The DOI matches its Crossref record; 3 of the 3 references it cites were found in a registry or an index.
Managing heat for electronics
Open accessAbstract
Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.
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Citations
Cites
Thermal Transport Measurements of Individual Multiwalled Nanotubes
Kim, P., Shi, L., Majumdar, A., & McEuen, P. L. (2001) · Physical Review Letters · doi:10.1103/physrevlett.87.215502 · Cited by 3,378
Self-citationThermal Interface Materials: Historical Perspective, Status, and Future Directions
Prasher, R. (2006) · Proceedings of the IEEE · doi:10.1109/jproc.2006.879796 · Cited by 927
Shi, L., Li, D., Yu, C., Jang, W., Kim, D., Yao, Z., Kim, P., & Majumdar, A. (2003) · Journal of Heat Transfer · doi:10.1115/1.1597619 · Cited by 733
Self-citation
Cited by
Emerging challenges and materials for thermal management of electronics
Moore, A. L., & Shi, L. (2014) · Materials Today · doi:10.1016/j.mattod.2014.04.003 · Cited by 2,106
Self-citationThermal Conductance and Thermopower of an Individual Single-Wall Carbon Nanotube
Yu, C., Shi, L., Yao, Z., Li, D., & Majumdar, A. (2005) · Nano Letters · doi:10.1021/nl051044e · Cited by 871
Self-citationConstruction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity
Yao, Y., Sun, J., Zeng, X., Sun, R., Xu, J., & Wong, C. (2018) · Small · doi:10.1002/smll.201704044 · Cited by 389
Mean free path spectra as a tool to understand thermal conductivity in bulk and nanostructures
Yang, F., & Dames, C. (2013) · Physical Review B · doi:10.1103/physrevb.87.035437 · Cited by 283
Thermal conductance of metal–diamond interfaces at high pressure
Hohensee, G. T., Wilson, R. B., & Cahill, D. G. (2015) · Nature Communications · doi:10.1038/ncomms7578 · Cited by 197
Metadata
- Authors
- Schelling, P. K., Shi, L., & Goodson, K. E.
- Venue
- Materials Today
- Publisher
- Elsevier BV
- Published
- 2005-06
- Volume
- 8
- Issue
- 6
- Pages
- 30-35
- ISSN
- 1369-7021 (ISSN-L)
- OpenAlex
- W2014698998
- Cited by
- 276
- References
- 3
- FWCI
- 4.03
- Type
- journal article
- Language
- en
- Open access
- hybrid
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- Schelling, P. K., Shi, L., & Goodson, K. E. (2005). Managing heat for electronics. Materials Today. https://doi.org/10.1016/s1369-7021(05)70935-4
Data sources
Bibliographic data: Semantic Scholar, OpenAlex, Crossref.
Contains information from the Semantic Scholar Academic Graph Datasets, made available under the ODC Attribution License (ODC-BY 1.0).
Semantic Scholar’s data is described in: Kinney, R., et al. (2023). The Semantic Scholar Open Data Platform. arXiv:2301.10140.
