Thermal conductance of metal–diamond interfaces at high pressure
Open accessAbstract
The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two-phonon processes. The high pressures achievable in a diamond anvil cell (DAC) can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. Here we report time-domain thermoreflectance measurements of metal–diamond interface thermal conductance up to 50 GPa in the DAC for Pb, Au0.95Pd0.05, Pt and Al films deposited on type 1A natural [100] and type 2A synthetic [110] diamond anvils. In all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. Our results suggest that anharmonic conductance at metal–diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon. The thermal conductance of interfaces between metal and diamond at high pressure is often greater than can be accounted for by two-phonon processes. Here, the authors present a new experimental system, suggesting that the ‘extra’ thermal conductance seen is controlled by Raman-like three-phonon processes.
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TDTR has been frequently used to measure the heat capacity of new materials and the thermal conductance of various solid/solid interfaces.
“The heat capacity of new materials 38, 39 and thermal conductance of various solid/solid interfaces 40-47 have also been frequently measured using TDTR.”
From Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials (2018) · cites this paper as [43]
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Calibration of the ruby pressure gauge to 800 kbar under quasi‐hydrostatic conditions
Mao, H., Xu, J., & Bell, P. M. (1986) · Journal of Geophysical Research Atmospheres · doi:10.1029/jb091ib05p04673 · Cited by 4,476 · see citing works
Cahill, D. G., Ford, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R. D., & Phillpot, S. R. (2003) · Journal of Applied Physics · doi:10.1063/1.1524305 · Cited by 3,225 · see citing works
Self-citationSwartz, E. T., & Pohl, R. O. (1989) · Reviews of Modern Physics · doi:10.1103/revmodphys.61.605 · Cited by 2,937 · see citing works
Wong, H. ‐. P., Raoux, S., Kim, S., Liang, J., Reifenberg, J. P., Rajendran, B., Asheghi, M., & Goodson, K. E. (2010) · Proceedings of the IEEE · doi:10.1109/jproc.2010.2070050 · Cited by 1,824 · see citing works
Nanoscale thermal transport. II. 2003–2012
Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., et al. (2014) · Applied Physics Reviews · doi:10.1063/1.4832615 · Cited by 1,763 · see citing works
Self-citationReview of the vapour pressures of ice and supercooled water for atmospheric applications
Murphy, D. M., & Koop, T. (2005) · Quarterly Journal of the Royal Meteorological Society · doi:10.1256/qj.04.94 · Cited by 1,595 · see citing works
Analysis of heat flow in layered structures for time-domain thermoreflectance
Cahill, D. G. (2004) · Review of Scientific Instruments · doi:10.1063/1.1819431 · Cited by 1,543 · see citing works
Self-citationCarbon nanotube reinforced metal matrix composites - a review
Bakshi, S. R., Debrupa Lahiri, A., & Agarwal, A. K. (2010) · International Materials Reviews · doi:10.1179/095066009x12572530170543 · Cited by 1,447 · see citing works
Heat Assisted Magnetic Recording
KRYDER, M. H., Gage, E. C., McDaniel, T. W., Challener, W. A., Rottmayer, R. E., Ju, G., Hsia, Y.-T., & Erden, M. F. (2008) · Proceedings of the IEEE · doi:10.1109/jproc.2008.2004315 · Cited by 1,087 · see citing works
Effects of chemical bonding on heat transport across interfaces
Losego, M. D., Grady, M. E., Sottos, N. R., Cahill, D. G., & Braun, P. V. (2012) · Nature Materials · doi:10.1038/nmat3303 · Cited by 701 · see citing works
Self-citationKapitza conductance and heat flow between solids at temperatures from 50 to 300 K
Stoner, R. J., & Maris, H. J. (1993) · Physical Review B · doi:10.1103/physrevb.48.16373 · Cited by 646 · see citing works
Thermal conductance of interfaces between highly dissimilar materials
Lyeo, H.-K., & Cahill, D. G. (2006) · Physical Review B · doi:10.1103/physrevb.73.144301 · Cited by 576 · see citing works
Self-citationCeramic and metal matrix composites: Routes and properties
Rosso, M. (2005) · Journal of Materials Processing Technology · doi:10.1016/j.jmatprotec.2005.04.038 · Cited by 559 · see citing works
Role of electron–phonon coupling in thermal conductance of metal–nonmetal interfaces
Majumdar, A., & Reddy, P. (2004) · Applied Physics Letters · doi:10.1063/1.1758301 · Cited by 511 · see citing works
