Cited by 1,023

The DOI matches its Crossref record; 3 of the 3 references it cites were found in a registry or an index.

Interfacial heat flow in carbon nanotube suspensions

Huxtable, Scott T., Cahill, David G., Shenogin, Sergei, Xue, Liping, Ozisik, Rahmi, Barone, Paul, Usrey, Monica, Strano, Michael S., Siddons, Giles, Shim, Moonsub, Keblinski, Pawel·2003·Nature Materials

Abstract

The enormous amount of basic research into carbon nanotubes has sparked interest in the potential applications of these novel materials. One promising use of carbon nanotubes is as fillers in a composite material to improve mechanical behaviour, electrical transport and thermal transport. For composite materials with high thermal conductivity, the thermal conductance across the nanotube-matrix interface is of particular interest. Here we use picosecond transient absorption to measure the interface thermal conductance (G) of carbon nanotubes suspended in surfactant micelles in water. Classical molecular dynamics simulations of heat transfer from a carbon nanotube to a model hydrocarbon liquid are in agreement with experiment. Our findings indicate that heat transport in a nanotube composite material will be limited by the exceptionally small interface thermal conductance (G approximately 12 MW m(-2) K(-1)) and that the thermal conductivity of the composite will be much lower than the value estimated from the intrinsic thermal conductivity of the nanotubes and their volume fraction.

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Crossref · 10.1038/nmat996

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  • TDTR technique is implemented extensively to study thermal transport mechanisms across interfaces, including surface chemistry effects on interfacial thermal conductance across functionalized liquid-solid and solid-solid interfaces, interfacial thermal conductance between metals and dielectrics, and interface between low dimensional materials and bulk substrates.

    “TDTR technique is therefore implemented extensively to study the thermal transport mechanisms across interfaces, including the effect of surface chemistry on interfacial thermal conductance across functionalized liquid-solid boundary[95,117,118] and solid-solid interfaces[119], interfacial thermal conductance between metals and dielectrics,[120][121][122][123][124] and interface between low dim”

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Research works printed but not linked: 22

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Metadata

Authors
Huxtable, S. T., Cahill, D. G., Shenogin, S., Xue, L., Ozisik, R., Barone, P., Usrey, M., Strano, M. S., Siddons, G., Shim, M., & Keblinski, P.
Venue
Nature Materials
Published
2003-10-12
Volume
2
Issue
11
Pages
731-734
ISSN
  • 1476-1122
  • 1476-4660
Cited by
1,023
References
3
Language
en

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