The DOI matches its Crossref record; 79 of the 79 references it cites were found in a registry or an index.
3D Printed Flexible Strain Sensors: From Printing to Devices and Signals
Abstract
The revolutionary and pioneering advancements of flexible electronics provide the boundless potential to become one of the leading trends in the exploitation of wearable devices and electronic skin. Working as substantial intermediates for the collection of external mechanical signals, flexible strain sensors that get intensive attention are regarded as indispensable components in flexible integrated electronic systems. Compared with conventional preparation methods including complicated lithography and transfer printing, 3D printing technology is utilized to manufacture various flexible strain sensors owing to the low processing cost, superior fabrication accuracy, and satisfactory production efficiency. Herein, up‐to‐date flexible strain sensors fabricated via 3D printing are highlighted, focusing on different printing methods based on photocuring and materials extrusion, including Digital Light Processing (DLP), fused deposition modeling (FDM), and direct ink writing (DIW). Sensing mechanisms of 3D printed strain sensors are also discussed. Furthermore, the existing bottlenecks and future prospects are provided for further progressing research.
Overview
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Integrity signals
Registry
Cites
Statistics
Verification
Claims the paper makes
The claims and statistics of this paper haven’t been checked yet.
Run the check — free, no account needed. It reads the open-access text and checks the sources it cites.
Self-check
Percentages, sums and reported differences re-computed from the paper’s own numbers.
The self-check needs the paper’s full text.
Citations
Cites
Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis
Gao, W., Emaminejad, S., Nyein, H. Y. Y., Challa, S., Chen, K., Peck, A., Fahad, H. M., Ota, H., Shiraki, H., Kiriya, D., et al. (2016) · Nature · doi:10.1038/nature16521 · Cited by 5,087
Stretchable, Skin-Mountable, and Wearable Strain Sensors and Their Potential Applications: A Review
Amjadi, M., Kyung, K., Park, I., & Sitti, M. (2016) · Advanced Functional Materials · doi:10.1002/adfm.201504755 · Cited by 3,202
3D printing of conducting polymers
Yuk, H., Lu, B., Lin, S., Qu, K., Xu, J., Luo, J., & Zhao, X. (2020) · Nature Communications · doi:10.1038/s41467-020-15316-7 · Cited by 1,001
3D printing of soft robotic systems
Wallin, T. J., Pikul, J., & Shepherd, R. F. (2018) · Nature Reviews Materials · doi:10.1038/s41578-018-0002-2 · Cited by 942
Li, Z., Li, H., Wu, Z., Wang, M., Luo, J., Torun, H., Hu, P., Yang, C., Grundmann, M., Liu, X., et al. (2019) · Materials Horizons · doi:10.1039/c8mh01365a · Cited by 760
Hybrid 3D Printing of Soft Electronics
Valentine, A. D., Busbee, T. A., Boley, J. W., Raney, J. R., Chortos, A., Kotikian, A., Berrigan, J. D., Durstock, M. F., & Lewis, J. A. (2017) · Advanced Materials · doi:10.1002/adma.201703817 · Cited by 688
Darabi, M. A., Khosrozadeh, A., Mbeleck, R., Liu, Y., Chang, Q., Jiang, J., Cai, J., Wang, Q., Luo, G., & Xing, M. (2017) · Advanced Materials · doi:10.1002/adma.201700533 · Cited by 672
A Highly Efficient Self‐Healing Elastomer with Unprecedented Mechanical Properties
Zhang, L., Liu, Z., Wu, X., Guan, Q., Chen, S., Sun, L., Guo, Y., Wang, S., Song, J., Jeffries, E. M., et al. (2019) · Advanced Materials · doi:10.1002/adma.201901402 · Cited by 664
Super-tough MXene-functionalized graphene sheets
Zhou, T., Wu, C., Wang, Y., Tomsia, A. P., Li, M., Saiz, E., Fang, S., Baughman, R. H., Jiang, L., & Cheng, Q. (2020) · Nature Communications · doi:10.1038/s41467-020-15991-6 · Cited by 578
Seyedin, S., Uzun, S., Levitt, A., Anasori, B., Dion, G., Gogotsi, Y., & Razal, J. M. (2020) · Advanced Functional Materials · doi:10.1002/adfm.201910504 · Cited by 557
Cited by
Wang, H., Zhang, W., Ladika, D., Yu, H., Gailevičius, D., Wang, H., Pan, C., Nair, P. N. S., Ke, Y., Mori, T., et al. (2023) · Advanced Functional Materials · doi:10.1002/adfm.202214211 · Cited by 401
Metadata
- Authors
- Liu, H., Zhang, H., Han, W., Lin, H., Li, R., Zhu, J., & Huang, W.
- Venue
- Advanced Materials
- Publisher
- Wiley
- Published
- 2021-01-14
- Volume
- 33
- Issue
- 8
- Pages
- e2004782-e2004782
- ISSN
- 0935-9648 (ISSN-L)
- 1521-4095
- OpenAlex
- W3120076521
- Cited by
- 441
- References
- 79
- FWCI
- 21.84
- Type
- journal article
- Language
- en
- Open access
- closed
About these checks
Registry, retraction, Cites and statistics results are computed, not judged, with one exception: a printed reference that no index lists is read once by a model before it counts as a citation error. Claims are extracted by a model and kept only when their quote appears verbatim in the text; each cited source is then checked, with a model’s help, for whether it says what the claim relies on. Those verdicts can be wrong — read the claim’s quote and the cited source before relying on one.
Statistics and arithmetic are recomputed, not judged.
Confidence bands are shown only for fields calibrated on our annotated test set. None is calibrated yet, so no band is shown.
What counts as a claim ›How we measure confidence ›How we check this ›
Are you an author, or do you see a problem with this page? Request a review
How to cite
Cite CoChat for the checks on this page, and the paper for its own findings.
- This page
- CoChat. (2026). Citation check: 3D Printed Flexible Strain Sensors: From Printing to Devices and Signals. https://app.cochat.ai/papers/10.1002/adma.202004782
- The paper
- Liu, H., Zhang, H., Han, W., Lin, H., Li, R., Zhu, J., & Huang, W. (2021). 3D Printed Flexible Strain Sensors: From Printing to Devices and Signals. Advanced Materials. https://doi.org/10.1002/adma.202004782
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