Properties of diamond under hydrostatic pressures up to 140 GPa
Occelli, F., Loubeyre, P., & Toullec, R. L. (2003) · Nature Materials · doi:10.1038/nmat831 · Cited by 502 · see citing works
Heat Conduction across Monolayer and Few-Layer Graphenes
Koh, Y. K., Bae, M.-H., Cahill, D. G., & Pop, E. (2010) · Nano Letters · doi:10.1021/nl101790k · Cited by 370 · see citing works
Self-citationSääskilahti, K., Oksanen, J., Tulkki, J., & Volz, S. G. (2014) · Physical Review B · doi:10.1103/physrevb.90.134312 · Cited by 349 · see citing works
Jayaraman, A. (1986) · Review of Scientific Instruments · doi:10.1063/1.1138654 · Cited by 348 · see citing works
Thermal conductivity of thin films: Measurements and understanding
Cahill, D. G., Fischer, H. E., Klitsner, T., Swartz, E. T., & Pohl, R. O. (1989) · Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films · doi:10.1116/1.576265 · Cited by 321 · see citing works
Self-citationThe relationship between infrared absorption and the A defect concentration in diamond
Boyd, S. R., Kiflawi, I., & Woods, G. S. (1994) · Philosophical Magazine B · doi:10.1080/01418639408240185 · Cited by 313 · see citing works
The ruby pressure standard to 150GPa
Chijioke, A. D., Nellis, W. J., Soldatov, A., & Silvera, I. F. (2005) · Journal of Applied Physics · doi:10.1063/1.2135877 · Cited by 286 · see citing works
Schelling, P. K., Shi, L., & Goodson, K. E. (2005) · Materials Today · doi:10.1016/s1369-7021(05)70935-4 · Cited by 278 · see citing works
Infrared absorption by the B nitrogen aggregate in diamond
Boyd, S. R., Kiflawi, I., & Woods, G. S. (1995) · Philosophical Magazine B · doi:10.1080/13642819508239089 · Cited by 260 · see citing works
Isothermal equation of state for gold with a He-pressure medium
Takemura, K., & Dewaele, A. (2008) · Physical Review B · doi:10.1103/physrevb.78.104119 · Cited by 208 · see citing works
Nitrogen and nitrogen-vacancy complexes and their formation in diamond
Mainwood, A. (1994) · Physical review. B, Condensed matter · doi:10.1103/physrevb.49.7934 · Cited by 201 · see citing works
An optical pump-probe technique for measuring the thermal conductivity of liquids
Schmidt, A., Chiesa, M., Chen, X., & Chen, G. (2008) · Review of Scientific Instruments · doi:10.1063/1.2937458 · Cited by 184 · see citing works
Hopkins, P. E., Kassebaum, J. L., & Norris, P. M. (2009) · Journal of Applied Physics · doi:10.1063/1.3068476 · Cited by 149 · see citing works
Al as a Simple Solid: High Pressure Study to 220 GPa (2.2 Mbar)
Greene, R. G., Luo, H., & Ruoff, A. L. (1994) · Physical Review Letters · doi:10.1103/physrevlett.73.2075 · Cited by 144 · see citing works
Characteristics of silicone fluid as a pressure transmitting medium in diamond anvil cells
Shen, Y., Kumar, R. S., Pravica, M. G., & Nicol, M. F. (2004) · Review of Scientific Instruments · doi:10.1063/1.1786355 · Cited by 144 · see citing works
Anharmonic Phonon Interactions at Interfaces and Contributions to Thermal Boundary Conductance
Hopkins, P. E., Duda, J. C., & Norris, P. M. (2011) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4003549 · Cited by 141 · see citing works
Heat-assisted magnetic recording
Pan, L., & Bogy, D. B. (2009) · Nature Photonics · doi:10.1038/nphoton.2009.40 · Cited by 136 · see citing works
Wang, Y., Ruan, X., & Roy, A. K. (2012) · Physical Review B · doi:10.1103/physrevb.85.205311 · Cited by 134 · see citing works
Hopkins, P. E. (2009) · Journal of Applied Physics · doi:10.1063/1.3169515 · Cited by 123 · see citing works
Katcho, N. A., Carrete, J., Li, W., & Mingo, N. (2014) · Physical Review B · doi:10.1103/physrevb.90.094117 · Cited by 121 · see citing works
Dewaele, A., Eggert, J. H., Loubeyre, P., & Toullec, R. L. (2003) · Physical review. B, Condensed matter · doi:10.1103/physrevb.67.094112 · Cited by 120 · see citing works
Ghimire, M. P., P., D., Shankar, A., Mohanty, A. K., Ernst, A., Deka, D., & Rahman, A. (2012) · Cited by 119 · see citing works
Nitrogen in diamond: evidence from thermal conductivity
Berman, R., Hudson, P. R. W., & Martinez, M. (1975) · Journal of Physics C Solid State Physics · doi:10.1088/0022-3719/8/21/003 · Cited by 118 · see citing works
Molecules under extreme conditions: Chemical reactions at high pressure
Schettino, V., & Bini, R. (2003) · Physical Chemistry Chemical Physics · doi:10.1039/b301381b · Cited by 117 · see citing works
