi:10.1109/jmems.2004.839027 · Cited by 117
High speed hybrid silicon evanescent electroabsorption modulator
Kuo, Y.-H., Chen, H., & Bowers, J. E. (2008) · Optics Express · doi:10.1364/oe.16.009936 · Cited by 97
Self-citationLiang, D., Fang, A. W., Park, H., Reynolds, T. E., Warner, K., Oakley, D. C., & Bowers, J. E. (2008) · Journal of Electronic Materials · doi:10.1007/s11664-008-0489-1 · Cited by 97
Self-citationLow temperature full wafer adhesive bonding of structured wafers
Niklaus, F., Svahn, H. A., Enoksson, P., & Stemme, G. (2001) · Sensors and Actuators A Physical · doi:10.1016/s0924-4247(01)00568-4 · Cited by 94
Analysis of Bonding‐Related Gas Enclosure in Micromachined Cavities Sealed by Silicon Wafer Bonding
Mack, S., Baumann, H., Gösele, U., Werner, H., & Schlögl, R. (1997) · Journal of The Electrochemical Society · doi:10.1149/1.1837540 · Cited by 91
Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration
Niklaus, F., Kumar, R., McMahon, J. J., Yu, J., Lu, J., Cale, T. S., & Gutmann, R. J. (2006) · Journal of The Electrochemical Society · doi:10.1149/1.2168409 · Cited by 80
Physics and chemistry of silicon wafer bonding investigated by infrared absorption spectroscopy
Weldon, M. K., Chabal, Y. J., Hamann, D. R., Christman, S. B., Chaban, E. E., & Feldman, L. C. (1996) · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · doi:10.1116/1.589070 · Cited by 77
Rapid thermal curing of BCB dielectric
Garrou, P. E., Heistand, R. H., Dibbs, M. G., Manial, T. A., Mohler, C. E., Stokich, T. M., Townsend, P. H., Adema, G. M., Berry, M., & Turlik, I. (1993) · IEEE Transactions on Components Hybrids and Manufacturing Technology · doi:10.1109/33.214859 · Cited by 68
Oxidation and Induced Damage in Oxygen Plasma In Situ Wafer Bonding
Pasquariello, D., Hedlund, C., & Hjort, K. (2000) · Journal of The Electrochemical Society · doi:10.1149/1.1393592 · Cited by 67
A Hybrid Silicon–AlGaInAs Phase Modulator
Chen, H., Kuo, Y.-H., & Bowers, J. E. (2008) · IEEE Photonics Technology Letters · doi:10.1109/lpt.2008.2004790 · Cited by 62
Self-citationHigh-Quality 150 mm InP-to-Silicon Epitaxial Transfer for Silicon Photonic Integrated Circuits
Liang, D., Bowers, J. E., Oakley, D. C., Napoleone, A., Chapman, D. C., Chen, C. L., Juodawlkis, P., & Raday, O. (2009) · Electrochemical and Solid-State Letters · doi:10.1149/1.3065994 · Cited by 57
Self-citationGaInAsP/InP membrane BH-DFB lasers directly bonded on SOI substrate
Maruyama, T., Okumura, T., Sakamoto, S., Miura, K., Nishimoto, Y., & Arai, S. (2006) · Optics Express · doi:10.1364/oe.14.008184 · Cited by 55
Supermode Si/III-V hybrid lasers, optical amplifiers and modulators: A proposal and analysis
Yariv, A., & Sun, X. (2007) · Optics Express · doi:10.1364/oe.15.009147 · Cited by 55
Adhesive wafer bonding for MEMS applications
Drăgoi, V., Glinsner, T., Mittendorfer, G., Wieder, B., & Lindner, P. F. (2003) · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · doi:10.1117/12.499077 · Cited by 51
Tan, C. S., Fan, A., Chen, K., & Reif, R. (2003) · Applied Physics Letters · doi:10.1063/1.1569657 · Cited by 51
Liu, L., Campenhout, J. V., Roelkens, G., Soref, R. A., Thourhout, D. V., Romeo, P. R., Régreny, P., Seassal, C., Fédéli, J.-M., & Baets, R. (2008) · Optics Letters · doi:10.1364/ol.33.002518 · Cited by 49
Self-citationHigh speed hybrid silicon evanescent Mach-Zehnder modulator and switch
Chen, H., Kuo, Y.-H., & Bowers, J. E. (2008) · Optics Express · doi:10.1364/oe.16.020571 · Cited by 47
Self-citationLow temperature InP/Si wafer bonding
Tong, Q.-Y., Gan, Q., Hudson, G., Fountain, G. G., & Enquist, P. M. (2004) · Applied Physics Letters · doi:10.1063/1.1644615 · Cited by 44
Integration of hybrid silicon lasers and electroabsorption modulators
Sysak, M. N., Anthes, J. O., Bowers, J. E., Raday, O., & Jones, R. (2008) · Optics Express · doi:10.1364/oe.16.012478 · Cited by 43
Self-citationSurface energy as a function of self-bias voltage in oxygen plasma wafer bonding
Pasquariello, D., Lindeberg, M., Hedlund, C., & Hjort, K. (2000) · Sensors and Actuators A Physical · doi:10.1016/s0924-4247(99)00338-6 · Cited by 42
Uniformity study of wafer-scale InP-to-silicon hybrid integration
Liang, D., Chapman, D. C., Li, Y., Oakley, D. C., Napoleone, T., Juodawlkis, P. W., Brubaker, C., Mann, C., Bar, H., Raday, O., et al. (2011) · Applied Physics A · doi:10.1007/s00339-010-5999-z · Cited by 39
