Slack, Glen A.
Rensselaer Polytechnic Institute
6 papers on CoChat
Most cited papers
- Verified
Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point
Glassbrenner, C. J., & Slack, G. A. (1964) · Physical Review
Thermal properties of materialsThermodynamic and Structural Properties of Metals and Alloys
Cited by 1,652
- Verified
The intrinsic thermal conductivity of AIN
Slack, G. A., Tanzilli, R. A., Pohl, R. O., & Vandersande, J. W. (1987) · Journal of Physics and Chemistry of Solids
Thermal properties of materialsGaN-based semiconductor devices and materials
Cited by 1,009
- Verified
Thermal Conductivity of Pure and Impure Silicon, Silicon Carbide, and Diamond
Slack, G. A. (1964) · Journal of Applied Physics
Thermal properties of materialsSilicon Carbide Semiconductor Technologies
Cited by 695
- Verified
Estimation of the isotope effect on the lattice thermal conductivity of group IV and group III-V semiconductors
Morelli, D. T., Heremans, J. P., & Slack, G. A. (2002) · Physical Review B
Thermal properties of materialsAdvanced Thermoelectric Materials and Devices
Cited by 628
- Verified
Some effects of oxygen impurities on AlN and GaN
Slack, G. A., Schowalter, L. J., Morelli, D., & Freitas, J. A. (2002) · Journal of Crystal Growth
GaN-based semiconductor devices and materialsSilicon Carbide Semiconductor Technologies
Cited by 415
- Verified
Thermal Conductivity of GaAs and GaAs1− x P x Laser Semiconductors
Carlson, R. O., Slack, G. A., & Silverman, S. J. (1965) · Journal of Applied Physics
Thermal properties of materialsAdvanced Thermoelectric Materials and Devices
Cited by 166
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