Pressure tuning of the thermal conductance of weak interfaces
Hsieh, W., Lyons, A. S., Pop, E., Keblinski, P., & Cahill, D. G. (2011) · Physical Review B · doi:10.1103/physrevb.84.184107 · Cited by 115 · see citing works
Self-citationElectronic Kapitza conductance due to inelastic electron-boundary scattering
Sergeev, A. V. (1998) · Physical review. B, Condensed matter · doi:10.1103/physrevb.58.r10199 · Cited by 113 · see citing works
Two-channel model for nonequilibrium thermal transport in pump-probe experiments
Wilson, R. B., Feser, J. P., Hohensee, G. T., & Cahill, D. G. (2013) · Physical Review B · doi:10.1103/physrevb.88.144305 · Cited by 112 · see citing works
Self-citationHigh-pressure thermal expansion, bulk modulus, and phonon structure of diamond
Xie, J., Chen, S. P., Tse, J. S., de Gironcoli, S., & Stefano Baroni, A. (1999) · Physical review. B, Condensed matter · doi:10.1103/physrevb.60.9444 · Cited by 96 · see citing works
Effects of surface chemistry on thermal conductance at aluminum–diamond interfaces
Collins, K. C., Chen, S., & Chen, G. (2010) · Applied Physics Letters · doi:10.1063/1.3480413 · Cited by 95 · see citing works
Kapitza thermal resistance between a metal and a nonmetal
Mahan, G. D. (2009) · Physical Review B · doi:10.1103/physrevb.79.075408 · Cited by 90 · see citing works
High-pressure phase transition and equation of state of lead to 238 GPa
Mao, H. K., Wu, Y. B., Shu, J., Hu, J. Z., Hemley, R. J., & Cox, D. E. (1990) · Solid State Communications · doi:10.1016/0038-1098(90)90479-u · Cited by 90 · see citing works
Zha, C., Mibe, K., Bassett, W. A., Tschauner, O., Mao, H., & Hemley, R. J. (2008) · Journal of Applied Physics · doi:10.1063/1.2844358 · Cited by 83 · see citing works
Chemical Reactions at High Pressures
Weale, K. E. (1967) · Cited by 77 · see citing works
Lattice dynamics and the high-pressure equation of state of Au
Greeff, C. W., & Graf, M. J. (2004) · Physical Review B · doi:10.1103/physrevb.69.054107 · Cited by 67 · see citing works
FCC–HCP phase boundary in lead
Kuznetsov, A. V., Dmitriev, V., Dubrovinsky, L., Prakapenka, V. B., & Weber, H. ‐. (2002) · Solid State Communications · doi:10.1016/s0038-1098(02)00112-6 · Cited by 64 · see citing works
Influence of diamond surface termination on thermal boundary conductance between Al and diamond
Monachon, C., & Weber, L. (2013) · Journal of Applied Physics · doi:10.1063/1.4804061 · Cited by 60 · see citing works
Bulk aluminum at high pressure: A first-principles study
Tambe, M. J., Bonini, N., & Marzari, N. (2008) · Physical Review B · doi:10.1103/physrevb.77.172102 · Cited by 52 · see citing works
Ab initiocalculations of elastic properties of compressed Pt
Menéndez‐Proupin, E., & Singh, A. K. (2007) · Physical Review B · doi:10.1103/physrevb.76.054117 · Cited by 45 · see citing works
Monachon, C., & Weber, L. (2013) · Diamond and Related Materials · doi:10.1016/j.diamond.2013.06.017 · Cited by 42 · see citing works
Inelastic electron–boundary scattering in thin films
Sergeev, A. V. (1999) · Physica B Condensed Matter · doi:10.1016/s0921-4526(98)01338-6 · Cited by 32 · see citing works
Effect of pressure on the optical absorption in aluminium
Tups, H., & Syassen, K. (1984) · Journal of Physics F Metal Physics · doi:10.1088/0305-4608/14/11/028 · Cited by 31 · see citing works
Giri, A., Foley, B. M., & Hopkins, P. E. (2014) · ASME Journal of Heat and Mass Transfer · doi:10.1115/1.4027785 · Cited by 28 · see citing works
Ta and Au(Pd) alloy metal film transducers for time-domain thermoreflectance at high pressures
Hsieh, W., & Cahill, D. G. (2011) · Journal of Applied Physics · doi:10.1063/1.3592882 · Cited by 23 · see citing works
Self-citationCritical Analysis of the Thermodynamic Data for Pt and a Prediction of ΘDW(T)
Feldman, J. L., & Horton, G. K. (1965) · Physical Review · doi:10.1103/physrev.137.a1106 · Cited by 21 · see citing works
Thermal Boundary Conductance between metals and dielectrics
Monachon, C. (2013) · Infoscience (Ecole Polytechnique Fédérale de Lausanne) · doi:10.5075/epfl-thesis-5872 · Cited by 10 · see citing works
Interfacial three-phonon processes: Application to pulse experiments and the Kapitza conductance
Lumpkin, M. E., & Saslow, W. M. (1979) · Physical review. B, Condensed matter · doi:10.1103/physrevb.20.1035 · Cited by 4 · see citing works
Flagged first, then by citations
1 of the 61 references couldn’t be matched to a known paper.