Self-citationLow temperature wafer bonding by spin on glass
Lin, H. C., Chang, K. L., Pickrell, G. W., Hsieh, K. C., & Cheng, K. Y. (2002) · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · doi:10.1116/1.1464832 · Cited by 39
Photonic Integration on the Hybrid Silicon Evanescent Device Platform
Park, H., Fang, A. W., Liang, D., Kuo, Y.-H., Chang, H.-H., Koch, B. R., Chen, H., Sysak, M. N., Jones, R., & Bowers, J. E. (2008) · Advances in Optical Technologies · doi:10.1155/2008/682978 · Cited by 37
Self-citationMack, S., Baumann, H., & Gösele, U. (1996) · Sensors and Actuators A Physical · doi:10.1016/s0924-4247(96)01320-9 · Cited by 34
Critical Adhesion Energy of Benzocyclobutene-Bonded Wafers
Kwon, Y., Seok, J., Lu, J., Cale, T. S., & Gutmann, R. J. (2006) · Journal of The Electrochemical Society · doi:10.1149/1.2172551 · Cited by 28
Kwon, Y., Seok, J., Lu, J., Cale, T. S., & Gutmann, R. J. (2005) · Journal of The Electrochemical Society · doi:10.1149/1.1869252 · Cited by 24
Low-temperature bonding of silicon-oxide-covered wafers using diluted HF etching
Tong, Q.-Y., Gan, Q., Fountain, G. G., Hudson, G., & Enquist, P. M. (2004) · Applied Physics Letters · doi:10.1063/1.1800275 · Cited by 17
Improved luminescence from InGaAsP/InP MQW active regions using a wafer fused superlattice barrier
Black, K. A., Abraham, P., Karim, A., Bowers, J. E., & Hu, E. L. (2003) · Conference proceedings. ... International Conference on Indium Phosphide and Related Materials · doi:10.1109/iciprm.1999.773708 · Cited by 17
Self-citationSilicon-on-Insulator CWDM Power Monitor/Receiver With Integrated Thin-Film InGaAs Photodetectors
Brouckaert, J., Roelkens, G., Selvaraja, S. K., Bogaerts, W., Dumon, P., Verstuyft, S., Thourhout, D. V., & Baets, R. (2009) · IEEE Photonics Technology Letters · doi:10.1109/lpt.2009.2027999 · Cited by 16
Self-citationLow temperature InP layer transfer onto Si by helium implantation and direct wafer bonding
Singh, R. V., Radu, I., Scholz, R., Himcinschi, C., Gösele, U., & Christiansen, S. H. (2006) · Semiconductor Science and Technology · doi:10.1088/0268-1242/21/9/016 · Cited by 15
Rooman, C., Kuijk, M., Jonge, S. D., & Heremans, P. L. (2005) · IEEE Photonics Technology Letters · doi:10.1109/lpt.2005.859150 · Cited by 13
Layer Transfer of FDSOI CMOS to 150mm InP Substrates for Mixed-Material Integration
Warner, K., Oakley, D. C., Donnelly, J. P., Keast, C. L., & Shaver, D. C. (2006) · Conference proceedings. ... International Conference on Indium Phosphide and Related Materials · doi:10.1109/iciprm.2006.1634155 · Cited by 9
(2003) · Materials Today · doi:10.1016/s1369-7021(03)00536-4 · Cited by 4
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Metadata
- Authors
- Liang, D., Roelkens, G., Baets, R., & Bowers, J.
- Affiliations
- University of California, Santa Barbara (US)
- Photonics Research Group, IMEC - Ghent University, Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
- Ghent University (BE)
- Corresponding author
- Liang, Di
- Venue
- Materials
- Publisher
- MDPI AG
- Published
- 2010-03-12
- Volume
- 3
- Issue
- 3
- Pages
- 1782-1802
- ISSN
- 1996-1944 (ISSN-L)
- PMC
- PMC5445873
- OpenAlex
- W2112113449
- Cited by
- 316
- References
- 60
- Citations by year
- 2026: 6 · 2025: 19 · 2024: 17 · 2023: 20 · 2022: 27 · 2021: 21 · 2020: 18 · 2019: 15 · 2018: 27 · 2017: 23 · 2016: 26 · 2015: 28 · 2014: 25 · 2013: 19 · 2012: 14
- FWCI
- 11.10
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- Materials (publishedVersion, cc-by)
- Europe PMC (PubMed Central) (publishedVersion, cc-by)
- PubMed Central (publishedVersion, cc-by)
- Ghent University Academic Bibliography (Ghent University) (submittedVersion, other-oa)
- DOAJ (DOAJ: Directory of Open Access Journals) (submittedVersion)
- Funders
- Vlaamse regering
- Defense Advanced Research Projects Agency
- University of California, Santa Barbara
- Topics
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Photonic and Optical Devices
- Physical Sciences › Engineering › Electrical and Electronic Engineering › 3D IC and TSV technologies
- Physical Sciences › Engineering › Electrical and Electronic Engineering › Semiconductor Lasers and Optical Devices
- Keywords
- hybrid integration, silicon photonics, III-V on silicon, silicon-on-insulator, wafer bonding, bond strength, stress distribution, active photonic devices, passive optical components
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