The DOI matches its Crossref record; 24 of the 24 references it cites were found in a registry or an index.
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
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Citations
Cites
(2016) · Alloy Phase Diagrams · doi:10.31399/asm.hb.v03.a0006247 · Cited by 16,046
Casady, J. B., & Johnson, R. W. (1996) · Solid-State Electronics · doi:10.1016/0038-1101(96)00045-7 · Cited by 1,445
Power semiconductor device figure of merit for high-frequency applications
Baliga, B. J. (1989) · IEEE Electron Device Letters · doi:10.1109/55.43098 · Cited by 1,070
The Changing Automotive Environment: High-Temperature Electronics
Johnson, R. W., Evans, J. L., Jacobsen, P., Thompson, J. R. R., & Christopher, M. (2004) · IEEE Transactions on Electronics Packaging Manufacturing · doi:10.1109/tepm.2004.843109 · Cited by 869
Investigation of growth processes of ingots of silicon carbide single crystals
Tairov, Y. M., & Tsvetkov, V. F. (1978) · Journal of Crystal Growth · doi:10.1016/0022-0248(78)90169-0 · Cited by 594
Silicon carbide MEMS for harsh environments
Mehregany, M., Zorman, C. A., Rajan, N., & Wu, C. H. (1998) · Proceedings of the IEEE · doi:10.1109/5.704265 · Cited by 463
SiC power-switching devices-the second electronics revolution?
Cooper, J. A., & Agarwal, A. (2002) · Proceedings of the IEEE · doi:10.1109/jproc.2002.1021561 · Cited by 394
Bai, J. G., Zhang, Z. Z., Calata, J. N., & Lu, G.-Q. (2006) · IEEE Transactions on Components and Packaging Technologies · doi:10.1109/tcapt.2005.853167 · Cited by 375
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Wang, T., Chen, X., Lu, G.-Q., & Lei, G.-Y. (2007) · Journal of Electronic Materials · doi:10.1007/s11664-007-0230-5 · Cited by 345
Werner, M. R., & Fahrner, W. R. (2001) · IEEE Transactions on Industrial Electronics · doi:10.1109/41.915402 · Cited by 332
Cited by
A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
Lee, H., Smet, V., & Tummala, R. (2020) · IEEE Journal of Emerging and Selected Topics in Power Electronics · doi:10.1109/jestpe.2019.2951801 · Cited by 526
Survey of High-Temperature Reliability of Power Electronics Packaging Components
Khazaka, R., Mendizabal, L., Henry, D., & Hanna, R. (2015) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2014.2357836 · Cited by 386
Chakraborty, S., Vu, H.-N., Hasan, M. M., Tran, D.-D., Baghdadi, M. E., & Hegazy, O. (2019) · Energies · doi:10.3390/en12081569 · Cited by 384
Kim, D., Nagao, S., Chen, C., Wakasugi, N., Yamamoto, Y., Suetake, A., Takemasa, T., Sugahara, T., & Suganuma, K. (2021) · IEEE Transactions on Power Electronics · doi:10.1109/tpel.2020.3031670 · Cited by 87
Metadata
- Authors
- Chin, H. S., Cheong, K. Y., & Ismail, A. B.
- Venue
- Metallurgical and Materials Transactions B
- Published
- 2010-04-06
- Volume
- 41
- Issue
- 4
- Pages
- 824-832
- ISSN
- 1073-5615 (ISSN-L)
- 1543-1916
- OpenAlex
- W2064911795
- Cited by
- 337
- References
- 24
- FWCI
- 8.22
- Type
- journal article
- Language
- en
- Open access
- closed
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- CoChat. (2026). Citation check: A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices. https://app.cochat.ai/papers/10.1007/s11663-010-9365-5
- The paper
- Chin, H. S., Cheong, K. Y., & Ismail, A. B. (2010). A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices. Metallurgical and Materials Transactions B. https://doi.org/10.1007/s11663-010-9365-5
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