Cited by
Sorted by citations
Interfacial thermal resistance: Past, present, and future
Chen, J., Xu, X., Zhou, J., & Li, B. (2022) · Reviews of Modern Physics · doi:10.1103/revmodphys.94.025002 · Cited by 744 · see citing works
Experimental observation of high thermal conductivity in boron arsenide
Kang, J. S., Li, M., Wu, H. Y., Nguyen, H., & Hu, Y. (2018) · Science · doi:10.1126/science.aat5522 · Cited by 648 · see citing works
Jiang, P., Qian, X., & Yang, R. (2018) · Journal of Applied Physics · doi:10.1063/1.5046944 · Cited by 424 · see citing works
Present and future thermal interface materials for electronic devices
Razeeb, K. M., Dalton, E., Cross, G. L. W., & Robinson, A. J. (2017) · International Materials Reviews · doi:10.1080/09506608.2017.1296605 · Cited by 420 · see citing works
Giri, A., & Hopkins, P. E. (2019) · Advanced Functional Materials · doi:10.1002/adfm.201903857 · Cited by 374 · see citing works
Thermal Boundary Conductance: A Materials Science Perspective
Monachon, C., Weber, L., & Dames, C. (2016) · Annual Review of Materials Research · doi:10.1146/annurev-matsci-070115-031719 · Cited by 288 · see citing works
A review on advanced carbon-based thermal interface materials for electronic devices
Khan, J. A., Momin, S. A., & Mariatti, M. (2020) · Carbon · doi:10.1016/j.carbon.2020.06.012 · Cited by 248 · see citing works
Cui, Y., Li, M., & Hu, Y. (2019) · Journal of Materials Chemistry C · doi:10.1039/c9tc05415d · Cited by 189 · see citing works
Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond
Chang, G., Sun, F., Duan, J., Che, Z., Wang, X., Wang, J., Kim, M. J., & Zhang, H. (2018) · Acta Materialia · doi:10.1016/j.actamat.2018.09.004 · Cited by 181 · see citing works
A Theoretical Review on Interfacial Thermal Transport at the Nanoscale
Zhang, P., Yuan, P., Jiang, X., Zhai, S., Zeng, J., Xian, Y., Qin, H., & Yang, D. (2017) · Small · doi:10.1002/smll.201702769 · Cited by 160 · see citing works
Thermal conductivity of materials under pressure
Zhou, Y., Dong, Z., Hsieh, W., Goncharov, A. F., & Chen, X. (2022) · Nature Reviews Physics · doi:10.1038/s42254-022-00423-9 · Cited by 151 · see citing works
Thermal Conductivity Enhancement in MoS 2 under Extreme Strain
Meng, X., Pandey, T., Jeong, J., Fu, S., Yang, J., Chen, K., Singh, A., He, F., Xu, X., Zhou, J., et al. (2019) · Physical Review Letters · doi:10.1103/physrevlett.122.155901 · Cited by 139 · see citing works
Size effects on the thermal conductivity of amorphous silicon thin films
Braun, J. L., Baker, C. H., Giri, A., Elahi, M. M. M., Artyushkova, K., Beechem, T. E., Norris, P. M., Leseman, Z. C., Gaskins, J. T., & Hopkins, P. E. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.140201 · Cited by 137 · see citing works
Zhou, Y., & Hu, M. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.95.115313 · Cited by 121 · see citing works
Anisotropic and inhomogeneous thermal conduction in suspended thin-film polycrystalline diamond
Sood, A., Cho, J., Hobart, K. D., Feygelson, T. I., Pate, B. B., Asheghi, M., Cahill, D. G., & Goodson, K. E. (2016) · Journal of Applied Physics · doi:10.1063/1.4948335 · Cited by 117 · see citing works
Self-citationPhotothermal phenomenon: Extended ideas for thermophysical properties characterization
Liu, J., Han, M., Wang, R., Xu, S., & Wang, X. (2022) · Journal of Applied Physics · doi:10.1063/5.0082014 · Cited by 110 · see citing works
High thermal conductive copper/diamond composites: state of the art
Jia, S. Q., & Yang, F. (2020) · Journal of Materials Science · doi:10.1007/s10853-020-05443-3 · Cited by 109 · see citing works
Sadasivam, S., Ye, N., Feser, J. P., Charles, J., Miao, K., Kubis, T., & Fisher, T. S. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.95.085310 · Cited by 107 · see citing works
Mohr, M., Daccache, L., Horvat, S., Brühne, K., Jacob, T., & Fecht, H. ‐. (2016) · Acta Materialia · doi:10.1016/j.actamat.2016.09.042 · Cited by 101 · see citing works
Weaker bonding can give larger thermal conductance at highly mismatched interfaces
Xu, B., Hu, S., Hung, S., Shao, C., Chandra, H., Chen, F., Kodama, T., & Shiomi, J. (2021) · Science Advances · doi:10.1126/sciadv.abf8197 · Cited by 99 · see citing works
Giri, A., King, S. W., Lanford, W. A., Mei, A. B., Merrill, D. R., Li, L., Oviedo, R., Richards, J., OLSON, D. H. L., Braun, J. L., et al. (2018) · Advanced Materials · doi:10.1002/adma.201804097 · Cited by 97 · see citing works
Understanding the thermal conductivity of Diamond/Copper composites by first-principles calculations
