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Cited by 249

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Surface chemistry mediates thermal transport in three-dimensional nanocrystal arrays

Ong, Wee-Liat, Rupich, Sara M., Talapin, Dmitri V., McGaughey, Alan J. H., Malen, Jonathan A.·2013·Nature Materials
DOI 10.1038/nmat3596
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Abstract

Arrays of ligand-stabilized colloidal nanocrystals with size-tunable electronic structure are promising alternatives to single-crystal semiconductors in electronic, optoelectronic and energy-related applications. Hard/soft interfaces in these nanocrystal arrays (NCAs) create a complex and uncharted vibrational landscape for thermal energy transport that will influence their technological feasibility. Here, we present thermal conductivity measurements of NCAs (CdSe, PbS, PbSe, PbTe, Fe3O4 and Au) and reveal that energy transport is mediated by the density and chemistry of the organic/inorganic interfaces, and the volume fractions of nanocrystal cores and surface ligands. NCA thermal conductivities are controllable within the range 0.1-0.3 W m(-1) K(-1), and only weakly depend on the thermal conductivity of the inorganic core material. This range is 1,000 times lower than the thermal conductivity of silicon, presenting challenges for heat dissipation in NCA-based electronics and photonics. It is, however, 10 times smaller than that of Bi2Te3, which is advantageous for NCA-based thermoelectric materials.

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  • Transient thermoreflectance has been widely applied to explore thermal properties of novel materials ranging from low thermal conductivity ≤0.1 W/m·K of hybrid materials and fullerene derivatives to very high thermal conductivity such as graphene.

    “Transient thermoreflectance method has been widely applied to explore thermal properties of novel materials that ranging from low thermal conductivity of ≤ 0.1 W/m•K of hybrid materials [132,133] and fullerene derivatives [134,135], to very high thermal conductivity such as graphene [136].”

    From Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials (2016) · cites this paper as [132]

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Metadata

Authors
Ong, W.-L., Rupich, S. M., Talapin, D. V., McGaughey, A. J. H., & Malen, J. A.
Venue
Nature Materials
Publisher
Springer Science and Business Media LLC
Published
2013-03-17
Volume
12
Issue
5
Pages
410-415
ISSN
  • 1476-1122
  • 1476-4660
DOI
10.1038/nmat3596
Cited by
249
References
2
Language
en
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