Chen, L., Chen, S., & Hou, Y. (2019) · Carbon · doi:10.1016/j.carbon.2019.03.051 · Cited by 96 · see citing works
Jia, S. Q., Bolzoni, L., Li, T., & Yang, F. (2020) · Carbon · doi:10.1016/j.carbon.2020.10.036 · Cited by 92 · see citing works
Zhu, J., Wu, X., Lattery, D. M., Zheng, W., & Wang, X. (2017) · Nanoscale and Microscale Thermophysical Engineering · doi:10.1080/15567265.2017.1313343 · Cited by 91 · see citing works
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Warzoha, R. J., Wilson, A. A., Donovan, B., Donmezer, F. N., Giri, A., Hopkins, P. E., Choi, S., Pahinkar, D. G., Shi, J., Graham, S. L., et al. (2020) · Journal of Electronic Packaging · doi:10.1115/1.4049293 · Cited by 90 · see citing works
Cho, H. J., Kim, Y., & Erb, U. (2018) · Composites Part B Engineering · doi:10.1016/j.compositesb.2018.08.014 · Cited by 90 · see citing works
Cheng, Z., Bai, T., Shi, J., Feng, T., Wang, Y., Mecklenburg, M. H., Li, C., Hobart, K. D., Feygelson, T. I., Tadjer, M. J., et al. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.9b02234 · Cited by 87 · see citing works
Cao, H., Tan, Z., Lu, M., Ji, G., Yan, X., Chen, D., Yuan, M., Guo, Q., Su, Y., Addad, A., et al. (2019) · Carbon · doi:10.1016/j.carbon.2019.05.004 · Cited by 84 · see citing works
Thermal conductance across harmonic-matched epitaxial Al-sapphire heterointerfaces
Cheng, Z., Koh, Y. R., Ahmad, H., Hu, R., Shi, J., Liao, M. E., Wang, Y., Bai, T., Li, R., Lee, E., et al. (2020) · Communications Physics · doi:10.1038/s42005-020-0383-6 · Cited by 84 · see citing works
Gaskins, J. T., Kotsonis, G. N., Giri, A., Ju, S., Rohskopf, A., Wang, Y., Bai, T., Sachet, E., Shelton, C. T., Liu, Z., et al. (2018) · Nano Letters · doi:10.1021/acs.nanolett.8b02837 · Cited by 83 · see citing works
Lu, Z., Wang, Y., & Ruan, X. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.064302 · Cited by 81 · see citing works
Chang, G., Sun, F., Wang, L., Che, Z., Wang, X., Wang, J., Kim, M. J., & Zhang, H. (2019) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.9b08106 · Cited by 79 · see citing works
Kimling, J., Philippi-Kobs, A., Jacobsohn, J., Oepen, H. P., & Cahill, D. G. (2017) · Physical Review B · doi:10.1103/physrevb.95.184305 · Cited by 76 · see citing works
Self-citationCheng, Z., Bougher, T., Bai, T., Wang, S. Y., Li, C., Yates, L., Foley, B. M., Goorsky, M., Cola, B. A., Faili, F., et al. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.7b16812 · Cited by 76 · see citing works
He, Y., Kuang, F., Che, Z., Sun, F., Zheng, K., Zhang, J., Cao, X., & Ma, Y. (2022) · Composites Part A Applied Science and Manufacturing · doi:10.1016/j.compositesa.2022.106933 · Cited by 71 · see citing works
Cho, H. J., Yan, D., Tam, J., & Erb, U. (2019) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2019.03.347 · Cited by 66 · see citing works
(Ultra)wide bandgap semiconductor heterostructures for electronics cooling
Cheng, Z., Huang, Z., Sun, J., Wang, J., Feng, T., Ohnishi, K., Liang, J., Amano, H., & Huang, R. (2024) · Applied Physics Reviews · doi:10.1063/5.0185305 · Cited by 60 · see citing works
Zhang, Y., Ma, D., Zang, Y., Wang, X., & Yang, N. (2018) · Frontiers in Energy Research · doi:10.3389/fenrg.2018.00048 · Cited by 60 · see citing works
Passive Ultra‐Conductive Thermal Metamaterials
Guo, J., Xu, G., Tian, D., Qu, Z., & Qiu, C. (2022) · Advanced Materials · doi:10.1002/adma.202200329 · Cited by 56 · see citing works
A novel strategy for GaN-on-diamond device with a high thermal boundary conductance
Mu, F., Xu, B., Wang, X., Gao, R., Huang, S., Ke, W., Takeuchi, K., Chen, X., Yin, H., Wang, D., et al. (2022) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2022.164076 · Cited by 53 · see citing works
Giri, A., Walton, S. G., Tomko, J. A., Bhatt, N., Johnson, M. J., Boris, D. R., Lu, G., Caldwell, J. D., Prezhdo, O. V., & Hopkins, P. E. (2023) · ACS Nano · doi:10.1021/acsnano.3c02417 · Cited by 53 · see citing works
Ye, N., Feser, J. P., Sadasivam, S., Fisher, T. S., Wang, T., Ni, C., & Janotti, A. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.95.085430 · Cited by 52 · see citing works
Monje, I. E., Louis, E., & Jordá, J. M. M. (2016) · Journal of Materials Science · doi:10.1007/s10853-016-0072-8 · Cited by 51 · see citing works
Thermal boundary conductance across epitaxial metal/sapphire interfaces
Koh, Y. R., Shi, J., Wang, B., Hu, R., Ahmad, H., Kerdsongpanya, S., Milosevic, E., Doolittle, W. A., Gall, D., Tian, Z., et al. (2020) · Physical review. B./Physical review. B · doi:10.1103/physrevb.102.205304 · Cited by 50 · see citing works
Seong, M., Hwang, I., Park, S., Jang, H., Choi, G., Kim, J., Kim, S., Kim, G., Yeo, J., & Jeong, H. E. (2021) · Advanced Functional Materials · doi:10.1002/adfm.202107023 · Cited by 50 · see citing works
Xu, Y., Fan, H., Li, Z., & Zhou, Y. (2022) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2022.123628 · Cited by 49 · see citing works
Xu, B., Hung, S., Hu, S., Shao, C., Guo, R., Choi, J., Kodama, T., Chen, F., & Shiomi, J. (2021) · Carbon · doi:10.1016/j.carbon.2021.01.018 · Cited by 48 · see citing works
Cheng, Z., Graham, S. L., Amano, H., & Cahill, D. G. (2022) · Applied Physics Letters · doi:10.1063/5.0077039 · Cited by 47 · see citing works
Self-citationSpin Seebeck effect near the antiferromagnetic spin-flop transition
Reitz, D., Li, J., Yuan, W., Shi, J., & Tserkovnyak, Y. (2020) · Physical review. B./Physical review. B · doi:10.1103/physrevb.102.020408 · Cited by 47 · see citing works
Yang, K., Zhang, Z., Zhao, H., Yang, B., Zhong, B., Chen, N., Song, J., Chen, C., Tang, D., Zhu, J., et al. (2021) · Acta Materialia · doi:10.1016/j.actamat.2021.117283 · Cited by 46 · see citing works
Maximization of thermal conductance at interfaces via exponentially mass-graded interlayers
Rastgarkafshgarkolaei, R., Zhang, J., Polanco, C. A., Le, N. Q., Ghosh, A. W., & Norris, P. M. (2019) · Nanoscale · doi:10.1039/c8nr09188a · Cited by 46 · see citing works
Wang, J., Wang, Z., Yang, K., Chen, N., Ni, J., Song, J., Li, Q., Sun, F., Liu, Y., & Fan, T. (2022) · Advanced Functional Materials · doi:10.1002/adfm.202206545 · Cited by 45 · see citing works
Chen, W., Wang, F., Fan, L., Zheng, H., Guo, X., Peng, Z., Zheng, L., & Zheng, L. (2024) · Applied Thermal Engineering · doi:10.1016/j.applthermaleng.2024.123958 · Cited by 44 · see citing works
General theories and features of interfacial thermal transport
Zhou, H., & Zhang, G. (2018) · Chinese Physics B · doi:10.1088/1674-1056/27/3/034401 · Cited by 42 · see citing works
Liu, Y., Qiu, L., Wang, Z., Li, H., & Feng, Y. (2024) · Composites Part A Applied Science and Manufacturing · doi:10.1016/j.compositesa.2024.108008 · Cited by 40 · see citing works
Heat switch effect in an antiferromagnetic insulator Co3V2O8
Zhao, X., Wu, J. C., Zhao, Z. Y., He, Z. Z., Song, J. D., Zhao, J. Y., Liu, X. G., Sun, X. F., & Li, X. G. (2016) · Applied Physics Letters · doi:10.1063/1.4953790 · Cited by 37 · see citing works
Thermal transport across high-pressure semiconductor-metal transition in Si and Si0.991Ge0.009
Hohensee, G. T., Fellinger, M. R., Trinkle, D. R., & Cahill, D. G. (2015) · Physical Review B · doi:10.1103/physrevb.91.205104 · Cited by 37 · see citing works
Self-citationToward Optimal Heat Transfer of 2D–3D Heterostructures via van der Waals Binding Effects
Zhang, L., Zhong, Y., Qian, X., Song, Q., Zhou, J., Li, L., Guo, L., Chen, G., & Wang, E. N. (2021) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.1c08131 · Cited by 36 · see citing works
Giri, A., Gaskins, J. T., Li, L., Wang, Y.-S., Prezhdo, O. V., & Hopkins, P. E. (2019) · Physical review. B./Physical review. B · doi:10.1103/physrevb.99.165139 · Cited by 35 · see citing works
Thermal interface conductance across metal alloy–dielectric interfaces
Freedman, J. P., Yu, X., Davis, R. F., Gellman, A. J., & Malen, J. A. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.035309 · Cited by 33 · see citing works
Zheng, W., Huang, B., Li, H., & Koh, Y. K. (2018) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.8b12480 · Cited by 33 · see citing works
Towards a coherent database of thermal boundary conductance at metal/dielectric interfaces
Blank, M., & Weber, L. (2019) · Journal of Applied Physics · doi:10.1063/1.5085176 · Cited by 33 · see citing works
Xu, Y., Yang, L., & Zhou, Y. (2022) · Physical Chemistry Chemical Physics · doi:10.1039/d2cp03081k · Cited by 33 · see citing works
Phonon mode at interface and its impact on interfacial thermal transport
Shan, S., Zhang, Z., Volz, S. G., & Chen, J. (2024) · Journal of Physics Condensed Matter · doi:10.1088/1361-648x/ad5fd7 · Cited by 32 · see citing works
Mohan, R., Khan, S., Wilson, R., & Hopkins, P. (2025) · Nature Reviews Methods Primers · doi:10.1038/s43586-025-00425-8 · Cited by 38 · see citing works
Self-citationAdnan, K. Z., Neupane, M. R., & Feng, T. (2024) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2024.126227 · Cited by 32 · see citing works
Properties for Thermally Conductive Interfaces with Wide Band Gap Materials
Khan, S., Angeles, F., Wright, J. G., Vishwakarma, S., Ortiz, V. H., Guzman, E., Kargar, F., Balandin, A. A., Smith, D. J., Jena, D., et al. (2022) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.2c01351 · Cited by 30 · see citing works
Self-citationLu, T., Zhou, J., Nakayama, T., Yang, R., & Li, B. (2016) · Physical review. B./Physical review. B · doi:10.1103/physrevb.93.085433 · Cited by 30 · see citing works
Metric for quantifying elastic and inelastic thermal transport at interfaces
Xu, Y., & Zhou, Y. (2024) · Physical review. B./Physical review. B · doi:10.1103/physrevb.110.115305 · Cited by 29 · see citing works
Importance of electron-phonon coupling in thermal transport in metal/semiconductor multilayer films
Miao, W., & Wang, M. (2022) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2022.123538 · Cited by 28 · see citing works
Effect of Nano-SiC coating on the thermal properties and microstructure of diamond/Al composites
Dong, Z. Y., Liu, X. Y., Wang, D., Wang, W. G., Xiao, B. L., & Ma, Z. Y. (2023) · Composites Communications · doi:10.1016/j.coco.2023.101564 · Cited by 28 · see citing works
Graphene Layer Number-Dependent Heat Transport across Nickel/Graphene/Nickel Interfaces
Zhou, J., Yang, K., Yang, B., Zhong, B., Yao, S., Ma, Y., Song, J., Fan, T., Tang, D., Zhu, J., et al. (2022) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.2c07796 · Cited by 26 · see citing works
A short account of thermoelectric film characterization techniques
Nandihalli, N. (2023) · Materials Today Physics · doi:10.1016/j.mtphys.2023.101173 · Cited by 26 · see citing works
Revealing the atomic mechanism of diamond–iron interfacial reaction
Ku, Y., Xu, K., Yan, L., Zhang, K., Song, D., Li, X., Li, S. F., Cheng, S., & Shan, C. (2023) · Carbon Energy · doi:10.1002/cey2.440 · Cited by 26 · see citing works
Zhao, N., Song, M., Zhang, X., Xu, W. D., & Liu, X. (2024) · Small · doi:10.1002/smll.202401292 · Cited by 25 · see citing works
Metallic θ-phase tantalum nitride has a thermal conductivity triple that of copper
Li, S., Su, C., Qin, Z., Alatas, A., Kunz, M., Yamada, T., Kelly, S. D., Upton, M. H., Gironda, A. J., Zhao, J., et al. (2026) · Science · doi:10.1126/science.aeb1142 · Cited by 25 · see citing works
Lu, C., Li, Z., Li, S., Li, Z., Zhang, Y., Zhao, J., & Wei, N. (2023) · Carbon · doi:10.1016/j.carbon.2023.118250 · Cited by 25 · see citing works
Yi, M., Li, H., & Ding, Z. (2016) · Physical review. E · doi:10.1103/physreve.93.032127 · Cited by 25 · see citing works
Steady-state measurements of thermal transport across highly conductive interfaces
Warzoha, R. J., Boteler, L. M., Smith, A. N., Getto, E., & Donovan, B. (2018) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2018.10.099 · Cited by 22 · see citing works
Lu, Z., Shi, J., & Ruan, X. (2019) · Journal of Applied Physics · doi:10.1063/1.5082526 · Cited by 23 · see citing works
Zhong, J., Xi, Q., Wang, Z., Nakayama, T., Li, X., Líu, J., & Zhou, J. (2021) · Journal of Applied Physics · doi:10.1063/5.0047396 · Cited by 23 · see citing works
Effects of bulk and interfacial anharmonicity on thermal conductance at solid/solid interfaces
Le, N. Q., Polanco, C. A., Rastgarkafshgarkolaei, R., Zhang, J., Ghosh, A. W., & Norris, P. M. (2017) · Physical review. B./Physical review. B · doi:10.1103/physrevb.95.245417 · Cited by 23 · see citing works
Insight into interfacial structure and bonding nature of diamond(001)/Cr3C2(001) interface
Gu, K., Pang, M., & Zhan, Y. (2018) · Journal of Alloys and Compounds · doi:10.1016/j.jallcom.2018.08.112 · Cited by 23 · see citing works
High-Pressure Effect on the Optical Extinction of a Single Gold Nanoparticle
Medeghini, F., Hettich, M., Rouxel, R., Silva-Santos, S. D., Hermelin, S., Pertreux, E., Dias, A. C. T., Legrand, F., Maioli, P., Crut, A., et al. (2018) · ACS Nano · doi:10.1021/acsnano.8b05539 · Cited by 23 · see citing works
Interfacial thermal conductance at metal–nonmetal interface via electron–phonon coupling
Shi, B., Tang, X., Lu, T., Nakayama, T., Li, Y., & Zhou, J. (2018) · Modern Physics Letters B · doi:10.1142/s0217984918300041 · Cited by 23 · see citing works
Thermal interfaces in dynamic compression experiments
Hartsfield, T., Lone, B. M. L., Stevens, G. D., Veeser, L. R., & Dolan, D. H. (2020) · Journal of Applied Physics · doi:10.1063/5.0012524 · Cited by 23 · see citing works
Warzoha, R. J., Wilson, A. A., Donovan, B., Clark, A. T., Cheng, X. M., An, L., & Feng, G. (2024) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.4c05258 · Cited by 22 · see citing works
A comparative study of interfacial thermal conductance between metal and semiconductor
Wu, K., Zhang, L., Wang, D., Li, F., Zhang, P., Sang, L., Liao, M., Tang, K., Ye, J., & Gu, S. (2022) · Scientific Reports · doi:10.1038/s41598-022-24379-z · Cited by 22 · see citing works
Sun, Z., Shi, H., Zhu, Y., Li, R., Sun, X., Wang, Q., Qi, Z., Li, L., Liu, S., Shen, W., et al. (2025) · npj Computational Materials · doi:10.1038/s41524-025-01843-8 · Cited by 21 · see citing works
Sun, Z., Yuan, K., Zhang, X., & Tang, D. (2019) · Physical Chemistry Chemical Physics · doi:10.1039/c8cp07516f · Cited by 21 · see citing works
Negative differential thermal resistance effect in a macroscopic homojunction
Yang, Y., Ma, D., Zhao, Y., & Zhang, L. (2020) · Journal of Applied Physics · doi:10.1063/5.0004284 · Cited by 21 · see citing works
Thermal Conductivity of BAs under Pressure
Hou, S., Sun, B., Tian, F., Cai, Q., Xu, Y., Wang, S., Peng, W., Chen, X., Ren, Z., Li, C., et al. (2022) · Advanced Electronic Materials · doi:10.1002/aelm.202200017 · Cited by 20 · see citing works
Self-citationInterfacial thermal transport with strong system-bath coupling: A phonon delocalization effect
He, D., Thingna, J., & Cao, J. (2018) · Physical review. B./Physical review. B · doi:10.1103/physrevb.97.195437 · Cited by 20 · see citing works
A two-sensor 3ω-2ω method for thermal boundary resistance measurement
Hua, Y., & Cao, B. (2021) · Journal of Applied Physics · doi:10.1063/5.0039444 · Cited by 20 · see citing works
Assessment of Self‐Assembled Monolayers as High‐Performance Thermal Interface Materials
Wang, Y., Cao, Y., Zhou, K. C., & Xu, Z. (2017) · Advanced Materials Interfaces · doi:10.1002/admi.201700355 · Cited by 19 · see citing works
Interfacial thermal resistance of metal-nonmetal interfaces under bidirectional heat fluxes
Wu, Y., Yagi, T., & Xu, Y. (2021) · International Journal of Heat and Mass Transfer · doi:10.1016/j.ijheatmasstransfer.2021.121766 · Cited by 18 · see citing works
Rapid subsurface analysis of frequency-domain thermoreflectance images with K-means clustering
Jarzembski, A., Piontkowski, Z., Hodges, W., Bahr, M., McDonald, A. E., Delmas, W., Pickrell, G. W., & Yates, L. (2024) · Journal of Applied Physics · doi:10.1063/5.0201473 · Cited by 18 · see citing works
W:Al2O3 Nanocomposite Thin Films with Tunable Optical Properties Prepared by Atomic Layer Deposition
Babar, S., Mane, A. U., Yanguas-Gil, Á., Mohimi, E., Haasch, R. T., & Elam, J. W. (2016) · The Journal of Physical Chemistry C · doi:10.1021/acs.jpcc.6b03823 · Cited by 18 · see citing works
Energy conversion and transport in molecular-scale junctions
Zhang, H., Zhu, Y., Duan, P., Shiri, M., Yelishala, S. C., Shen, S., Song, Z., Jia, C., Guo, X., Cui, L., et al. (2024) · Applied Physics Reviews · doi:10.1063/5.0225756 · Cited by 17 · see citing works
Chen, N., Yang, K., Wang, Z., Zhong, B., Wang, J. J., Song, J., Li, Q., Ni, J., Sun, F., Liu, Y., et al. (2023) · ACS Applied Materials & Interfaces · doi:10.1021/acsami.3c00978 · Cited by 17 · see citing works
- Authors
- Hohensee, G. T., Wilson, R. B., & Cahill, D. G.
- Affiliations
- University of Illinois Urbana-Champaign (US)
- Corresponding author
- Hohensee, Gregory T.
- Venue
- Nature Communications
- Published
- 2015-03-06
- Volume
- 6
- Issue
- 1
- Pages
- 6578-6578
- ISSN
- 2041-1723 (ISSN-L)
- OpenAlex
- W2171459929
- Cited by
- 197
- References
- 61
- Citations by year
- 2026: 16 · 2025: 19 · 2024: 20 · 2023: 18 · 2022: 24 · 2021: 18 · 2020: 14 · 2019: 16 · 2018: 19 · 2017: 15 · 2016: 16 · 2015: 1
- FWCI
- 6.90
- Type
- journal article
- Language
- en
- Open access
- gold
- doi.org
- Licence
- Locations
- Nature Communications (publishedVersion)
- PubMed (publishedVersion)
- OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) (submittedVersion)
- RePEc: Research Papers in Economics (submittedVersion)
- Funders
- U.S. Department of Energy (DENA0002006)
- University of Illinois at Urbana-Champaign
- Division of Materials Research
- Topics
- Physical Sciences › Materials Science › Materials Chemistry › Thermal properties of materials
- Physical Sciences › Materials Science › Materials Chemistry › Diamond and Carbon-based Materials Research
- Physical Sciences › Earth and Planetary Sciences › Geophysics › High-pressure geophysics and materials
- Keywords
- metal-diamond interface, thermal conductance, high pressure, diamond anvil cell, time-domain thermoreflectance, three-phonon processes, phonon scattering, lead, gold-palladium alloy, platinum, aluminum
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